LFXP3C-3TN100I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP |
|---|---|
| Quantity | 638 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 62 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3C-3TN100I – XP Field Programmable Gate Array, 62 I/O, 3,000 logic elements, 100-LQFP
The LFXP3C-3TN100I from Lattice Semiconductor is a LatticeXP family FPGA device that combines non-volatile, reconfigurable logic with embedded memory and flexible I/O in a 100‑pin LQFP package. It targets embedded and industrial applications that require on-chip block RAM, up to 62 general-purpose I/Os, and configurable supply operation across a broad voltage range.
Built for system-level integration, the device emphasizes instant-on, secure configuration and field reprogramming capabilities while supporting industrial operating temperatures and surface-mount 14 × 14 mm packaging.
Key Features
- Core Logic — Approximately 3,000 logic elements and 384 logic blocks provide compact programmable logic capacity for glue logic, protocol conversion and control functions.
- Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 54 Kbits) suitable for small buffers, FIFOs and state storage.
- I/O and Package — 62 I/O pins in a 100‑pin LQFP (14 × 14 mm) surface‑mount package, enabling direct interfacing to sensors, buses and peripherals.
- Configurable Power Supply — Supports a wide supply range from 1.71 V to 3.465 V for mixed-voltage system integration.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Non-volatile, Instant-on Architecture — LatticeXP family characteristics include non-volatile configuration and instant-on capability with no external configuration memory required.
- In-field Reconfiguration & Security — Supports in-field logic updates and design security features provided by the LatticeXP family architecture.
- Low-power Modes — Family-level sleep mode capability can reduce static current by up to 1000× for power-sensitive designs.
- Clocking — Device-level PLL support consistent with LatticeXP family specifications (LFXP3 devices include PLL resources for clock management).
- Standards-oriented I/O Support — Family architecture provides flexible I/O buffer support across common signaling families to ease interface design.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Use for control logic, protocol bridging and sensor/actuator interfacing where the −40 °C to 100 °C rating and 62 I/Os support robust system integration.
- Embedded Systems — Ideal for embedded peripheral offload, glue logic and deterministic control functions using on-chip logic and embedded RAM.
- Communications & Interfaces — Implement custom interface logic, protocol conversion and I/O serialization/deserialization leveraging flexible I/O and programmable clocking.
- Instrumentation & Test — On-chip memory and reconfigurability enable compact implementations of data capture, preprocessing and control functions in measurement equipment.
Unique Advantages
- Instant-on, Non-volatile Operation: Eliminates the need for external configuration memory and enables immediate startup behavior.
- Field Reconfigurability: In-field logic updates allow system functionality to be modified without replacing hardware.
- Compact, Surface-mount Package: 100‑pin LQFP (14 × 14 mm) simplifies board layout while providing 62 I/Os for extensive system connectivity.
- Wide Voltage Compatibility: 1.71 V to 3.465 V supply range supports diverse I/O voltage domains and mixed-voltage systems.
- Industrial Reliability: Rated operation from −40 °C to 100 °C supports deployment in demanding environments.
- Low-power Capability: Sleep mode options from the LatticeXP family enable significant static current reduction for power-sensitive designs.
Why Choose LFXP3C-3TN100I?
The LFXP3C-3TN100I delivers a balanced mix of reconfigurable logic, embedded memory and flexible I/O in a compact industrial-grade package. Its non-volatile configuration, instant-on behavior and in-field reconfiguration capabilities make it well suited for embedded and industrial designs that require secure, updatable logic without external configuration components.
Engineers specifying this device benefit from a clear set of system-level features—approximately 3,000 logic elements, ~54 Kbits of on-chip RAM, 62 I/Os, dual PLL resources and a wide supply and temperature range—making it a practical choice for scalable, robust designs where board space, configurability and reliability matter.
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