LFXP3C-3T144I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP |
|---|---|
| Quantity | 1,562 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3C-3T144I – XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP
The LFXP3C-3T144I is a LatticeXP family FPGA offering a non-volatile, reconfigurable logic platform in a 144-pin surface-mount package. It integrates approximately 3,000 logic elements, 55,296 bits of embedded RAM, and 100 user I/Os to address compact system designs that require instant-on operation and flexible I/O support.
Designed for industrial-grade applications, this device supports a wide supply range (1.71 V to 3.465 V) and an operating temperature range of −40 °C to 100 °C, making it suitable for embedded control, interface bridging, and communication endpoint functions where robustness and reconfigurability are required.
Key Features
- Core Logic Approximately 3,000 logic elements organized across 384 configurable logic blocks (CLBs) for implementing control, glue-logic and mid-density processing functions.
- On-chip Memory 55,296 total RAM bits (approximately 54 Kbits of embedded block RAM) plus support for distributed RAM resources to store lookup tables, FIFOs and small data buffers.
- I/O Density & Flexibility 100 user I/Os in a 144-pin package provide ample connectivity for sensors, peripherals, and parallel interfaces.
- Power & Supply Range Operates from 1.71 V to 3.465 V, enabling compatibility with multiple core and I/O voltage domains within a system.
- Industrial Temperature Grade Rated for −40 °C to 100 °C operation, suitable for industrial environments.
- Non-Volatile, Instant-On Architecture Family-level capabilities include non-volatile configuration with instant-on behavior and in-field reconfiguration options, enabling rapid startup and secure designs.
- Clocking Family documentation specifies integrated analog PLLs for clock multiply/divide and phase shifting; the LFXP3 family includes device-level PLL resources to support system timing requirements.
- Package and Mounting Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20 × 20 mm) for compact board integration.
- Standards & Compliance RoHS compliant.
Typical Applications
- Industrial Control — Implement motor control logic, sensor aggregation and deterministic I/O handling within factory and process-control systems using industrial temperature capability and flexible I/O.
- Interface Bridging — Bridge disparate peripheral interfaces and perform protocol conversion where a compact, reprogrammable logic device is needed.
- Embedded Communications — Handle endpoint signaling, packet parsing or custom packet filtering in communications modules that require on-chip memory and PLL-based clocking.
- Instrumentation & Test — Create custom data acquisition front-ends, timing logic, and control sequencing for benchtop or rack-mounted instruments.
Unique Advantages
- Non-volatile instant-on operation: Eliminates the need for external configuration memory and enables rapid system startup.
- Reconfigurability in the field: Supports in-system updates and logic changes without replacing hardware, extending product lifetime and enabling iterative feature development.
- Balanced integration: Combines ~3,000 logic elements, embedded RAM and 100 I/Os in a compact 144-pin package to reduce board area and BOM complexity.
- Industrial thermal range: Rated −40 °C to 100 °C to meet demanding environmental requirements in industrial deployments.
- Flexible supply compatibility: Broad voltage support from 1.71 V to 3.465 V allows use with multiple core and I/O voltage domains.
- RoHS compliance: Meets common environmental requirements for commercial and industrial electronics.
Why Choose LFXP3C-3T144I?
The LFXP3C-3T144I delivers a compact, reconfigurable solution for mid-density logic, interface and embedded memory needs. Its combination of approximately 3,000 logic elements, 55,296 bits of embedded RAM, and 100 I/Os in a 144-pin surface-mount package provides a practical balance of integration and flexibility for industrial and embedded designs.
This part is well-suited for engineers seeking a non-volatile FPGA with instant-on capability, field reconfiguration options and a wide operating voltage and temperature range. The LFXP3 family support and device-level resources help enable scalable designs and straightforward migration within the same FPGA family.
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