LFXP20E-5FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA |
|---|---|
| Quantity | 59 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-5FN256C – XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA
The LFXP20E-5FN256C is a commercial-grade, non-volatile LatticeXP family FPGA supplied in a 256-ball fpBGA (17 × 17 mm) package with 188 I/O pins. It integrates approximately 20,000 logic elements and on-chip embedded memory to support mid-density programmable logic requirements.
Built for applications that require instant-on, in-field reconfiguration and flexible I/O, this device delivers a balance of integration, reconfigurability and system-level features that address interface bridging, embedded control and memory-interfacing tasks.
Key Features
- Core Capacity — Approximately 20,000 logic elements to implement medium-complexity logic designs.
- Embedded Memory — Approximately 0.396 Mbits (405,504 bits) of on-chip RAM for distributed and block memory functions.
- I/O Flexibility — 188 user I/Os available in a 256-ball fpBGA package to support multiple interfaces and board-level routing.
- Non-volatile, Instant-on Architecture — Family-level features include non-volatile configuration with instant-on and no requirement for external configuration memory.
- In-field Reconfiguration & Security — Supports reconfiguration while in-system and architecture-level protections that eliminate external bitstream exposure.
- Clocking — Family-level support for up to four analog PLLs enables clock multiplication, division and phase adjustments for complex timing needs.
- Low-power Modes — Family-level sleep mode can dramatically reduce static current for power-sensitive designs.
- Package & Mounting — 256-FPBGA (17 × 17 mm) surface-mount package suitable for compact board designs.
- Power & Temperature — Specified supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS compliant for environmentally conscious manufacturing.
Typical Applications
- Interface Bridging and Protocol Conversion — Use the device's flexible I/O and reconfigurable logic to implement protocol translation and board-level interface logic.
- Embedded Control and Glue Logic — Implement control state machines, peripheral glue logic and custom accelerators using the device’s 20,000 logic elements and on-chip RAM.
- Memory Interfaces — Leverage family-level dedicated DDR support and abundant I/Os for designs requiring DDR memory interfacing and buffering.
- System Configuration and In-field Updates — Non-volatile instant-on behavior and TransFR-style reconfiguration capabilities enable firmware updates and in-field logic changes without external configuration memory.
Unique Advantages
- Instant-on Non-volatile Architecture: Eliminates the need for external configuration memory and enables rapid system startup.
- In-field Reconfiguration: Allows logic updates while the system is operating, reducing downtime for firmware and feature upgrades.
- Rich Embedded Memory: Nearly 0.396 Mbits of on-chip RAM supports data buffering, FIFOs and small embedded storage without external RAM.
- Comprehensive I/O Count: 188 I/Os in a compact 256-ball fpBGA provide broad connectivity for peripherals, memory and high-speed interfaces.
- Power-aware Operation: Specified power range and family-level sleep mode enable designs that can optimize static current for lower-power applications.
- Compact BGA Package: The 17 × 17 mm fpBGA delivers a small board footprint while preserving routing density and thermal performance for commercial applications.
Why Choose LFXP20E-5FN256C?
The LFXP20E-5FN256C positions itself as a versatile, mid-density FPGA option for designers who need a programmable, non-volatile solution with substantial logic capacity, on-chip RAM and a high I/O count in a compact BGA package. Its family-level features—instant-on configuration, in-field reconfiguration, PLL-based clocking and flexible I/O support—align with designs that require fast startup, secure configuration and ongoing feature updates.
This device is suited for commercial embedded systems, communication interfaces and memory-interfacing designs where a balance of integration, reconfigurability and board-space efficiency delivers long-term value through simplified BOM and maintainable firmware-driven updates.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the LFXP20E-5FN256C.