LFXP3C-3T100I

The LFXP3C-3T100I is a non-volatile FPGA from Lattice Semiconductor designed for industrial applications requiring instant-on operation and flexible I/O. The device integrates approximately 3,000 logic elements and roughly 55 Kbits of on-chip RAM in a 100-pin LQFP surface-mount package, supporting dense control, interface and mid-range logic integration.

Built on the LatticeXP family architecture, the device supports in-field reconfiguration, low-power sleep modes and a wide supply voltage window, making it suitable for embedded systems and industrial control designs that must operate across extended temperature and voltage ranges.

Key Features

• Logic Capacity — 384 logic blocks and 3,000 logic elements provide mid-range programmable logic for glue logic, control, and protocol implementation.
• On‑chip Memory — Approximately 55 Kbits of embedded RAM (55,296 total RAM bits) for distributed and block memory needs within user designs.
• Flexible I/O — 62 user I/Os in a 100-pin package supporting a variety of interfaces; programmable I/O buffers enable multiple signaling standards as defined by the LatticeXP family.
• Non‑volatile, Instant‑On — LatticeXP family features include non-volatile configuration with instant-on operation and no requirement for external configuration memory.
• Low‑Power Modes — Sleep mode capability permits large reductions in static current for power-sensitive applications (family-level sleep mode behavior described in the LatticeXP data sheet).
• Reconfiguration — Supports in-field logic updates through TransFR™ reconfiguration mechanisms (family-level feature).
• Supply and Temperature Range — Operates from 1.71 V to 3.465 V and rated for industrial temperatures from −40 °C to 100 °C.
• Package and Mounting — Surface-mount 100-LQFP package (supplier device package 100-TQFP, 14 × 14 mm) for compact board-level integration.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement motor control logic, sensor interfacing and embedded control functions that benefit from industrial temperature range and non‑volatile instant-on behavior.
• Communications & Networking — Use programmable I/Os and embedded memory to implement protocol bridging, packet parsing or custom interface logic.
• Consumer & Embedded Systems — Integrate glue logic, user interfaces and peripheral control where compact package and low-power sleep modes are advantageous.
• Memory and Interface Support — Implement DDR-supporting interfaces and timing-critical logic using on-chip memory resources and the family’s sysCLOCK PLL capabilities.

Unique Advantages

• Instant-on Non‑volatile Architecture: Eliminates the need for external configuration memory and enables immediate availability after power-up.
• In‑field Reconfiguration: TransFR™ functionality allows logic updates while the system is operational, reducing downtime for field updates (family-level capability).
• Power Optimization: Sleep mode support provides substantial static current reduction for battery-backed or low-power systems.
• Wide Voltage and Temperature Window: Broad supply voltage range (1.71 V–3.465 V) and −40 °C to 100 °C rating suit robust industrial deployments.
• Compact, Surface‑Mount Package: 100-LQFP (14 × 14 mm) enables space-efficient board layouts while providing 62 I/Os for versatile connectivity.
• Standards‑Ready I/O: Programmable I/O buffers support multiple signaling standards (as defined for the LatticeXP family), helping simplify interface design.

Why Choose LFXP3C-3T100I?

The LFXP3C-3T100I combines the LatticeXP family’s non-volatile instant-on architecture with a compact 100-pin LQFP package and industrial temperature capability, delivering a robust mid-range FPGA option for embedded and industrial designs. Its mix of approximately 3,000 logic elements, ~55 Kbits of on-chip RAM and flexible I/O makes it well suited to designers who need reliable configuration persistence, in-field update capability and power-conscious operation.

Backed by Lattice Semiconductor family-level features such as programmable I/O buffers, PLL-based clocking and system-level support for boundary scan and internal instrumentation, this device offers a practical balance of integration, configurability and long-term deployability for control, interface and protocol tasks.

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