LFXP3C-3T100C

IC FPGA 62 I/O 100TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP

Quantity 1,734 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O62Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells3000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of LFXP3C-3T100C – XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP

The LFXP3C-3T100C is a non-volatile XP family FPGA from Lattice Semiconductor Corporation featuring 3,000 logic elements, approximately 55 Kbits of on-chip RAM (55,296 bits), and 62 user I/Os in a 100-pin LQFP package. The device targets system designs that need instant-on, reconfigurable logic with flexible I/O and integrated memory resources.

Its architecture combines programmable logic, embedded block RAM and flexible I/O support with features for in-field reconfiguration and system-level integration, making it suitable for cost-sensitive commercial designs that require compact board-level implementation and RoHS compliance.

Key Features

  • Core Logic 3,000 logic elements provide the programmable fabric for implementing custom logic, state machines and glue logic.
  • Embedded Memory Approximately 55 Kbits (55,296 bits) of on-chip RAM for block and distributed memory use.
  • I/O and Package 62 user I/Os in a 100-pin LQFP (100-TQFP, 14 × 14 mm supplier package) with surface-mount mounting.
  • Non-volatile, Instant-on Device family supports non-volatile configuration with instant-on operation and no external configuration memory required.
  • Reconfiguration and Power Modes Supports rapid in-field reconfiguration and a sleep mode for significant static current reduction.
  • Flexible I/O Standards Architecture supports a wide range of interface standards to accommodate diverse system requirements (documented in family datasheet).
  • Clocking On-chip PLL resources (LFXP3 family devices include analog PLLs) for clock multiply/divide and phase shifting.
  • Memory Interface Support Family-level support for dedicated DDR memory interfaces (see datasheet for specific DDR operating points and timing).
  • Power and Supply Wide supply voltage range from 1.71 V to 3.465 V to support multiple logic I/O level configurations.
  • Commercial Temperature Grade Rated for 0 °C to 85 °C operation for commercial applications.
  • Compliance RoHS-compliant manufacturing.
  • System-Level Tools Family-level features include IEEE 1149.1 boundary-scan and internal logic analysis capability for system debug and test.

Typical Applications

  • Embedded Control Implement control logic and glue logic in compact systems where instant-on and non-volatile configuration reduce boot complexity.
  • Interface Bridging Use flexible I/Os and clocking resources to bridge between different logic families or peripheral interfaces on a single board.
  • Memory Interface Support Implement DDR interface logic and timing-critical control blocks where on-chip RAM and PLLs simplify design integration.
  • Consumer and Commercial Electronics Integrate custom feature logic, user interfaces and peripheral control in space-constrained packages while maintaining RoHS compliance.

Unique Advantages

  • Reduced BOM with Non-Volatile Configuration: No external configuration memory is required, simplifying board design and reducing component count.
  • Instant-On System Behavior: Non-volatile architecture enables fast power-up readiness for time-sensitive applications.
  • Flexible Powering Options: Broad supply voltage range (1.71 V–3.465 V) accommodates multiple I/O voltage domains and system power schemes.
  • Integrated Memory and Clocking: Embedded RAM and on-chip PLLs minimize external components for memory buffering and clock management.
  • Compact, Surface-Mount Package: 100-pin LQFP (14 × 14 mm) provides a small footprint for dense PCB layouts while supporting 62 I/Os.
  • Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product designs.

Why Choose LFXP3C-3T100C?

The LFXP3C-3T100C combines a compact package with a non-volatile, reconfigurable FPGA fabric—offering 3,000 logic elements, approximately 55 Kbits of on-chip RAM and 62 I/Os—delivered in a surface-mount 100-LQFP package. Its wide supply voltage range, integrated clocking and memory resources, and instant-on behavior make it well suited to commercial embedded systems that need a balance of integration, flexibility and straightforward board-level implementation.

Designed for developers who require reprogrammable logic without external configuration memory, this device supports in-field updates, system-level debug features and power-saving modes that help simplify design and support long-term product maintenance and scalability within the Lattice XP family.

Request a quote or submit an inquiry to receive pricing and availability for the LFXP3C-3T100C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up