LFXP20E-4FN388C

IC FPGA 268 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA

Quantity 1,912 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case388-BBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-4FN388C – XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA

The LFXP20E-4FN388C is a non-volatile LatticeXP family FPGA in a 388-ball FBGA package, offering approximately 20,000 logic elements, 405,504 bits of on-chip RAM, and 268 general-purpose I/Os. Built for reconfigurable embedded designs, it delivers instant-on capability, in-field reconfiguration and a compact surface-mount 23 × 23 mm package for designs that require moderate logic density, significant embedded memory and flexible I/O.

On-package features include up to four PLLs, a range of programmable I/O standards and sleep-mode power reduction, making this device suitable for applications that need fast boot, field updates and configurable high-speed interfaces while remaining RoHS-compliant.

Key Features

  • Core Capacity  Approximately 20,000 logic elements with 2,464 logic resources for implementing medium-complexity logic and control functions.
  • Embedded Memory  Total on-chip RAM of 405,504 bits (approximately 0.41 Mbits) providing a mix of embedded block RAM and distributed memory for buffers, FIFOs and state storage.
  • I/O and Interface Flexibility  268 I/Os in a 388-ball fpBGA offering support for a wide range of programmable I/O standards as described in the LatticeXP family documentation, enabling diverse parallel and serial interface implementations.
  • Clocking  Up to four analog PLLs per device for clock multiplication, division and phase shifting to support local clocking requirements.
  • Non-volatile, Reconfigurable Architecture  Instant-on operation with no external configuration memory required; in-system and in-field reconfiguration capabilities allow design updates without external storage.
  • Low-Power Modes  Sleep mode can reduce static current substantially to support energy-conscious system designs.
  • Package & Mounting  388-BBGA (388-FPBGA, 23 × 23 mm) surface-mount package for compact board layouts and high I/O density.
  • Power & Thermal  Specified supply voltage range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS-compliant manufacturing.

Typical Applications

  • Memory Interface and Buffering  Use the device's embedded RAM and dedicated DDR memory support to implement local memory controllers, buffers and interface logic.
  • Field-Updatable Embedded Systems  Instant-on and TransFR reconfiguration enable in-field logic updates and rapid boot for systems requiring ongoing feature upgrades.
  • High-Speed I/O Bridging  High I/O count and programmable I/O standards support protocol translation, parallel/serial bridging and custom interface implementations.
  • Low-Power Control Nodes  Sleep mode and low static-current operation make the device suitable for power-sensitive control and monitoring nodes.

Unique Advantages

  • Instant-on Non-volatile Operation: Eliminates the need for external configuration memory and enables immediate functionality after power-up.
  • Field Reconfiguration (TransFR): Allows updates to device logic while the system remains operational, reducing downtime and enabling in-field feature rollouts.
  • Balanced Integration: Combines ~20k logic elements with ~0.41 Mbits of embedded RAM and 268 I/Os in a compact 23 × 23 mm FBGA to reduce board area and part count.
  • Flexible Clocking: Up to four PLLs support complex clocking schemes for multi-domain and high-speed designs.
  • Power Management: Sleep mode offers substantial static-current reduction for energy-efficient designs.
  • Vendor Tool and IP Support: The LatticeXP family is documented with device-level tools and IP modules to accelerate development and migration across densities.

Why Choose LFXP20E-4FN388C?

The LFXP20E-4FN388C positions itself as a flexible, non-volatile FPGA option for designers who need instant-on behavior, in-field reconfiguration and a balance of logic, memory and I/O density in a compact surface-mount package. Its mix of approximately 20,000 logic elements, roughly 0.41 Mbits of embedded RAM and 268 I/Os supports a wide range of embedded and interface-centric designs.

With programmable I/O standards, multiple PLLs and power-saving modes, this device is well suited to customers building reconfigurable control, interface and memory-centric systems that require fast boot, field updates and RoHS-compliant components backed by Lattice documentation and development resources.

If you would like pricing, availability or to request a quote for the LFXP20E-4FN388C, submit an inquiry or request a quote and our team will respond with details and procurement options.

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