LFXP20E-4FN388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA |
|---|---|
| Quantity | 1,912 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-4FN388C – XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA
The LFXP20E-4FN388C is a non-volatile LatticeXP family FPGA in a 388-ball FBGA package, offering approximately 20,000 logic elements, 405,504 bits of on-chip RAM, and 268 general-purpose I/Os. Built for reconfigurable embedded designs, it delivers instant-on capability, in-field reconfiguration and a compact surface-mount 23 × 23 mm package for designs that require moderate logic density, significant embedded memory and flexible I/O.
On-package features include up to four PLLs, a range of programmable I/O standards and sleep-mode power reduction, making this device suitable for applications that need fast boot, field updates and configurable high-speed interfaces while remaining RoHS-compliant.
Key Features
- Core Capacity Approximately 20,000 logic elements with 2,464 logic resources for implementing medium-complexity logic and control functions.
- Embedded Memory Total on-chip RAM of 405,504 bits (approximately 0.41 Mbits) providing a mix of embedded block RAM and distributed memory for buffers, FIFOs and state storage.
- I/O and Interface Flexibility 268 I/Os in a 388-ball fpBGA offering support for a wide range of programmable I/O standards as described in the LatticeXP family documentation, enabling diverse parallel and serial interface implementations.
- Clocking Up to four analog PLLs per device for clock multiplication, division and phase shifting to support local clocking requirements.
- Non-volatile, Reconfigurable Architecture Instant-on operation with no external configuration memory required; in-system and in-field reconfiguration capabilities allow design updates without external storage.
- Low-Power Modes Sleep mode can reduce static current substantially to support energy-conscious system designs.
- Package & Mounting 388-BBGA (388-FPBGA, 23 × 23 mm) surface-mount package for compact board layouts and high I/O density.
- Power & Thermal Specified supply voltage range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
- Compliance RoHS-compliant manufacturing.
Typical Applications
- Memory Interface and Buffering Use the device's embedded RAM and dedicated DDR memory support to implement local memory controllers, buffers and interface logic.
- Field-Updatable Embedded Systems Instant-on and TransFR reconfiguration enable in-field logic updates and rapid boot for systems requiring ongoing feature upgrades.
- High-Speed I/O Bridging High I/O count and programmable I/O standards support protocol translation, parallel/serial bridging and custom interface implementations.
- Low-Power Control Nodes Sleep mode and low static-current operation make the device suitable for power-sensitive control and monitoring nodes.
Unique Advantages
- Instant-on Non-volatile Operation: Eliminates the need for external configuration memory and enables immediate functionality after power-up.
- Field Reconfiguration (TransFR): Allows updates to device logic while the system remains operational, reducing downtime and enabling in-field feature rollouts.
- Balanced Integration: Combines ~20k logic elements with ~0.41 Mbits of embedded RAM and 268 I/Os in a compact 23 × 23 mm FBGA to reduce board area and part count.
- Flexible Clocking: Up to four PLLs support complex clocking schemes for multi-domain and high-speed designs.
- Power Management: Sleep mode offers substantial static-current reduction for energy-efficient designs.
- Vendor Tool and IP Support: The LatticeXP family is documented with device-level tools and IP modules to accelerate development and migration across densities.
Why Choose LFXP20E-4FN388C?
The LFXP20E-4FN388C positions itself as a flexible, non-volatile FPGA option for designers who need instant-on behavior, in-field reconfiguration and a balance of logic, memory and I/O density in a compact surface-mount package. Its mix of approximately 20,000 logic elements, roughly 0.41 Mbits of embedded RAM and 268 I/Os supports a wide range of embedded and interface-centric designs.
With programmable I/O standards, multiple PLLs and power-saving modes, this device is well suited to customers building reconfigurable control, interface and memory-centric systems that require fast boot, field updates and RoHS-compliant components backed by Lattice documentation and development resources.
If you would like pricing, availability or to request a quote for the LFXP20E-4FN388C, submit an inquiry or request a quote and our team will respond with details and procurement options.