LFXP3C-5QN208C

The LFXP3C-5QN208C is a LatticeXP family FPGA packaged in a 208-pin BFQFP (28 × 28 mm) surface-mount package. It integrates roughly 3,000 logic elements, flexible on-chip memory and high-performance I/O to address embedded control, interface bridging and system prototyping requirements. Designed for commercial applications, the device combines non-volatile configuration with instant-on capability and a wide supply-voltage range to simplify board-level design and power sequencing.

Key Features

• Core Logic – Approximately 3,000 logic elements (LUT4-based architecture) delivered in a compact fabric suitable for mid-density logic designs.
• Embedded Memory – Approximately 54 Kbits of embedded SRAM and distributed RAM resources for on-chip buffering and state storage.
• I/O Capacity & Flexibility – 136 I/O pins supporting a wide range of standards (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS) for diverse interface requirements.
• Dedicated Memory Interface – Dedicated DDR memory support with interface capability up to DDR333 (166 MHz).
• Clocking – Up to 2 analog PLLs for clock multiplication, division and phase shifting.
• Non-Volatile Configuration & Instant-On – On-chip non-volatile configuration eliminates the need for external configuration memory and enables fast power-up.
• In-Field Reconfiguration – TransFR™ Reconfiguration enables logic updates while the system operates; SRAM logic can be reconfigured in milliseconds.
• Low-Power Modes – Sleep mode support that can reduce static current by up to 1000× for lower-power standby operation.
• Power & Temperature – Wide supply range from 1.71 V to 3.465 V and commercial operating range 0 °C to 85 °C for typical embedded environments.
• Package & Mounting – 208-BFQFP (supplier package listed as 208-PQFP 28×28) in a surface-mount form factor; RoHS compliant.

Typical Applications

• Embedded Control & Prototyping – Implement glue logic, custom interfaces and rapid prototyping where instant-on non-volatile configuration and reconfigurability accelerate development.
• Interface Bridging – Bridge disparate I/O standards and implement protocol converters using the flexible sysIO™ buffer support for many signaling families.
• Memory Interface Designs – Support DDR memory front-ends and on-board buffering leveraging the dedicated DDR interface capability and on-chip SRAM.
• Communications & Networking – Implement timing-critical I/O and clocking functions with up to two PLLs and a broad set of I/O options for serial/parallel interfaces.

Unique Advantages

• Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables immediate availability at power-up.
• Field reconfiguration capability: TransFR™ enables in-system updates to SRAM-based logic while the system remains operational, reducing downtime for firmware iterations.
• Broad I/O standard support: Extensive programmable I/O standards simplify integration with diverse peripherals and memory types.
• Compact, surface-mount package: 208-pin BFQFP (28 × 28 mm) provides a balance of I/O count and board-level density for mid-range designs.
• Power and thermal suitability for commercial products: Support for 1.71–3.465 V supplies and an operating range of 0 °C to 85 °C fits many consumer and commercial applications.
• Regulatory and environmental compliance: RoHS compliance for easier supply-chain integration and environmental compliance.

Why Choose LFXP3C-5QN208C?

The LFXP3C-5QN208C delivers a mid-density FPGA solution combining non-volatile instant-on configuration, flexible I/O and on-chip memory in a compact 208-pin BFQFP package. Its combination of approximately 3,000 logic elements, roughly 54 Kbits of embedded RAM and 136 I/Os makes it well suited for embedded systems, interface bridging and memory-interface designs where rapid startup, reconfigurability and I/O flexibility matter.

Because it supports a wide supply-voltage window, multiple I/O standards and in-field reconfiguration, the device is a practical choice for commercial product designs and development platforms that require a balance of capability, board-level density and configurability.

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