LFXP3C-3TN144C

The LFXP3C-3TN144C is a Lattice Semiconductor LatticeXP family FPGA offered in a 144-pin surface-mount package. It combines non-volatile, infinitely reconfigurable logic with on-chip embedded memory and flexible I/O to support instant-on and in-field reconfiguration scenarios.

This device targets designs that require compact, reconfigurable logic: it provides 3,000 logic elements, approximately 55 Kbits of embedded RAM, 100 I/O pins and a 1.71–3.465 V supply range, making it suitable for a wide range of commercial electronic applications where fast startup, low-power sleep modes and flexible interfacing are important.

Key Features

• Core Architecture  Non-volatile LatticeXP family FPGA with reconfigurable logic and instant-on capability; supports in-field reconfiguration (TransFR™ Reconfiguration) and reprogramming through system configuration and JTAG ports.
• Logic Capacity  Approximately 3,000 logic elements and 384 logic blocks (PFU/PFF), enabling moderate-complexity designs in a compact package.
• Embedded Memory  Total on-chip RAM: 55,296 bits (approximately 54 Kbits) of embedded block RAM for data buffering, state storage and small local memories.
• Flexible I/O  100 I/O pins in the 144-pin package with programmable sysIO™ buffer support for multiple interface standards as described in the LatticeXP family documentation.
• Clocking  Device-level PLL support consistent with LatticeXP family capabilities; on-chip clock management to support common clock multiply/divide and phase-shifting requirements.
• Low-Power Modes  Sleep mode capability with significant static current reduction (datasheet indicates up to 1000× reduction) to support low-power system states.
• Voltage & Power  Supply range 1.71 V to 3.465 V; the LatticeXP family supports operation with common rails including 1.2 V, 1.8 V, 2.5 V and 3.3 V.
• Package & Mounting  Surface-mount 144-LQFP (supplier device package listed as 144-TQFP, 20 × 20 mm) for board-level integration where a compact footprint is required.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation for commercial applications.
• Design & Debug Support  Family-level features include IEEE 1149.1 boundary scan and internal logic analysis capabilities as documented for the LatticeXP family.
• RoHS Compliant  Device is RoHS compliant.

Typical Applications

• Embedded control and prototyping  Implement reconfigurable control logic, glue logic and prototyping platforms that benefit from instant-on and in-field updates.
• Interface bridging and protocol adaptation  Use programmable I/O and on-chip logic to adapt between different digital interfaces and to implement protocol translators.
• Memory buffering and small-data processing  Leverage the integrated embedded RAM for local buffering, FIFO implementation and small on-chip data structures.
• Low-power systems  Deploy in designs that require aggressive static current reduction and the ability to enter deep sleep modes while preserving configuration.

Unique Advantages

• Non-volatile instant-on: Ensures rapid power-up without external configuration memory and protects configuration security.
• Reconfigurable in-field: TransFR™ reconfiguration enables logic updates while the system is operating for quick feature deployment or bug fixes.
• Compact, integrated solution: 3,000 logic elements and ~54 Kbits of embedded RAM in a 144-pin surface-mount package reduce BOM and save board space.
• Flexible interfacing: Programmable I/O buffer options from the LatticeXP family provide broad protocol support for mixed-signal systems and heterogeneous interfaces.
• Power management: Dedicated sleep mode capability offers substantial static current reduction for energy-conscious designs.
• Commercial-grade reliability: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployments.

Why Choose LFXP3C-3TN144C?

The LFXP3C-3TN144C provides a balanced combination of reconfigurable logic, embedded memory and flexible I/O in a compact 144-pin surface-mount package. Its non-volatile architecture delivers instant-on startup and secure configuration storage, while sleep-mode and reconfiguration features support power-conscious and field-updatable designs. With 3,000 logic elements, approximately 55 Kbits of on-chip RAM and 100 I/Os, this device is well suited to commercial embedded applications that require moderate logic density, fast boot, and adaptable I/O.

Designers benefit from the LatticeXP family ecosystem and device-level features such as boundary scan and internal logic analysis—helping accelerate development cycles and enabling longer-term design scalability within the LatticeXP product line.

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