LFXP20E-4FN484C

The LFXP20E-4FN484C is a non-volatile, reconfigurable FPGA optimized for designs that require high logic density and extensive I/O. Built on the LatticeXP family architecture, the device combines approximately 20,000 logic elements with embedded memory and flexible I/O to address applications requiring instant-on capability, in-field reconfiguration and dense board-level signal integration.

Key value propositions include non-volatile instant-on operation with no external configuration memory, a high I/O count for complex interfaces, and on-chip memory and clocking resources that simplify system design and reduce external component count.

Key Features

• Core Logic  Approximately 20,000 logic elements enable medium-to-high complexity logic integration on a single device.
• Embedded Memory  405,504 total RAM bits (approximately 0.41 Mbits) of on-chip memory for buffering, state storage and local data processing.
• I/O Density  Up to 340 I/O pins provide broad signal connectivity for parallel buses, multi-channel interfaces and board-level aggregation.
• Non-volatile Instant-On  ispXP™ non-volatile technology provides instant-on operation with no external configuration memory and protected configuration streams.
• Reconfiguration & Field Updates  TransFR™ reconfiguration allows in-field logic updates while the system operates; SRAM-based logic can be reconfigured in milliseconds.
• Low-Power Modes  Sleep mode supports significant static current reduction (up to 1000×), helping designs meet low-power standby requirements.
• Clocking  Up to four analog PLLs on-device support flexible clock multiply/divide and phase shifting for complex timing domains.
• Flexible I/O Buffering  Programmable sysIO™ buffers support a wide range of interface standards (including multiple LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS and more) for versatile signal compatibility.
• System-Level Tools  IEEE 1149.1 boundary-scan and ispTRACY™ internal logic analyzer capability provide testability and visibility for debugging and verification.
• Package & Mounting  484-ball BBGA package (484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board integration.
• Power & Thermal  Core supply range specified at 1.14 V to 1.26 V; operating temperature range 0 °C to 85 °C (commercial grade).
• Compliance  RoHS compliant.

Typical Applications

• High-density I/O aggregation  Board-level designs that require many parallel interfaces or signal multiplexing benefit from the device’s 340 I/O pins and flexible I/O standards.
• Embedded control and glue logic  Integrate custom control, protocol conversion and peripheral interfacing using the device’s 20,000 logic elements and on-chip memory.
• Communications and networking modules  Use the device for interface bridging, packet handling and timing domain management leveraging multiple PLLs and programmable I/O.
• Test & measurement and instrumentation  Implement custom data capture, preprocessing and control logic with local memory and instant-on configuration for rapid startup.

Unique Advantages

• Non-volatile instant-on: No external configuration memory required—designs power up quickly and securely without a separate configuration device.
• High I/O capacity: 340 I/Os reduce the need for external multiplexers or additional devices when interfacing many signals.
• In-field reconfiguration: TransFR™ allows live logic updates, enabling field upgrades and feature additions without full system downtime.
• On-chip memory and clocking: Approximately 0.41 Mbits of embedded memory plus up to four PLLs simplify system architecture and lower external BOM.
• Power management flexibility: Sleep mode supports deep static current reduction for energy-sensitive applications.
• Compact, surface-mount packaging: 484-ball FPBGA (23 × 23 mm) provides high density in a manufacturable surface-mount footprint.

Why Choose LFXP20E-4FN484C?

The LFXP20E-4FN484C delivers a balanced combination of logic capacity, embedded memory and high I/O count in a non-volatile FPGA architecture. Its instant-on behavior, in-field reconfiguration capabilities and on-chip clocking and RAM resources make it well suited to designs that need secure, fast startup and flexible system updates without adding configuration memory or extra components.

This device is appropriate for teams building compact, feature-rich embedded systems, communications interfaces, or instrumentation modules that require dense I/O, moderate-to-high logic integration and commercial-temperature operation. Its RoHS compliance, surface-mount 484-BBGA package and integrated test support streamline integration and manufacturability.

Request a quote or submit an inquiry for pricing and availability of the LFXP20E-4FN484C to receive a tailored response from our supply team.