LFXP3C-4QN208I

The LFXP3C-4QN208I is a non-volatile Lattice XP family FPGA in a 208-pin BFQFP package designed for industrial-grade embedded applications. It combines reconfigurable logic, on-chip memory and a high-density I/O array to support system-level integration where instant-on operation, flexible I/O and field reconfiguration are required.

With 3,000 logic elements, approximately 55 Kbits of embedded RAM and 136 I/Os, this device targets designs that need compact, robust programmability across a wide supply and temperature range (1.71 V–3.465 V, –40 °C to 100 °C).

Key Features

• Core Logic — 3000 logic elements (approximately 3K LUTs) in the LFXP3 class providing reconfigurable logic resources for glue logic, control functions and custom accelerators.
• Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 55 Kbits) for distributed and block memory needs within system designs.
• I/O Density & Package — 136 user I/Os in a 208-BFQFP (208-PQFP, 28×28 mm) package for high pin-count interfacing in a compact footprint.
• Non-Volatile, Instant-On Architecture — LatticeXP family non-volatile technology removes the need for external configuration memory and enables immediate power-up configuration.
• Reconfiguration & In-field Updates — Supports in-field logic updates (TransFR reconfiguration) and programmable SRAM/non-volatile memory through system configuration and JTAG ports.
• Clocking — Device-level PLL resources consistent with the LFXP3 class (2 analog PLLs) for clock multiplication, division and phase adjustment.
• Flexible I/O Standards (Family-Level) — Family architecture supports a wide range of I/O standards across voltage domains (including multiple LVCMOS levels and differential interfaces), enabling interface versatility across designs.
• Power & Low-Power Modes — Wide supply range (1.71 V to 3.465 V) and sleep-mode capability for static current reduction at the system level.
• Industrial Temperature Rating — Specified operating temperature from –40 °C to 100 °C for use in industrial environments.
• Packaging & Mounting — Surface-mount 208-BFQFP (28×28 mm) supplier device package suited for automated PCB assembly.
• Standards & System Support (Family-Level) — Boundary-scan (IEEE 1149.1) and onboard debug capabilities for system bring-up and validation.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Instant-on embedded systems — Systems that require immediate availability at power-up benefit from the device’s non-volatile, instant-on architecture and on-chip configuration.
• Field-upgradeable products — Devices that require in-field logic updates can use TransFR reconfiguration and JTAG-programmable memory to deploy updates without external configuration memory.
• Memory interface and buffering — Designs requiring dedicated DDR or synchronous memory interfaces can leverage the family’s dedicated DDR support and on-chip memory resources.
• High-density I/O bridging and protocol interfacing — The 136 I/O pins in the 208-BFQFP package enable dense signal routing for protocol translation, bus bridging and mixed-signal interfacing.

Unique Advantages

• Instant-on, no external config memory: Eliminates the need for external configuration devices, simplifying BOM and board-level design.
• In-field reconfiguration: TransFR and JTAG programmability enable safe, rapid updates to deployed systems without removing the device.
• Compact, high-pin-count package: 208-BFQFP with 136 I/Os delivers high interface density in a compact 28×28 mm footprint for space-constrained boards.
• Wide supply and industrial temperature range: Operates from 1.71 V to 3.465 V and –40 °C to 100 °C, supporting diverse industrial power rails and environmental conditions.
• On-chip memory resources: Approximately 55 Kbits of embedded RAM provides local storage for buffering, state machines and small data structures without external memory.
• Design and debug support: Boundary-scan and onboard debug capabilities simplify verification, testing and production fault isolation.

Why Choose LFXP3C-4QN208I?

The LFXP3C-4QN208I delivers a balanced combination of reconfigurable logic, on-chip memory and high I/O density in a non-volatile FPGA tailored for industrial embedded designs. Its instant-on capability, in-field reconfiguration options and compact 208-BFQFP package make it suitable for systems that demand fast startup, flexible updates and dense interfacing without external configuration components.

This device is a strong fit for engineers designing industrial controllers, embedded communication interfaces and compact systems that require robust temperature range support, flexible supply voltages and on-chip resources to reduce board-level complexity.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the LFXP3C-4QN208I.