LFXP3C-4T100C

The LFXP3C-4T100C is a non-volatile, instant-on FPGA from Lattice’s LatticeXP family designed for commercial embedded applications. It combines reconfigurable logic, on-chip embedded memory and flexible I/O in a compact 100-pin package to support system designs that require fast startup, in-field reconfiguration and a wide range of interface options.

This device is targeted at commercial electronic products and embedded systems that benefit from integrated memory, programmable I/O standards and low-power modes while operating over a 1.71 V to 3.465 V supply range and a 0 °C to 85 °C commercial temperature range.

Key Features

• Non‑volatile, instant‑on architecture – Powers up in microseconds and does not require external configuration memory, enabling simpler boot and secure designs.
• Reconfiguration and in‑field updates – Supports reconfiguring SRAM-based logic in milliseconds and TransFR™ reconfiguration for in-field logic updates while a system operates.
• Logic resources – Approximately 3,000 logic elements and 384 logic blocks provide mid-range capacity for control, glue-logic and protocol bridging tasks.
• Embedded and distributed memory – Approximately 55 Kbits of embedded block RAM (total RAM bits: 55,296) with additional distributed RAM resources for small data buffers and FIFOs.
• I/O count and flexibility – 62 general-purpose I/Os with programmable sysIO™ buffer support for multiple standards, enabling direct interfacing to a broad set of signaling types.
• Clocking – Device-level PLLs for clock multiply/divide and phase shifting (LFXP3 family: 2 PLLs), supporting refined clock management for synchronous designs.
• Low‑power operation – Sleep mode that can reduce static current by up to 1000× for power-sensitive applications.
• Package and mounting – Available in a 100‑pin TQFP / LQFP (14 × 14 mm) surface-mount package for compact board layouts.
• Commercial grade – Rated for 0 °C to 85 °C operating temperature and RoHS compliant for commercial applications.
• System‑level support – Includes IEEE 1149.1 boundary scan and built-in configuration / debug facilities described in the LatticeXP family data.

Typical Applications

• Commercial embedded controllers – Reconfigurable logic and on-chip RAM simplify integration of control functions and custom state machines for consumer and commercial products.
• Interface bridging and protocol conversion – Flexible I/O standards and mid-range logic density enable implementation of glue logic between disparate interfaces.
• Memory interface support – On-chip memory and available DDR support from the LatticeXP family are useful for buffering and interfacing to external memory subsystems.
• Power‑sensitive designs – Sleep mode and non‑volatile instant-on behavior reduce overall system power and speed time-to-ready on power-up.

Unique Advantages

• Instant-on non‑volatile technology – Eliminates the need for external configuration memory, reducing BOM complexity and improving board-level security by avoiding an external bitstream.
• Field reconfiguration – TransFR™ capability and fast SRAM reconfiguration allow in-field updates and feature upgrades without lengthy downtime.
• Compact, mid‑density solution – ~3,000 logic elements and 62 I/Os in a 100‑pin package deliver a balance of capacity and small form factor for space-constrained boards.
• Comprehensive I/O flexibility – Programmable I/O buffer options cover multiple signaling standards to minimize the need for external level‑shifters or translators.
• Power management features – Sleep mode provides substantial static current reduction for designs that require low idle power.
• Tool and IP support – Part of the LatticeXP family with design tool and IP ecosystem referenced in the family data to accelerate development.

Why Choose LFXP3C-4T100C?

The LFXP3C-4T100C positions itself as a compact, commercial-grade FPGA that combines instant-on non‑volatile operation, reconfigurable logic and on-chip memory in a 100‑pin surface-mount package. It is suitable for engineers seeking a mid-density programmable device for commercial embedded systems, interface bridging and power-sensitive applications.

With programmable I/O options, low-power sleep capability and family-level tool and IP support, this device provides a scalable, integrable platform for designs that require in-field flexibility, reduced BOM and predictable commercial-temperature operation.

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