LFXP3C-4TN144C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP |
|---|---|
| Quantity | 1,313 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3C-4TN144C – XP FPGA, 3,000 Logic Elements, 55,296-bit RAM, 100 I/Os, 144-LQFP
The LFXP3C-4TN144C from Lattice Semiconductor is a non-volatile XP family FPGA in a 144-pin LQFP/TQFP package. It provides 3,000 logic elements, approximately 55,296 bits of on-chip RAM and up to 100 I/Os, making it suitable for compact, commercial embedded designs that require reprogrammable logic with flexible I/O and on-chip memory.
Built on the ispXP™ non-volatile architecture, this device supports instant-on behavior, in-field reconfiguration and multiple I/O standards while operating across a broad supply range and commmercial temperature grade.
Key Features
- Core Capacity — 3,000 logic elements (cells) and 384 PFU/PFF resources provide deterministic logic capacity for moderate-density designs.
- Embedded Memory — Approximately 55,296 bits of total on-chip RAM for distributed and block memory use, enabling buffering, small FIFOs and local data storage without external RAM.
- I/O and Package — 100 user I/Os in a 144-LQFP / 144-TQFP (20 × 20 mm) surface-mount package, offering a compact footprint for space-constrained boards.
- Voltage Range — Flexible supply operation from 1.71 V to 3.465 V to support mixed-voltage systems and a variety of I/O standards.
- Non-volatile, Instant-on Configuration — ispXP™ non-volatile architecture with instant-on capability and no external configuration memory required.
- Reconfiguration and Security — Supports JTAG and system configuration ports for programming and in-field updates; reprogrammable non-volatile storage secures configuration data.
- Low-Power Modes — Sleep mode available for significant static current reduction.
- Clocking — Device-level PLLs for clock multiply/divide and phase adjustment (LFXP3 family devices include 2 PLLs).
- Flexible I/O Standards — sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL and a range of high-speed and memory interfaces as documented in the LatticeXP family data.
- Operating Range & Mounting — Commercial grade operation from 0 °C to 85 °C; surface-mount package for standard PCB assembly.
- RoHS Compliant — Device meets RoHS environmental requirements.
Typical Applications
- Commercial Embedded Systems — On-board programmable logic for protocol translation, glue logic and custom control functions where compact package and on-chip RAM are required.
- Interface Bridging — Flexible I/O and multiple supported voltage levels enable bridging between different bus and peripheral standards in space-constrained implementations.
- Prototyping and Development — Instant-on, reprogrammability and JTAG support make the device suitable for design validation and iterative development cycles.
Unique Advantages
- Instant-on non-volatile FPGA: Eliminates the need for external configuration memory and provides fast power-up for designs that require immediate logic availability.
- Balanced integration: Combines 3,000 logic elements with ~55 Kbits of on-chip RAM and 100 I/Os in a single compact 144-pin package to reduce BOM and board area.
- Flexible power and I/O: Wide supply range (1.71 V–3.465 V) and broad sysIO support let you interface multiple voltage domains without extra level-shifting ICs.
- Field reconfiguration: In-system and JTAG programming with TransFR™ reconfiguration capability enable updates and in-field logic changes.
- Low-power options: Sleep mode support provides a path to significantly reduce static current when the application is idle.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation, matching many consumer and commercial application environments.
Why Choose LFXP3C-4TN144C?
The LFXP3C-4TN144C delivers a compact, non-volatile FPGA solution with a balanced combination of logic capacity, embedded RAM and flexible I/O in a 144-pin surface-mount package. Its ispXP™ architecture provides instant-on operation and secure, reprogrammable configuration without external memory, while sleep mode and reconfiguration capabilities support power-conscious and field-updateable designs.
This device is well suited to commercial embedded projects that need immediate logic availability, moderate on-chip memory and versatile interfacing options, backed by Lattice's FPGA tool and IP ecosystem referenced in the LatticeXP family documentation.
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