LFXP3C-4QN208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP |
|---|---|
| Quantity | 58 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 136 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3C-4QN208C – XP Field Programmable Gate Array (FPGA), 136 I/Os, 55,296 bits RAM, 3,000 logic elements, 208-BFQFP
The LFXP3C-4QN208C is a member of the LatticeXP family of non-volatile FPGAs from Lattice Semiconductor Corporation. This surface-mount FPGA integrates approximately 3,000 logic elements and 55,296 bits of on-chip RAM in a 208-pin BFQFP (28 × 28 mm) package, with 136 available I/Os.
Designed for system-level designs and embedded applications, the device delivers instant-on non-volatile operation, flexible I/O support, and low-power modes to simplify board-level design and reduce external components.
Key Features
- Logic Capacity — 3,000 logic elements (cells) and 384 CLB/PFU resources provide the programmable fabric for custom logic and control functions.
- Embedded Memory — 55,296 bits of on-chip RAM (approximately 54 Kbits) for distributed and block memory needs within your design.
- I/O and Package — 136 I/Os in a 208-BFQFP (208-PQFP, 28 × 28 mm) surface-mount package for dense I/O connectivity in a compact footprint.
- Voltage Range — Flexible supply operation from 1.71 V to 3.465 V to support multiple system power domains.
- Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Non-volatile, Instant-On Architecture — Family-level capability provides non-volatile configuration without the need for external configuration memory and enables rapid device startup.
- Low-Power Modes — Sleep mode capability to significantly reduce static current for power-sensitive applications.
- Flexible I/O Standards (family-level) — Family architecture supports a broad range of I/O standards for interfacing with diverse system peripherals and signaling environments.
- System Support — Family features include on-chip PLLs for clock management and system-level debug/configuration through standard interfaces.
- RoHS Compliant — Conforms to RoHS requirements for lead-free assembly.
Typical Applications
- Embedded Control — Implement custom control logic, protocol bridging, and glue logic in embedded products requiring compact, on-chip programmability.
- Communications Interfaces — Provide flexible I/O and memory resources for interface adaptation, protocol translation, and timing-critical control functions.
- Instrumentation and Test — Integrate data handling, timing, and I/O conditioning for compact measurement and test equipment.
- Consumer Electronics — Enable feature customization, I/O expansion, and system integration in consumer devices where instant-on and no external configuration memory are beneficial.
Unique Advantages
- Non-volatile instant-on: Eliminates external configuration memory and provides immediate startup behavior, simplifying BOM and system initialization.
- Compact, high-density I/O: 136 I/Os in a 208-pin BFQFP package enable substantial I/O integration in a small board area.
- Wide supply flexibility: Operates across 1.71 V–3.465 V, easing integration across multiple power rails without requiring voltage translation components.
- On-chip memory for local buffering: Approximately 55 Kbits of embedded RAM supports local data buffering and small memory-mapped functions without external SRAM.
- Power management options: Sleep mode reduces static current for energy-conscious designs and battery-powered applications.
- RoHS compliance: Simplifies regulatory requirements for lead-free assembly and manufacturing.
Why Choose LFXP3C-4QN208C?
The LFXP3C-4QN208C positions itself as a compact, non-volatile FPGA solution for embedded and system-level designs that require immediate startup, flexible I/O, and on-chip memory in a commercial-temperature device. Its combination of approximately 3,000 logic elements, 55,296 bits of embedded RAM, and 136 I/Os in a 208-BFQFP package delivers a balance of integration and board-level simplicity for mid-density applications.
Choose this part when you need an FPGA with instant-on configuration, a small footprint package, and power-saving modes to reduce external components and accelerate time-to-market. It is well suited to customers developing embedded control, communications interface, instrumentation, and consumer electronic applications who require verified family-level features and vendor-supported design flows.
Request a quote or submit an inquiry to receive pricing, availability, and technical support for LFXP3C-4QN208C. Our team can provide delivery options and additional product documentation upon request.

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