LFXP3C-3T144I

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

Quantity 1,562 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O100Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-3T144I – XP Field Programmable Gate Array (FPGA) IC 100 55296 3000 144-LQFP

The LFXP3C-3T144I is a LatticeXP family FPGA offering a non-volatile, reconfigurable logic platform in a 144-pin surface-mount package. It integrates approximately 3,000 logic elements, 55,296 bits of embedded RAM, and 100 user I/Os to address compact system designs that require instant-on operation and flexible I/O support.

Designed for industrial-grade applications, this device supports a wide supply range (1.71 V to 3.465 V) and an operating temperature range of −40 °C to 100 °C, making it suitable for embedded control, interface bridging, and communication endpoint functions where robustness and reconfigurability are required.

Key Features

  • Core Logic Approximately 3,000 logic elements organized across 384 configurable logic blocks (CLBs) for implementing control, glue-logic and mid-density processing functions.
  • On-chip Memory 55,296 total RAM bits (approximately 54 Kbits of embedded block RAM) plus support for distributed RAM resources to store lookup tables, FIFOs and small data buffers.
  • I/O Density & Flexibility 100 user I/Os in a 144-pin package provide ample connectivity for sensors, peripherals, and parallel interfaces.
  • Power & Supply Range Operates from 1.71 V to 3.465 V, enabling compatibility with multiple core and I/O voltage domains within a system.
  • Industrial Temperature Grade Rated for −40 °C to 100 °C operation, suitable for industrial environments.
  • Non-Volatile, Instant-On Architecture Family-level capabilities include non-volatile configuration with instant-on behavior and in-field reconfiguration options, enabling rapid startup and secure designs.
  • Clocking Family documentation specifies integrated analog PLLs for clock multiply/divide and phase shifting; the LFXP3 family includes device-level PLL resources to support system timing requirements.
  • Package and Mounting Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20 × 20 mm) for compact board integration.
  • Standards & Compliance RoHS compliant.

Typical Applications

  • Industrial Control — Implement motor control logic, sensor aggregation and deterministic I/O handling within factory and process-control systems using industrial temperature capability and flexible I/O.
  • Interface Bridging — Bridge disparate peripheral interfaces and perform protocol conversion where a compact, reprogrammable logic device is needed.
  • Embedded Communications — Handle endpoint signaling, packet parsing or custom packet filtering in communications modules that require on-chip memory and PLL-based clocking.
  • Instrumentation & Test — Create custom data acquisition front-ends, timing logic, and control sequencing for benchtop or rack-mounted instruments.

Unique Advantages

  • Non-volatile instant-on operation: Eliminates the need for external configuration memory and enables rapid system startup.
  • Reconfigurability in the field: Supports in-system updates and logic changes without replacing hardware, extending product lifetime and enabling iterative feature development.
  • Balanced integration: Combines ~3,000 logic elements, embedded RAM and 100 I/Os in a compact 144-pin package to reduce board area and BOM complexity.
  • Industrial thermal range: Rated −40 °C to 100 °C to meet demanding environmental requirements in industrial deployments.
  • Flexible supply compatibility: Broad voltage support from 1.71 V to 3.465 V allows use with multiple core and I/O voltage domains.
  • RoHS compliance: Meets common environmental requirements for commercial and industrial electronics.

Why Choose LFXP3C-3T144I?

The LFXP3C-3T144I delivers a compact, reconfigurable solution for mid-density logic, interface and embedded memory needs. Its combination of approximately 3,000 logic elements, 55,296 bits of embedded RAM, and 100 I/Os in a 144-pin surface-mount package provides a practical balance of integration and flexibility for industrial and embedded designs.

This part is well-suited for engineers seeking a non-volatile FPGA with instant-on capability, field reconfiguration options and a wide operating voltage and temperature range. The LFXP3 family support and device-level resources help enable scalable designs and straightforward migration within the same FPGA family.

Request a quote or submit a product inquiry to receive pricing, availability and technical support for LFXP3C-3T144I.

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