LFXP3C-3TN144I

The LFXP3C-3TN144I is a Lattice Semiconductor XP-family FPGA in a 144-pin LQFP package designed for industrial applications. It combines on-chip non-volatile configuration, a compact logic array and embedded memory to deliver instant-on, reconfigurable logic for embedded and industrial systems.

With 3,000 logic elements, 100 user I/Os and approximately 54 Kbits of on-chip RAM, the device targets designs that require mid-range logic density, flexible I/O options and operation across a wide supply and temperature range.

Key Features

• Core Logic — 3,000 logic elements and 384 logic blocks provide mid-range logic density for custom control, glue-logic and interface functions.
• Embedded Memory — Total on-chip RAM: 55,296 bits (approximately 54 Kbits) for distributed and block memory usage within the FPGA fabric.
• I/O and Package — 100 general-purpose I/Os available in a 144-LQFP (20 × 20 mm) surface-mount package to support dense board-level integration.
• Non-volatile, Instant-on Architecture — LatticeXP family characteristics include non-volatile configuration with instant-on operation and no external configuration memory required.
• Flexible Voltage Supply — Supported supply range from 1.71 V to 3.465 V to accommodate multiple I/O and core voltage domains.
• Industrial Temperature Grade — Specified operating temperature range from −40 °C to 100 °C for deployment in industrial environments.
• Power and System Features — Family-level features include sleep mode for significant static current reduction and in-field reconfiguration capabilities.
• Clocking and Memory Interfaces — Family documentation references programmable PLLs/clock management and dedicated DDR memory support at the family level.
• Standards and Compliance — RoHS compliant and supplied in a standard 144-pin TQFP footprint for established manufacturing flows.

Typical Applications

• Industrial Control — Mid-density control logic, signal conditioning and I/O aggregation where industrial temperature operation and robust packaging are required.
• Embedded Systems — Instant-on, non-volatile configuration makes the device suitable for embedded controllers and products that benefit from fast start-up without external configuration memory.
• Interface Bridging — 100 I/Os in a compact 144-LQFP package provide flexible options for protocol translation, bus interfacing and custom peripheral glue logic.
• In-field Upgrades and Prototyping — Reconfigurable fabric and family support for in-field logic updates enable iterative development and deployed feature upgrades.

Unique Advantages

• Integrated Non-volatile Configuration — Eliminates the need for external configuration memory, simplifying BOM and board design.
• Instant-on Behavior — Fast power-up behavior enables systems that require rapid initialization without additional boot circuitry.
• Industrial Temperature Support — −40 °C to 100 °C rating supports deployments in harsh or temperature-variable environments.
• Compact, High I/O Density — 100 I/Os in a 144-LQFP package balance board area and connectivity for dense embedded designs.
• Flexible Power Options — Wide supply range (1.71 V–3.465 V) allows compatibility with multiple core and I/O voltage domains.
• On-chip Memory for System Logic — Approximately 54 Kbits of embedded RAM enables local buffering, state storage and small lookup tables without external memory.

Why Choose LFXP3C-3TN144I?

The LFXP3C-3TN144I delivers a mid-range FPGA solution combining non-volatile configuration, a compact logic fabric and embedded memory in a 144-LQFP surface-mount package. Its mix of 3,000 logic elements, approximately 54 Kbits of on-chip RAM and 100 I/Os make it well-suited for industrial and embedded designs that need reliable performance across a wide temperature range and simplified system integration.

Choosing this part provides designers with a reconfigurable building block that reduces external component count, supports instant-on operation and aligns with established LatticeXP family capabilities for clocking, flexible I/O signaling and in-field reconfiguration.

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