LFXP3C-3QN208C

The LFXP3C-3QN208C is a non-volatile LatticeXP-family FPGA offering 3,000 logic elements, approximately 55 Kbits of on‑chip RAM, and 136 general-purpose I/Os in a 208-pin BFQFP package. It is designed for commercial-grade embedded systems that require instant-on, reconfigurable logic and flexible I/O options.

With a 1.71 V to 3.465 V supply range and a commercial operating temperature of 0 °C to 85 °C, this surface-mount device is suited to a variety of mid-density digital integration tasks where board-level integration and on‑chip memory are important.

Key Features

• Core Logic 3,000 logic elements (cells) arranged across 384 PFU/PFF rows/columns consistent with the LatticeXP LFXP3 family architecture.
• On‑Chip Memory Approximately 55 Kbits (55,296 bits) of embedded RAM for distributed and block memory usage.
• I/O Capacity 136 user I/Os available in the 208-BFQFP (28 × 28 mm PQFP) package to support a wide range of parallel and serial interfaces.
• Non‑volatile, Reconfigurable Architecture LatticeXP family technology provides non‑volatile storage with instant‑on behavior, no external configuration memory required, and in-field reconfiguration capabilities.
• Power and Sleep Modes Supports low-power operation including a sleep mode for significant static current reduction.
• Clocking and Timing Includes integrated PLL resources consistent with the LFXP3 family (2 PLLs) for clock multiplication, division and phase shifting.
• Flexible I/O Standards Family support for a broad range of I/O standards (examples documented for the LatticeXP family) enables interface flexibility across voltage domains.
• Package and Mounting 208-pin BFQFP / 208-PQFP (28 × 28 mm) surface-mount package for through‑board placement and board-level integration.
• Commercial Grade and Compliance Commercial operating grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• Embedded Control and Glue Logic Mid-density control tasks and glue logic where 3,000 logic elements and on-chip memory reduce external component count.
• Prototyping and Field Upgrades Non‑volatile reconfiguration and instant‑on behavior simplify development cycles and enable in-field updates.
• Interface Bridging Use the 136 I/Os and flexible I/O standard support to implement protocol bridges, parallel interfaces, and board-level signal aggregation.
• Memory‑Backed Logic On‑chip RAM supports small buffering, FIFOs, and lookup tables for mid-complexity data-path and control applications.

Unique Advantages

• Instant‑on Non‑volatile Architecture: Eliminates the need for external configuration memory and enables immediate startup without a configuration phase.
• Compact, Mid‑Density Integration: 3,000 logic elements and approximately 55 Kbits of embedded RAM provide a balance of logic and memory for space- and cost-sensitive designs.
• High I/O Count in PQFP Package: 136 I/Os in a 208‑pin PQFP (28 × 28 mm) package deliver board-level integration without requiring a BGA.
• Flexible Powering: Wide supply range from 1.71 V to 3.465 V supports multiple I/O voltages and system domains.
• Commercial Temperature Range and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial applications.
• Field Reconfigurability and Low‑Power Modes: In-field reconfiguration capabilities plus sleep mode options help extend system flexibility and reduce standby power.

Why Choose LFXP3C-3QN208C?

The LFXP3C-3QN208C provides a practical, mid-density FPGA solution that consolidates logic, memory, and I/O in a single, non‑volatile device. Its instant-on capability and reconfigurable architecture address design cycles that require rapid startup and in-field updates, while the 136 I/Os and PQFP packaging simplify board integration.

This device is well suited for designers and OEMs building commercial embedded systems that need a balance of logic capacity, on‑chip memory, flexible I/O options, and straightforward power requirements. The combination of LatticeXP family features and the LFXP3 device profile delivers a scalable choice within the LatticeXP lineup for mid-complexity designs.

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