LFXP20E-5FN256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

Quantity 59 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-5FN256C – XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

The LFXP20E-5FN256C is a commercial-grade, non-volatile LatticeXP family FPGA supplied in a 256-ball fpBGA (17 × 17 mm) package with 188 I/O pins. It integrates approximately 20,000 logic elements and on-chip embedded memory to support mid-density programmable logic requirements.

Built for applications that require instant-on, in-field reconfiguration and flexible I/O, this device delivers a balance of integration, reconfigurability and system-level features that address interface bridging, embedded control and memory-interfacing tasks.

Key Features

  • Core Capacity — Approximately 20,000 logic elements to implement medium-complexity logic designs.
  • Embedded Memory — Approximately 0.396 Mbits (405,504 bits) of on-chip RAM for distributed and block memory functions.
  • I/O Flexibility — 188 user I/Os available in a 256-ball fpBGA package to support multiple interfaces and board-level routing.
  • Non-volatile, Instant-on Architecture — Family-level features include non-volatile configuration with instant-on and no requirement for external configuration memory.
  • In-field Reconfiguration & Security — Supports reconfiguration while in-system and architecture-level protections that eliminate external bitstream exposure.
  • Clocking — Family-level support for up to four analog PLLs enables clock multiplication, division and phase adjustments for complex timing needs.
  • Low-power Modes — Family-level sleep mode can dramatically reduce static current for power-sensitive designs.
  • Package & Mounting — 256-FPBGA (17 × 17 mm) surface-mount package suitable for compact board designs.
  • Power & Temperature — Specified supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant for environmentally conscious manufacturing.

Typical Applications

  • Interface Bridging and Protocol Conversion — Use the device's flexible I/O and reconfigurable logic to implement protocol translation and board-level interface logic.
  • Embedded Control and Glue Logic — Implement control state machines, peripheral glue logic and custom accelerators using the device’s 20,000 logic elements and on-chip RAM.
  • Memory Interfaces — Leverage family-level dedicated DDR support and abundant I/Os for designs requiring DDR memory interfacing and buffering.
  • System Configuration and In-field Updates — Non-volatile instant-on behavior and TransFR-style reconfiguration capabilities enable firmware updates and in-field logic changes without external configuration memory.

Unique Advantages

  • Instant-on Non-volatile Architecture: Eliminates the need for external configuration memory and enables rapid system startup.
  • In-field Reconfiguration: Allows logic updates while the system is operating, reducing downtime for firmware and feature upgrades.
  • Rich Embedded Memory: Nearly 0.396 Mbits of on-chip RAM supports data buffering, FIFOs and small embedded storage without external RAM.
  • Comprehensive I/O Count: 188 I/Os in a compact 256-ball fpBGA provide broad connectivity for peripherals, memory and high-speed interfaces.
  • Power-aware Operation: Specified power range and family-level sleep mode enable designs that can optimize static current for lower-power applications.
  • Compact BGA Package: The 17 × 17 mm fpBGA delivers a small board footprint while preserving routing density and thermal performance for commercial applications.

Why Choose LFXP20E-5FN256C?

The LFXP20E-5FN256C positions itself as a versatile, mid-density FPGA option for designers who need a programmable, non-volatile solution with substantial logic capacity, on-chip RAM and a high I/O count in a compact BGA package. Its family-level features—instant-on configuration, in-field reconfiguration, PLL-based clocking and flexible I/O support—align with designs that require fast startup, secure configuration and ongoing feature updates.

This device is suited for commercial embedded systems, communication interfaces and memory-interfacing designs where a balance of integration, reconfigurability and board-space efficiency delivers long-term value through simplified BOM and maintainable firmware-driven updates.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the LFXP20E-5FN256C.

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