LFXP3C-3Q208I

The LFXP3C-3Q208I is a LatticeXP family FPGA offering a non-volatile, reconfigurable architecture tailored for embedded system designs that require instant-on behavior and in-field reconfiguration. This device integrates roughly 3,000 logic elements, approximately 55 Kbits of on-chip RAM, and up to 136 I/O pins in a 208-pin BFQFP package to support compact, industrial-grade applications.

With a broad supply voltage range (1.71 V to 3.465 V) and an industrial operating temperature range (−40 °C to 100 °C), the LFXP3C-3Q208I is positioned for systems that demand flexibility, integrated memory, and robust environmental performance.

Key Features

• Non-volatile, reconfigurable architecture Instant-on capability and non-volatile configuration remove the need for external configuration memory and allow rapid start-up.
• Reconfiguration and power modes Supports in-field reconfiguration (family TransFR™ Reconfiguration) and sleep mode to reduce static current significantly.
• Logic resources Approximately 3,000 logic elements and 384 logic blocks (PFU/PFF total for the LFXP3 family) to implement control, glue-logic, and state machines.
• Embedded memory Total on-chip RAM of 55,296 bits (approximately 54 Kbits) for distributed and block memory use within designs.
• I/O capability 136 user I/Os in a 208-BFQFP package to interface with peripherals and external devices.
• Voltage and temperature flexibility Operates across 1.71 V to 3.465 V supplies and an industrial temperature range of −40 °C to 100 °C.
• System-level features (family-level) Family features include up to four sysCLOCK™ PLLs, IEEE 1149.1 boundary scan, internal logic analyzer capability (ispTRACY™), and a programmable sysIO™ buffer supporting multiple I/O standards.
• Package and mounting Surface-mount 208-BFQFP (28 × 28 mm PQFP footprint) for compact PCB integration.

Typical Applications

• Embedded control and glue logic Use the device for system control, peripheral interfacing, and custom logic functions where compact, reconfigurable logic is required.
• Memory interface and buffering On-chip RAM resources and PLLs support designs that implement memory interfaces and timing-critical data paths.
• In-field upgradeable systems Non-volatile configuration and TransFR reconfiguration enable firmware and logic updates while deployed.
• Industrial equipment Industrial temperature range and robust supply tolerance make the device suitable for automation, instrumentation, and industrial controller applications.

Unique Advantages

• Instant-on non-volatile configuration: Eliminates external configuration memory and enables rapid system start-up.
• Integrated memory and logic: Approximately 55 Kbits of on-chip RAM combined with ~3,000 logic elements reduces external component count and simplifies PCB design.
• Flexible I/O density: 136 I/Os in a 208-BFQFP package provide a balance of signal count and compact packaging for space-constrained designs.
• Wide supply and temperature tolerance: Support for 1.71 V–3.465 V supplies and −40 °C to 100 °C operation addresses varied industrial environments.
• Field reconfiguration and power management: In-field reconfiguration and sleep mode support reduce downtime and improve system power management options.

Why Choose LFXP3C-3Q208I?

The LFXP3C-3Q208I brings the LatticeXP family’s non-volatile, reconfigurable architecture to compact industrial designs that need immediate availability, integrated memory, and flexible I/O. With ~3,000 logic elements, approximately 55 Kbits of embedded RAM, and 136 I/Os in a 208-BFQFP package, this device is suited for embedded control, interface logic, and systems that benefit from in-field updates and instant-on operation.

Engineers specifying this part will find a balanced combination of integration, environmental tolerance, and family-level system features—offering a scalable path within the LatticeXP portfolio for evolving design requirements.

Request a quote or submit an inquiry for pricing and availability on the LFXP3C-3Q208I to evaluate its fit for your next design.