LFXP3C-4Q208C

The LFXP3C-4Q208C is a non-volatile, reconfigurable FPGA device in a 208-pin BFQFP package designed for compact, instantly available programmable logic. It integrates approximately 3,000 logic elements and roughly 55 Kbits of embedded RAM with 136 user I/Os to support moderate-density system designs that require instant-on behavior and in-field reconfiguration.

With broad I/O buffer programmability, multiple on-chip PLLs, and support for a wide supply voltage range, this device targets applications that benefit from fast startup, flexible interfacing, and low static power modes while operating within commercial temperature limits.

Key Features

• Core Logic Approximately 3,000 logic elements and 384 logic block units provide the programmable fabric for combinational and sequential logic implementation.
• Embedded Memory Approximately 55 Kbits (55,296 bits) of on-chip RAM for distributed and block memory use in buffering, FIFOs or small data storage.
• I/O and Interface Flexibility 136 user I/O pins with programmable sysIO-style buffer options (multiple voltage standards supported in the family) for interfacing to a wide range of peripherals and memory devices.
• Non-volatile, Instant-on Architecture Integrated non-volatile configuration means no external configuration memory is required and the device powers up and becomes operational in microseconds.
• In-field Reconfiguration Supports reprogramming of SRAM-based logic in milliseconds and in-system updates via JTAG or in-system programming features described for the family.
• Low-power Modes Family-level sleep mode support enables significant static current reduction for power-sensitive applications.
• Clock Management Up to 2 analog PLLs on the LFXP3 family provide clock multiplication, division and phase shifting for system clocking needs.
• Memory Interface Capability Family documentation indicates dedicated DDR memory interface support up to DDR333, enabling external memory connectivity where required.
• Supply and Thermal Operates across a 1.71 V to 3.465 V supply range and is specified for commercial operating temperatures from 0 °C to 85 °C.
• Package and Mounting Supplied in a 208-BFQFP (208-PQFP, 28 × 28 mm) package for surface-mount assembly.
• Compliance RoHS compliant for lead-free process requirements.

Typical Applications

• Embedded control and glue logic — Use the device to implement system glue logic, protocol bridging and custom control functions where instant-on and reconfigurability reduce BOM and simplify updates.
• Interface and I/O consolidation — Consolidate multiple parallel and serial interfaces using the device’s 136 I/Os and programmable I/O buffer options to reduce board complexity.
• Memory buffering and small data processing — Leverage the embedded RAM and on-chip PLLs for buffering, small FIFOs and timing-critical data paths.

Unique Advantages

• Instant-on, non-volatile configuration: Eliminates the need for external configuration memory and enables immediate device availability after power-up.
• Field reconfigurability: Reprogram SRAM-based logic in-system to update functionality or fix firmware without board-level changes.
• Flexible voltage support: Wide supply range from 1.71 V to 3.465 V accommodates mixed-voltage system designs.
• Compact surface-mount package: 208-PQFP (28 × 28 mm) package provides a balance of pin count and PCB footprint for medium-density designs.
• Power management options: Sleep mode capability (family feature) allows substantial reduction in static current for energy-sensitive applications.
• RoHS compliant: Meets lead-free process requirements for modern manufacturing.

Why Choose LFXP3C-4Q208C?

The LFXP3C-4Q208C offers a compact, non-volatile FPGA solution that combines reconfigurable logic, embedded RAM, and a flexible I/O complement in a single surface-mount package. Its instant-on behavior, in-field reconfiguration capabilities, and on-chip clock management make it well suited to designs that require rapid startup and adaptable functionality within commercial temperature ranges.

This device is appropriate for designers seeking a programmable, moderately dense FPGA with explicit supply and thermal specifications, RoHS compliance, and family-level features such as PLLs and DDR memory interface support that simplify system-level integration and long-term scalability.

Request a quote or submit a pricing inquiry to get availability, lead time and volume pricing for the LFXP3C-4Q208C. Our team can provide technical and procurement support to help integrate this device into your next design.