LFXP3C-3T100C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP |
|---|---|
| Quantity | 1,734 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 62 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of LFXP3C-3T100C – XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP
The LFXP3C-3T100C is a non-volatile XP family FPGA from Lattice Semiconductor Corporation featuring 3,000 logic elements, approximately 55 Kbits of on-chip RAM (55,296 bits), and 62 user I/Os in a 100-pin LQFP package. The device targets system designs that need instant-on, reconfigurable logic with flexible I/O and integrated memory resources.
Its architecture combines programmable logic, embedded block RAM and flexible I/O support with features for in-field reconfiguration and system-level integration, making it suitable for cost-sensitive commercial designs that require compact board-level implementation and RoHS compliance.
Key Features
- Core Logic 3,000 logic elements provide the programmable fabric for implementing custom logic, state machines and glue logic.
- Embedded Memory Approximately 55 Kbits (55,296 bits) of on-chip RAM for block and distributed memory use.
- I/O and Package 62 user I/Os in a 100-pin LQFP (100-TQFP, 14 × 14 mm supplier package) with surface-mount mounting.
- Non-volatile, Instant-on Device family supports non-volatile configuration with instant-on operation and no external configuration memory required.
- Reconfiguration and Power Modes Supports rapid in-field reconfiguration and a sleep mode for significant static current reduction.
- Flexible I/O Standards Architecture supports a wide range of interface standards to accommodate diverse system requirements (documented in family datasheet).
- Clocking On-chip PLL resources (LFXP3 family devices include analog PLLs) for clock multiply/divide and phase shifting.
- Memory Interface Support Family-level support for dedicated DDR memory interfaces (see datasheet for specific DDR operating points and timing).
- Power and Supply Wide supply voltage range from 1.71 V to 3.465 V to support multiple logic I/O level configurations.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for commercial applications.
- Compliance RoHS-compliant manufacturing.
- System-Level Tools Family-level features include IEEE 1149.1 boundary-scan and internal logic analysis capability for system debug and test.
Typical Applications
- Embedded Control Implement control logic and glue logic in compact systems where instant-on and non-volatile configuration reduce boot complexity.
- Interface Bridging Use flexible I/Os and clocking resources to bridge between different logic families or peripheral interfaces on a single board.
- Memory Interface Support Implement DDR interface logic and timing-critical control blocks where on-chip RAM and PLLs simplify design integration.
- Consumer and Commercial Electronics Integrate custom feature logic, user interfaces and peripheral control in space-constrained packages while maintaining RoHS compliance.
Unique Advantages
- Reduced BOM with Non-Volatile Configuration: No external configuration memory is required, simplifying board design and reducing component count.
- Instant-On System Behavior: Non-volatile architecture enables fast power-up readiness for time-sensitive applications.
- Flexible Powering Options: Broad supply voltage range (1.71 V–3.465 V) accommodates multiple I/O voltage domains and system power schemes.
- Integrated Memory and Clocking: Embedded RAM and on-chip PLLs minimize external components for memory buffering and clock management.
- Compact, Surface-Mount Package: 100-pin LQFP (14 × 14 mm) provides a small footprint for dense PCB layouts while supporting 62 I/Os.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product designs.
Why Choose LFXP3C-3T100C?
The LFXP3C-3T100C combines a compact package with a non-volatile, reconfigurable FPGA fabric—offering 3,000 logic elements, approximately 55 Kbits of on-chip RAM and 62 I/Os—delivered in a surface-mount 100-LQFP package. Its wide supply voltage range, integrated clocking and memory resources, and instant-on behavior make it well suited to commercial embedded systems that need a balance of integration, flexibility and straightforward board-level implementation.
Designed for developers who require reprogrammable logic without external configuration memory, this device supports in-field updates, system-level debug features and power-saving modes that help simplify design and support long-term product maintenance and scalability within the Lattice XP family.
Request a quote or submit an inquiry to receive pricing and availability for the LFXP3C-3T100C.

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