LFXP20E-4FN256I

The LFXP20E-4FN256I is a Lattice Semiconductor LatticeXP family FPGA offering a non-volatile, reconfigurable logic platform with approximately 20,000 logic elements and roughly 405,504 bits of embedded RAM. Packaged in a 256-ball fpBGA (17 × 17 mm) surface-mount package with 188 I/O pins, the device is specified for industrial operation from −40 °C to 100 °C and a core supply range of 1.14 V to 1.26 V.

Designed for applications that require instant-on behavior, in-field reconfiguration and a compact, highly integrated FPGA solution, this device combines memory resources, programmable I/O flexibility and system-level features from the LatticeXP family to simplify board-level design.

Key Features

• Non-volatile, instant-on architecture  Family-level ispXP™ non-volatile technology enables instant-on operation without external configuration memory and protects configuration data from unauthorized read-back.
• In-field reconfiguration  TransFR™ reconfiguration supports updating logic while the system is operating, enabling field upgrades and iterative development.
• Logic capacity  Approximately 20,000 logic elements with 2,464 logic block structures provide substantial gate density for mid-range designs.
• Embedded memory  Approximately 405,504 bits of on-chip RAM (block and distributed memory) for buffers, FIFOs and local data storage.
• Flexible I/O and system interfaces  188 I/O pins in the 256-FPBGA package support diverse interface requirements and system connectivity.
• Clocking and timing  Up to four analog PLLs at the family level enable clock multiply/divide and phase shifting for complex clocking schemes.
• Power and low-power modes  Core supply specified at 1.14 V to 1.26 V; family-level sleep modes enable substantial static current reduction for power-sensitive designs.
• Package and mounting  256-ball fpBGA (17 × 17 mm) surface-mount package provides a compact footprint for space-constrained PCBs and dense layouts.
• Industrial temperature grade  Qualified for operation from −40 °C to 100 °C to meet robust environmental requirements.
• System-level support  Family features include JTAG programming, onboard oscillator options and embedded debug capabilities to streamline bring-up and validation.

Typical Applications

• Industrial control and automation  Custom control logic, sensor interfacing and deterministic I/O handling benefit from the device’s industrial temperature range and high I/O count.
• Embedded systems  Instant-on configuration and on-chip memory make the device suitable for embedded controllers and instrumentation that require rapid startup and local data buffering.
• Communications and networking  Flexible I/O and multiple PLLs support timing and interface requirements for mid-range protocol bridging and packet processing tasks.
• In-field upgradeable systems  TransFR reconfiguration enables remote logic updates and iterative feature deployment without removing devices from the field.

Unique Advantages

• Integrated non-volatile FPGA:  Removes the need for external configuration memory, simplifying BOM and securing configuration data.
• High usable logic and memory density:  Approximately 20,000 logic elements and ~405,504 bits of embedded RAM consolidate functionality that would otherwise require multiple discrete components.
• Field reconfigurability:  In-field reconfiguration capability supports product upgrades and design evolution without hardware changes.
• Compact, high-I/O package:  256-FPBGA (17 × 17 mm) provides a balance of pin count and PCB area for compact system designs.
• Industrial robustness:  Specified for −40 °C to 100 °C operation and RoHS compliant for deployment in demanding environments.
• System bring-up and debug support:  Family-level JTAG and onboard debug features reduce development time and simplify diagnostics.

Why Choose LFXP20E-4FN256I?

The LFXP20E-4FN256I delivers a mid-range FPGA option within the LatticeXP family that balances logic capacity, on-chip memory and I/O flexibility in a compact fpBGA package. Its non-volatile instant-on architecture and in-field reconfiguration features reduce system complexity and support secure, updatable designs.

This device is well suited for engineering teams building industrial, embedded and communications equipment that require reliable operation across an extended temperature range, compact board footprint and the ability to evolve functionality in the field. The combination of integrated memory, PLL-based clocking and extensive I/O helps shorten system-level design cycles and reduces external component count.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the LFXP20E-4FN256I.