LFXP20E-5FN484C

The LFXP20E-5FN484C is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It integrates a fabric of logic elements, embedded memory and high-density I/O in a 484-ball BGA (23 × 23 mm) package to deliver instant-on programmable logic without external configuration memory.

This device targets system designs that require in-field reconfiguration, compact high-I/O integration and flexible interface support. Key architectural highlights from the family include non-volatile instant-on behavior, sleep mode for static current reduction, and on-chip resources to implement embedded memory and dedicated memory interfaces.

Key Features

• Non-volatile, infinitely reconfigurable architecture – Instant-on operation with no external configuration memory required; supports in-field reconfiguration and secure configuration retention.
• Logic capacity – 20,000 logic elements (cells) suitable for mid-density FPGA implementations.
• On-chip memory – Approximately 0.396 Mbits of embedded memory (405,504 total bits) for block and distributed RAM use.
• I/O density and package – Up to 340 user I/Os in a 484-ball FBGA (23 × 23 mm) surface-mount package for high-pin-count board designs.
• Flexible I/O standards – Family-level I/O buffer support includes LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS to accommodate a wide range of interfaces.
• Dedicated memory and clock support – Family supports dedicated DDR memory interfaces (up to DDR333) and up to four analog PLLs for clock multiply/divide and phase shifting.
• Low-power modes – Sleep mode capability enables significant static current reduction for power-sensitive applications.
• Commercial temperature and supply – Designed for commercial-grade operation from 0 °C to 85 °C with a specified voltage supply range of 1.14 V to 1.26 V.
• Compliance – RoHS compliant and provided in a surface-mount 484-FPBGA (23 × 23) supplier package.

Typical Applications

• Embedded systems – Use for compact, reconfigurable logic subsystems that benefit from instant-on capability and on-chip memory.
• Memory interface controllers – Implement DDR interface logic using the device’s dedicated memory support and on-chip PLLs for timing control.
• High-density I/O bridging – Consolidate multiple I/O functions and protocol conversions with the device’s 340 I/Os and flexible sysIO buffer support.

Unique Advantages

• Instant-on non-volatile operation: Eliminates the need for external configuration memory and simplifies power-up sequencing.
• Balanced mid-range capacity: 20,000 logic elements with ~0.396 Mbits embedded memory provides a practical blend of logic and memory for many system designs.
• High I/O count in a compact package: 340 I/Os in a 484-ball FBGA (23 × 23 mm) helps reduce board complexity and minimize routing challenges.
• Flexible interface support: Broad family-level I/O standards enable interfacing with a wide variety of peripherals and memory types.
• Power management features: Sleep mode support enables reduced static current for power-sensitive applications.
• Design ecosystem support: Family datasheet references tool and IP support for implementation and migration across LatticeXP densities.

Why Choose LFXP20E-5FN484C?

The LFXP20E-5FN484C positions itself as a compact, mid-density FPFA solution that combines non-volatile instant-on operation, approximately 20,000 logic elements and roughly 0.396 Mbits of embedded memory with a high 340 I/O count in a 484-ball FBGA package. Its commercial temperature rating (0 °C to 85 °C), RoHS compliance and surface-mount packaging make it suitable for space- and cost-constrained system designs that need in-field reconfiguration and flexible interface options.

Backed by the LatticeXP family architecture and associated design tool and IP support, this device offers designers a scalable option for migrating designs across densities while keeping BOM and configuration complexity under control.

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