LFXP20E-4F484I

IC FPGA 340 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA

Quantity 933 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O340Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-4F484I – XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA

The LFXP20E-4F484I is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs designed for industrial applications. This device integrates 20,000 logic elements with approximately 0.405 Mbits of embedded memory and up to 340 I/Os in a 484-ball FPBGA (23 × 23 mm) package. It targets system designs that require instant-on capability, flexible I/O support and in-field reconfiguration.

Key Features

  • Core Capacity — 20,000 logic elements (cells) and 2,464 logic block units, providing a substantial fabric for complex logic implementations.
  • Embedded Memory — 405,504 total RAM bits (approximately 0.405 Mbits) of combined embedded and distributed memory to support buffering, packet processing and data storage.
  • I/O Density — Up to 340 I/Os supported in the 484-ball package, enabling high-pin-count interfaces and board-level connectivity.
  • Non‑volatile, Instant-On Architecture — Family-level features include non-volatile configuration with instant-on behavior and no requirement for external configuration memory.
  • In-Field Reconfiguration — TransFR™ reconfiguration capability allows updates to SRAM-based logic in-system while the device operates.
  • Flexible I/O Standards — Family support for a wide range of I/O standards (including LVDS, LVCMOS, SSTL, HSTL and others) provides interface flexibility for mixed-signal and high-speed designs.
  • Dedicated Memory Interfaces — Family-level support for DDR memory interfaces (up to DDR333) to simplify integration with external DRAM where needed.
  • Clocking — Up to four analog PLLs per device for clock multiply/divide and phase shifting to meet diverse timing requirements.
  • Power and Temperature — Supported supply range 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.
  • Package — 484-FPBGA (23 × 23 mm) surface-mount package for compact, high-density board designs; RoHS compliant.

Typical Applications

  • Industrial Control — Implement deterministic control logic, sensor interfacing and I/O aggregation in industrial automation equipment operating across −40 °C to 100 °C.
  • Communications and Networking — High I/O count and embedded memory support protocol bridging, packet buffering and custom interface logic for communication endpoints.
  • Memory Interface and Buffering — Use the device’s DDR memory support and on-chip RAM for temporary storage, data stream handling and interface adaptation.
  • In-Field Upgrades — Systems that require remote or in-system logic updates benefit from TransFR™ reconfiguration and non-volatile instant-on behavior.

Unique Advantages

  • Non-volatile instant-on operation: Eliminates the need for external configuration memory and enables rapid power-up without configuration delays.
  • In-field reconfiguration capability: TransFR™ lets you update SRAM-based logic while the system is running, reducing maintenance windows and enabling iterative feature deployment.
  • High integration in a compact package: 20,000 logic elements, substantial embedded RAM and 340 I/Os in a 23 × 23 mm FPBGA reduce board-level component count and simplify system design.
  • Flexible clocking and memory support: Up to four PLLs and dedicated DDR interface support provide the timing and external memory connectivity needed for data-intensive designs.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh environments and a wide range of embedded systems.
  • Standards and I/O versatility: Family-level support for numerous I/O standards enables broad interoperability with legacy and modern interfaces.

Why Choose LFXP20E-4F484I?

The LFXP20E-4F484I combines a high logic count, sizable on-chip memory and a very high I/O density within a compact 484-FPBGA package, making it suitable for industrial-grade embedded systems that require reconfigurability and fast start-up. Its non-volatile architecture, in-field reconfiguration and flexible clocking/memory features provide practical value for designs that must evolve post-deployment or demand rapid initialization.

This device is best suited for engineers and system designers seeking a robust, integrated FPGA solution for industrial control, communications bridging, memory interfacing and other applications where reliability, configurability and I/O capacity are key considerations.

Request a quote or submit an inquiry to receive pricing and availability for LFXP20E-4F484I and to discuss volume or design-in support.

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