LFXP3C-3Q208C

The LFXP3C-3Q208C is a non-volatile LatticeXP family FPGA offering approximately 3,000 logic elements, approximately 54 Kbits of on-chip RAM, and 136 I/O pins in a 208-pin BFQFP (28 × 28 mm) surface-mount package. The device combines reconfigurable logic, embedded memory and flexible I/O support in a single integrated solution.

Designed for system-level integration, this commercial-grade FPGA delivers instant-on operation without external configuration memory, field reconfiguration capabilities, and low-power sleep modes—features suited to designers who need secure, reconfigurable logic with compact packaging and a broad supply-voltage range.

Key Features

• Core logic — Approximately 3,000 logic elements providing a compact programmable fabric for custom logic and glue functions.
• Logic array — 384 PFU/PFF units (family-level array structure) that underpin the LFXP3 device architecture.
• Embedded and distributed memory — Approximately 54 Kbits of embedded SRAM (total RAM bits: 55,296) with additional distributed memory resources for flexible data storage and buffering.
• I/O density and standards — 136 user I/Os; sysIO buffer support for a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Clocking and memory interface — On-device PLLs (2 for the LFXP3 family) for clock multiply/divide and phase shifting; dedicated DDR memory support up to DDR333 (166 MHz) is supported at the family level.
• Non-volatile, instant-on operation — Built-in non-volatile configuration enables instant-on behavior and eliminates the need for external configuration memory.
• In-field reconfiguration and security — TransFR™ reconfiguration enables in-field logic updates while the system operates; non-volatile configuration reduces the risk of external bitstream interception.
• Low-power modes — Sleep mode can reduce static current by up to 1000× for power-sensitive designs.
• Power and thermal — Wide supply-voltage support from 1.71 V to 3.465 V; commercial operating temperature range 0 °C to 85 °C.
• Package and mounting — 208-BFQFP (28 × 28 mm) surface-mount package; RoHS compliant and graded for commercial use.

Unique Advantages

• Instant-on, non-volatile configuration: Eliminates external configuration memory and enables immediate startup in microseconds.
• Field-updatable logic: TransFR reconfiguration allows in-system updates to logic while the system continues to operate, reducing maintenance downtime.
• Flexible I/O support: Broad sysIO buffer compatibility simplifies interfacing to multiple voltage domains and high-speed signaling standards.
• On-chip memory and PLLs: Embedded SRAM and device PLLs reduce the need for external memory and clocking components, simplifying BOM and board layout.
• Low-power operation: Sleep mode capability enables significant static current reduction for power-sensitive designs.
• Development ecosystem: Family-level design tools and IP (ispLEVER and ispLeverCORE modules referenced at the family level) support integration and accelerate time-to-market.

Why Choose LFXP3C-3Q208C?

The LFXP3C-3Q208C positions itself as a compact, non-volatile FPGA option for designs that require reconfigurable logic, embedded memory, and a wide set of I/O options in a 208-pin BFQFP package. Its instant-on capability, in-field reconfiguration, and low-power sleep mode make it well suited to cost-sensitive system designs that benefit from secure, reprogrammable logic without external configuration components.

Engineers designing systems with moderate logic density and on-chip memory needs will find the device’s combination of approximately 3,000 logic elements, approximately 54 Kbits of embedded SRAM, 136 I/O pins, and family-level tool and IP support advantageous for reducing BOM complexity and accelerating development.

Request a quote or submit a product inquiry to receive pricing, availability, and further technical assistance for the LFXP3C-3Q208C.