LFXP20E-4F484I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 933 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-4F484I – XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA
The LFXP20E-4F484I is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs designed for industrial applications. This device integrates 20,000 logic elements with approximately 0.405 Mbits of embedded memory and up to 340 I/Os in a 484-ball FPBGA (23 × 23 mm) package. It targets system designs that require instant-on capability, flexible I/O support and in-field reconfiguration.
Key Features
- Core Capacity — 20,000 logic elements (cells) and 2,464 logic block units, providing a substantial fabric for complex logic implementations.
- Embedded Memory — 405,504 total RAM bits (approximately 0.405 Mbits) of combined embedded and distributed memory to support buffering, packet processing and data storage.
- I/O Density — Up to 340 I/Os supported in the 484-ball package, enabling high-pin-count interfaces and board-level connectivity.
- Non‑volatile, Instant-On Architecture — Family-level features include non-volatile configuration with instant-on behavior and no requirement for external configuration memory.
- In-Field Reconfiguration — TransFR™ reconfiguration capability allows updates to SRAM-based logic in-system while the device operates.
- Flexible I/O Standards — Family support for a wide range of I/O standards (including LVDS, LVCMOS, SSTL, HSTL and others) provides interface flexibility for mixed-signal and high-speed designs.
- Dedicated Memory Interfaces — Family-level support for DDR memory interfaces (up to DDR333) to simplify integration with external DRAM where needed.
- Clocking — Up to four analog PLLs per device for clock multiply/divide and phase shifting to meet diverse timing requirements.
- Power and Temperature — Supported supply range 1.14 V to 1.26 V and industrial operating temperature range of −40 °C to 100 °C.
- Package — 484-FPBGA (23 × 23 mm) surface-mount package for compact, high-density board designs; RoHS compliant.
Typical Applications
- Industrial Control — Implement deterministic control logic, sensor interfacing and I/O aggregation in industrial automation equipment operating across −40 °C to 100 °C.
- Communications and Networking — High I/O count and embedded memory support protocol bridging, packet buffering and custom interface logic for communication endpoints.
- Memory Interface and Buffering — Use the device’s DDR memory support and on-chip RAM for temporary storage, data stream handling and interface adaptation.
- In-Field Upgrades — Systems that require remote or in-system logic updates benefit from TransFR™ reconfiguration and non-volatile instant-on behavior.
Unique Advantages
- Non-volatile instant-on operation: Eliminates the need for external configuration memory and enables rapid power-up without configuration delays.
- In-field reconfiguration capability: TransFR™ lets you update SRAM-based logic while the system is running, reducing maintenance windows and enabling iterative feature deployment.
- High integration in a compact package: 20,000 logic elements, substantial embedded RAM and 340 I/Os in a 23 × 23 mm FPBGA reduce board-level component count and simplify system design.
- Flexible clocking and memory support: Up to four PLLs and dedicated DDR interface support provide the timing and external memory connectivity needed for data-intensive designs.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh environments and a wide range of embedded systems.
- Standards and I/O versatility: Family-level support for numerous I/O standards enables broad interoperability with legacy and modern interfaces.
Why Choose LFXP20E-4F484I?
The LFXP20E-4F484I combines a high logic count, sizable on-chip memory and a very high I/O density within a compact 484-FPBGA package, making it suitable for industrial-grade embedded systems that require reconfigurability and fast start-up. Its non-volatile architecture, in-field reconfiguration and flexible clocking/memory features provide practical value for designs that must evolve post-deployment or demand rapid initialization.
This device is best suited for engineers and system designers seeking a robust, integrated FPGA solution for industrial control, communications bridging, memory interfacing and other applications where reliability, configurability and I/O capacity are key considerations.
Request a quote or submit an inquiry to receive pricing and availability for LFXP20E-4F484I and to discuss volume or design-in support.

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