LFXP3C-3TN100C

The LFXP3C-3TN100C is a non-volatile LatticeXP family FPGA offering approximately 3000 logic elements, about 55 Kbits of on-chip RAM (55,296 bits), and 62 user I/Os in a 100-pin LQFP package. It provides instant-on, infinitely reconfigurable programmable logic with integrated memory and flexible I/O support for commercial embedded designs.

Designed for system-level integration where fast power-up, in-field reconfiguration and compact packaging matter, this device supports a wide supply voltage range (1.71 V to 3.465 V) and operates across a commercial temperature range (0 °C to 85 °C).

Key Features

• Non-volatile, reconfigurable core Instant-on operation with no external configuration memory required; SRAM-based logic can be reconfigured in milliseconds.
• Low-power modes On-chip sleep mode reduces static current by up to 1000× for power-sensitive designs.
• Logic capacity Approximately 3000 logic elements and 384 logic blocks (PFU/PFF tiles) for mid-range logic integration.
• Embedded memory Approximately 55 Kbits of on-chip RAM delivered as embedded and distributed memory resources for buffering and state storage.
• I/O and interface flexibility 62 user I/Os with programmable sysIO buffers supporting multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Dedicated memory interface Support for dedicated DDR memory interfaces up to DDR333 (166 MHz) for external memory connectivity.
• Clocking Two analog sysCLOCK PLLs on the LFXP3 family for clock multiply/divide and phase shifting.
• Package and mounting 100-pin LQFP (14 × 14 mm) surface-mount package; RoHS compliant.
• Power and temperature Wide operating supply range of 1.71 V to 3.465 V and commercial operating temperature from 0 °C to 85 °C.
• System-level support On-chip configuration oscillator, IEEE 1149.1 boundary scan and embedded debug capabilities in the LatticeXP family; supported by ispLEVER design tools and pre-designed IP cores.

Typical Applications

• Commercial embedded control — Implement custom glue logic, peripheral control and state machines with instant-on reconfigurability and compact package options.
• Interface bridging and protocol conversion — Flexible sysIO and wide interface support enable protocol bridging between heterogeneous subsystems.
• Memory interface and buffering — On-chip embedded RAM and DDR interface support simplify local buffering and external memory control tasks.
• Consumer and communications electronics — Fast power-up and reconfiguration capabilities suit consumer and communications modules requiring rapid initialization and field updates.

Unique Advantages

• Instant-on, non-volatile architecture: Eliminates the need for external configuration memory and enables microsecond-level power-up for time-sensitive applications.
• Field reconfiguration: Reconfigure SRAM-based logic in milliseconds and apply in-field updates without external storage, simplifying maintenance and upgrades.
• Low BOM and compact packaging: Integrated memory and 62 I/Os in a 100-LQFP reduce board area and component count for space-constrained designs.
• Power-efficient standby: Sleep mode can cut static current dramatically, supporting battery- or energy-conscious designs.
• Flexible I/O and memory support: Broad sysIO standard support and dedicated DDR interface capability enable diverse system connectivity without additional interface chips.
• Design ecosystem: Supported by ispLEVER tools and pre-designed ispLeverCORE modules to accelerate development and simplify implementation.

Why Choose LFXP3C-3TN100C?

The LFXP3C-3TN100C positions itself as a mid-range, non-volatile FPGA that balances logic capacity, embedded memory and flexible I/O in a compact 100-LQFP footprint. Its instant-on behavior, in-field reconfiguration and sleep-mode power savings make it well suited to commercial embedded systems and communications equipment where fast start-up and lifecycle updates are important.

Designed for engineers who need a reconfigurable, integrated solution backed by vendor design tools and IP, this device offers practical on-chip resources (approximately 3000 logic elements and ~55 Kbits of RAM), dual PLL clocking and a broad I/O standard palette for versatile system integration and long-term design scalability.

Request a quote or submit a quote for LFXP3C-3TN100C to begin procurement and evaluation for your next design.