LFXP3C-4QN208C

IC FPGA 136 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 136 55296 3000 208-BFQFP

Quantity 58 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O136Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-4QN208C – XP Field Programmable Gate Array (FPGA), 136 I/Os, 55,296 bits RAM, 3,000 logic elements, 208-BFQFP

The LFXP3C-4QN208C is a member of the LatticeXP family of non-volatile FPGAs from Lattice Semiconductor Corporation. This surface-mount FPGA integrates approximately 3,000 logic elements and 55,296 bits of on-chip RAM in a 208-pin BFQFP (28 × 28 mm) package, with 136 available I/Os.

Designed for system-level designs and embedded applications, the device delivers instant-on non-volatile operation, flexible I/O support, and low-power modes to simplify board-level design and reduce external components.

Key Features

  • Logic Capacity — 3,000 logic elements (cells) and 384 CLB/PFU resources provide the programmable fabric for custom logic and control functions.
  • Embedded Memory — 55,296 bits of on-chip RAM (approximately 54 Kbits) for distributed and block memory needs within your design.
  • I/O and Package — 136 I/Os in a 208-BFQFP (208-PQFP, 28 × 28 mm) surface-mount package for dense I/O connectivity in a compact footprint.
  • Voltage Range — Flexible supply operation from 1.71 V to 3.465 V to support multiple system power domains.
  • Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
  • Non-volatile, Instant-On Architecture — Family-level capability provides non-volatile configuration without the need for external configuration memory and enables rapid device startup.
  • Low-Power Modes — Sleep mode capability to significantly reduce static current for power-sensitive applications.
  • Flexible I/O Standards (family-level) — Family architecture supports a broad range of I/O standards for interfacing with diverse system peripherals and signaling environments.
  • System Support — Family features include on-chip PLLs for clock management and system-level debug/configuration through standard interfaces.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free assembly.

Typical Applications

  • Embedded Control — Implement custom control logic, protocol bridging, and glue logic in embedded products requiring compact, on-chip programmability.
  • Communications Interfaces — Provide flexible I/O and memory resources for interface adaptation, protocol translation, and timing-critical control functions.
  • Instrumentation and Test — Integrate data handling, timing, and I/O conditioning for compact measurement and test equipment.
  • Consumer Electronics — Enable feature customization, I/O expansion, and system integration in consumer devices where instant-on and no external configuration memory are beneficial.

Unique Advantages

  • Non-volatile instant-on: Eliminates external configuration memory and provides immediate startup behavior, simplifying BOM and system initialization.
  • Compact, high-density I/O: 136 I/Os in a 208-pin BFQFP package enable substantial I/O integration in a small board area.
  • Wide supply flexibility: Operates across 1.71 V–3.465 V, easing integration across multiple power rails without requiring voltage translation components.
  • On-chip memory for local buffering: Approximately 55 Kbits of embedded RAM supports local data buffering and small memory-mapped functions without external SRAM.
  • Power management options: Sleep mode reduces static current for energy-conscious designs and battery-powered applications.
  • RoHS compliance: Simplifies regulatory requirements for lead-free assembly and manufacturing.

Why Choose LFXP3C-4QN208C?

The LFXP3C-4QN208C positions itself as a compact, non-volatile FPGA solution for embedded and system-level designs that require immediate startup, flexible I/O, and on-chip memory in a commercial-temperature device. Its combination of approximately 3,000 logic elements, 55,296 bits of embedded RAM, and 136 I/Os in a 208-BFQFP package delivers a balance of integration and board-level simplicity for mid-density applications.

Choose this part when you need an FPGA with instant-on configuration, a small footprint package, and power-saving modes to reduce external components and accelerate time-to-market. It is well suited to customers developing embedded control, communications interface, instrumentation, and consumer electronic applications who require verified family-level features and vendor-supported design flows.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for LFXP3C-4QN208C. Our team can provide delivery options and additional product documentation upon request.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up