LFXP3C-3TN100I

IC FPGA 62 I/O 100TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP

Quantity 638 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O62Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-3TN100I – XP Field Programmable Gate Array, 62 I/O, 3,000 logic elements, 100-LQFP

The LFXP3C-3TN100I from Lattice Semiconductor is a LatticeXP family FPGA device that combines non-volatile, reconfigurable logic with embedded memory and flexible I/O in a 100‑pin LQFP package. It targets embedded and industrial applications that require on-chip block RAM, up to 62 general-purpose I/Os, and configurable supply operation across a broad voltage range.

Built for system-level integration, the device emphasizes instant-on, secure configuration and field reprogramming capabilities while supporting industrial operating temperatures and surface-mount 14 × 14 mm packaging.

Key Features

  • Core Logic — Approximately 3,000 logic elements and 384 logic blocks provide compact programmable logic capacity for glue logic, protocol conversion and control functions.
  • Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 54 Kbits) suitable for small buffers, FIFOs and state storage.
  • I/O and Package — 62 I/O pins in a 100‑pin LQFP (14 × 14 mm) surface‑mount package, enabling direct interfacing to sensors, buses and peripherals.
  • Configurable Power Supply — Supports a wide supply range from 1.71 V to 3.465 V for mixed-voltage system integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Non-volatile, Instant-on Architecture — LatticeXP family characteristics include non-volatile configuration and instant-on capability with no external configuration memory required.
  • In-field Reconfiguration & Security — Supports in-field logic updates and design security features provided by the LatticeXP family architecture.
  • Low-power Modes — Family-level sleep mode capability can reduce static current by up to 1000× for power-sensitive designs.
  • Clocking — Device-level PLL support consistent with LatticeXP family specifications (LFXP3 devices include PLL resources for clock management).
  • Standards-oriented I/O Support — Family architecture provides flexible I/O buffer support across common signaling families to ease interface design.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Use for control logic, protocol bridging and sensor/actuator interfacing where the −40 °C to 100 °C rating and 62 I/Os support robust system integration.
  • Embedded Systems — Ideal for embedded peripheral offload, glue logic and deterministic control functions using on-chip logic and embedded RAM.
  • Communications & Interfaces — Implement custom interface logic, protocol conversion and I/O serialization/deserialization leveraging flexible I/O and programmable clocking.
  • Instrumentation & Test — On-chip memory and reconfigurability enable compact implementations of data capture, preprocessing and control functions in measurement equipment.

Unique Advantages

  • Instant-on, Non-volatile Operation: Eliminates the need for external configuration memory and enables immediate startup behavior.
  • Field Reconfigurability: In-field logic updates allow system functionality to be modified without replacing hardware.
  • Compact, Surface-mount Package: 100‑pin LQFP (14 × 14 mm) simplifies board layout while providing 62 I/Os for extensive system connectivity.
  • Wide Voltage Compatibility: 1.71 V to 3.465 V supply range supports diverse I/O voltage domains and mixed-voltage systems.
  • Industrial Reliability: Rated operation from −40 °C to 100 °C supports deployment in demanding environments.
  • Low-power Capability: Sleep mode options from the LatticeXP family enable significant static current reduction for power-sensitive designs.

Why Choose LFXP3C-3TN100I?

The LFXP3C-3TN100I delivers a balanced mix of reconfigurable logic, embedded memory and flexible I/O in a compact industrial-grade package. Its non-volatile configuration, instant-on behavior and in-field reconfiguration capabilities make it well suited for embedded and industrial designs that require secure, updatable logic without external configuration components.

Engineers specifying this device benefit from a clear set of system-level features—approximately 3,000 logic elements, ~54 Kbits of on-chip RAM, 62 I/Os, dual PLL resources and a wide supply and temperature range—making it a practical choice for scalable, robust designs where board space, configurability and reliability matter.

Request a quote or submit an inquiry to receive pricing and availability for the LFXP3C-3TN100I. Include your planned quantity and any required lead-time details to expedite the response.

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