LFXP3C-3T144C

The LFXP3C-3T144C is a commercial‑grade, non‑volatile FPGA from Lattice Semiconductor’s LatticeXP family, provided in a 144‑lead LQFP surface‑mount package. It integrates approximately 3,000 logic elements, roughly 55,296 bits of on‑chip RAM, and 100 I/O pins to address mid‑density embedded logic and interfacing needs.

Designed for instant-on, reconfigurable applications, this device targets system designs that require compact, programmable logic with flexible I/O and multiple supply voltage operation across a commercial temperature range.

Key Features

• Core Logic — Approximately 3,000 logic elements organized for reconfigurable logic implementation.
• Embedded Memory — Total on‑chip RAM of 55,296 bits (approximately 54 Kbits) supporting distributed and block memory usage.
• I/O and Package — 100 general‑purpose I/Os in a 144‑lead LQFP (surface‑mount) package; supplier package noted as 144‑TQFP (20 × 20 mm).
• Voltage Flexibility — Operates across a broad supply range from 1.71 V to 3.465 V to support multiple I/O and core voltage domains.
• Non‑volatile Instant‑On — Family features include non‑volatile configuration and instant‑on power‑up behavior (powers up in microseconds).
• In‑Field Reconfiguration (TransFR) — Supports in‑field logic updates while the system operates, enabling rapid field upgrades.
• Low‑Power Mode — Sleep mode capability provides significant static current reduction (sleep mode allows up to 1000× static current reduction as documented for the family).
• Clocking — Family supports analog PLLs for clock multiply/divide and phase shifting; LFXP3 family devices include PLL resources appropriate to mid‑density parts.
• System Support — Family‑level features include JTAG/boundary scan and on‑chip configuration support for system integration and debug.
• RoHS Compliant — Device is RoHS compliant for environmentally conscious product designs.
• Commercial Temperature Grade — Specified for operation from 0 °C to 85 °C.

Typical Applications

• Embedded Control — Implement custom control logic, protocol bridging, or glue logic in compact embedded systems.
• Interface and I/O Expansion — Provide flexible, reprogrammable I/O handling for sensor aggregation, display interfaces, or peripheral conversion.
• Consumer and Industrial Electronics — Add field‑updateable functionality and instant‑on responsiveness to products operating within commercial temperature ranges.
• Prototyping and Low‑to‑Mid Volume Designs — Use the integrated memory and logic resources to validate system functions without external configuration memory.

Unique Advantages

• Non‑volatile, instant‑on architecture: Eliminates the need for external configuration memory and enables rapid system startup in microseconds.
• Field reconfiguration: TransFR capability allows logic updates while the system is running, reducing maintenance downtime and enabling in‑field feature upgrades.
• Compact, surface‑mount package: 144‑lead LQFP (20 × 20 mm supplier package) combines a mid‑range I/O count with a small PCB footprint for space‑constrained designs.
• Flexible supply range: Operation from 1.71 V to 3.465 V supports multiple I/O standards and power scenarios within a single device.
• Power management options: Sleep mode offers substantial static current reduction for power‑sensitive systems.
• Proven family ecosystem: Family‑level features such as PLLs, on‑chip memory structures, and boundary scan support simplify system integration and debugging.

Why Choose LFXP3C-3T144C?

The LFXP3C-3T144C positions itself as a mid‑density, reconfigurable logic solution for designs that need non‑volatile instant‑on behavior, in‑field update capability, and a compact surface‑mount footprint. With around 3,000 logic elements, roughly 55 Kbits of on‑chip RAM, and 100 I/Os, it balances integration and board area efficiency for embedded control, interface, and prototyping applications within commercial temperature requirements.

Choosing this device provides long‑term design flexibility through reprogrammability and family‑level system features, while RoHS compliance and a wide supply range support environmentally conscious, multi‑voltage system designs.

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