LFXP3C-4TN144C

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

Quantity 1,313 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O100Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-4TN144C – XP FPGA, 3,000 Logic Elements, 55,296-bit RAM, 100 I/Os, 144-LQFP

The LFXP3C-4TN144C from Lattice Semiconductor is a non-volatile XP family FPGA in a 144-pin LQFP/TQFP package. It provides 3,000 logic elements, approximately 55,296 bits of on-chip RAM and up to 100 I/Os, making it suitable for compact, commercial embedded designs that require reprogrammable logic with flexible I/O and on-chip memory.

Built on the ispXP™ non-volatile architecture, this device supports instant-on behavior, in-field reconfiguration and multiple I/O standards while operating across a broad supply range and commmercial temperature grade.

Key Features

  • Core Capacity — 3,000 logic elements (cells) and 384 PFU/PFF resources provide deterministic logic capacity for moderate-density designs.
  • Embedded Memory — Approximately 55,296 bits of total on-chip RAM for distributed and block memory use, enabling buffering, small FIFOs and local data storage without external RAM.
  • I/O and Package — 100 user I/Os in a 144-LQFP / 144-TQFP (20 × 20 mm) surface-mount package, offering a compact footprint for space-constrained boards.
  • Voltage Range — Flexible supply operation from 1.71 V to 3.465 V to support mixed-voltage systems and a variety of I/O standards.
  • Non-volatile, Instant-on Configuration — ispXP™ non-volatile architecture with instant-on capability and no external configuration memory required.
  • Reconfiguration and Security — Supports JTAG and system configuration ports for programming and in-field updates; reprogrammable non-volatile storage secures configuration data.
  • Low-Power Modes — Sleep mode available for significant static current reduction.
  • Clocking — Device-level PLLs for clock multiply/divide and phase adjustment (LFXP3 family devices include 2 PLLs).
  • Flexible I/O Standards — sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL and a range of high-speed and memory interfaces as documented in the LatticeXP family data.
  • Operating Range & Mounting — Commercial grade operation from 0 °C to 85 °C; surface-mount package for standard PCB assembly.
  • RoHS Compliant — Device meets RoHS environmental requirements.

Typical Applications

  • Commercial Embedded Systems — On-board programmable logic for protocol translation, glue logic and custom control functions where compact package and on-chip RAM are required.
  • Interface Bridging — Flexible I/O and multiple supported voltage levels enable bridging between different bus and peripheral standards in space-constrained implementations.
  • Prototyping and Development — Instant-on, reprogrammability and JTAG support make the device suitable for design validation and iterative development cycles.

Unique Advantages

  • Instant-on non-volatile FPGA: Eliminates the need for external configuration memory and provides fast power-up for designs that require immediate logic availability.
  • Balanced integration: Combines 3,000 logic elements with ~55 Kbits of on-chip RAM and 100 I/Os in a single compact 144-pin package to reduce BOM and board area.
  • Flexible power and I/O: Wide supply range (1.71 V–3.465 V) and broad sysIO support let you interface multiple voltage domains without extra level-shifting ICs.
  • Field reconfiguration: In-system and JTAG programming with TransFR™ reconfiguration capability enable updates and in-field logic changes.
  • Low-power options: Sleep mode support provides a path to significantly reduce static current when the application is idle.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation, matching many consumer and commercial application environments.

Why Choose LFXP3C-4TN144C?

The LFXP3C-4TN144C delivers a compact, non-volatile FPGA solution with a balanced combination of logic capacity, embedded RAM and flexible I/O in a 144-pin surface-mount package. Its ispXP™ architecture provides instant-on operation and secure, reprogrammable configuration without external memory, while sleep mode and reconfiguration capabilities support power-conscious and field-updateable designs.

This device is well suited to commercial embedded projects that need immediate logic availability, moderate on-chip memory and versatile interfacing options, backed by Lattice's FPGA tool and IP ecosystem referenced in the LatticeXP family documentation.

Request a quote or submit a parts request to get pricing and availability for LFXP3C-4TN144C. Our team can assist with lead times and volume pricing information.

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