LFXP3C-4Q208I

The LFXP3C-4Q208I is a non-volatile FPGA in the Lattice XP family designed for instant-on, reconfigurable logic integration. It combines approximately 3,000 logic elements with on-chip memory and flexible I/O to address embedded and industrial system designs that require rapid startup and field reconfiguration.

Key hardware credentials include 136 user I/Os in a 208‑BFQFP (28 × 28 mm) package, approximately 55,296 bits of on-chip RAM, a wide supply range (1.71 V to 3.465 V) and industrial operating temperature (-40 °C to 100 °C).

Key Features

• Logic Capacity  Approximately 3,000 logic elements with 384 logic blocks, enabling medium-density logic integration for control, interface and glue-logic functions.
• Embedded Memory  55,296 bits of total on-chip RAM (approximately 54 Kbits), combining block and distributed memory resources for data buffering and state storage.
• Flexible I/O  136 I/O pins in a 208‑BFQFP package (28 × 28 mm), supporting a wide range of interface options as provided by the LatticeXP family.
• Configurable I/O Standards  Programmable sysIO buffer support for multiple standards documented for the LatticeXP family, enabling LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and other high-speed interfaces.
• Non-volatile, Instant-on Architecture  Built-in non-volatile configuration delivers microsecond power-up and eliminates the need for external configuration memory.
• Reconfiguration & Security  Infinitely reconfigurable fabric with in-field reconfiguration capability via system and JTAG ports, and inherent bitstream protection from external read-back.
• Power Management  Sleep mode support that can reduce static current by up to 1000× for low-power standby operation.
• Clocking  Up to 2 PLLs on the LFXP3 device family for clock multiply/divide and phase control (family-level PLL features apply).
• Industrial Grade  Specified operating temperature range of -40 °C to 100 °C for deployment in industrial environments.
• Package & Supply  208‑BFQFP (28 × 28 mm) package; voltage supply range from 1.71 V to 3.465 V to support multi-voltage system rail configurations.
• Standards & Tools  Family-level support for IEEE 1149.1 boundary scan and onboard configuration options documented in the LatticeXP data materials.

Typical Applications

• Embedded Systems  Use as a mid-density programmable logic fabric for glue logic, peripheral aggregation and protocol bridging in embedded controllers.
• Industrial Control  Industrial-temperature operation and broad I/O support enable motor control, factory automation interfaces and real-time supervisory logic.
• Communication Interfaces  Programmable I/O standards and on-chip memory make the device suitable for custom PHY interfaces, SERDES glue logic and protocol conversion.
• Prototyping & System Integration  Instant-on configuration and reprogrammability speed development cycles and allow in-field updates during system integration and validation.

Unique Advantages

• Instant-on Non-volatile Configuration: Eliminates external configuration memory and enables microsecond startup for quicker system availability.
• Field Reconfigurable: Re-programmable fabric and JTAG/system configuration paths support in-field updates and iterative feature rollout.
• Compact, High‑I/O Package: 136 I/Os in a 208‑BFQFP (28 × 28 mm) package simplifies PCB routing and reduces BOM complexity compared with multi-chip solutions.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in industrial environments.
• Flexible Supply Range: 1.71 V to 3.465 V input range supports designs using multiple common supply rails without external level shifters for some configurations.
• Power-saving Sleep Mode: Sleep capability delivers substantial static current reduction for low-power standby modes.

Why Choose LFXP3C-4Q208I?

The LFXP3C-4Q208I positions itself as a versatile, mid-density FPGA that brings non-volatile instant-on behavior, in-field reconfiguration and a broad set of I/O options into a single 208‑BFQFP package. Its approximately 3,000 logic elements and ~55 Kbits of on-chip RAM make it well suited for embedded and industrial applications requiring reliable, reprogrammable logic and flexible interfacing.

Engineers seeking a compact FPGA with industrial temperature capability, multiple programmable I/O standards, and the ability to update logic in the field will find the LFXP3C-4Q208I appropriate for reducing system complexity and supporting long-term product evolution within the LatticeXP family ecosystem.

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