LFXP20E-3FN484I

IC FPGA 340 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA

Quantity 1,124 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O340Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-3FN484I – XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA

The LFXP20E-3FN484I is a non-volatile FPGA offering a high-density programmable fabric with 20,000 logic elements and approximately 405,504 bits of on-chip RAM. Designed for industrial applications, this device combines instant-on reconfigurability, extensive I/O, and embedded memory in a compact 484-ball BGA (23 × 23 mm) package.

Typical uses include embedded systems and high‑I/O platforms where fast configuration, in-field updates and flexible interface support are required. The device’s operating range and package make it suitable for robust designs that demand sustained operation from −40 °C to 100 °C.

Key Features

  • Non-volatile, instant-on architecture  Powers up quickly without external configuration memory and supports secure, reconfigurable operation.
  • Reconfiguration and in-field updates  Supports SRM reconfiguration and TransFR™ in-field logic updates for system maintenance and feature upgrades while running.
  • Logic capacity  Provides 20,000 logic elements to implement complex digital functions and custom control logic.
  • Embedded memory  Approximately 405,504 bits (≈396 Kbits) of on-chip RAM, combining distributed and block RAM resources for data buffering and state storage.
  • High I/O density  Up to 340 programmable I/O pins to support wide-ranging peripheral and memory interfaces.
  • Flexible I/O standards  Programmable sysIO™ buffers support multiple standards documented for the family, enabling various single‑ended and differential interfaces.
  • Clocking and memory interfaces  Up to four analog PLLs and dedicated DDR memory support are provided on the LatticeXP family for clock management and high-speed memory interfacing.
  • Low-voltage core operation  Specified supply range of 1.14 V to 1.26 V for core operation, enabling low-voltage system designs.
  • Industrial temperature range  Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
  • Compact, surface-mount package  484-ball BBGA (23 × 23 mm) with a 484-FPBGA supplier package footprint for dense board-level integration.

Typical Applications

  • Embedded control systems  Implement custom control logic and state machines using 20,000 logic elements and on-chip RAM for buffering and configuration.
  • High‑I/O interface hubs  Leverage up to 340 I/Os and programmable I/O standards to connect sensors, peripherals and external memory devices.
  • Memory interface and buffering  Use the device’s embedded RAM and dedicated DDR memory support for system memory interfaces, data staging and throughput smoothing.
  • Field-updatable systems  Deploy designs that require in-field updates and rapid reconfiguration without external configuration storage.

Unique Advantages

  • Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables rapid system startup.
  • High integration in a compact package: Combines 20,000 logic elements, substantial on-chip RAM and up to 340 I/Os in a 484-BBGA footprint to reduce BOM and board area.
  • Robust thermal performance: Industrial temperature rating (−40 °C to 100 °C) supports deployment in harsh environments.
  • Low-voltage core: Core supply specified at 1.14 V to 1.26 V supports modern low-voltage system architectures.
  • Flexible clocking and memory support: Multiple PLLs and family-documented DDR support enable precise clock management and high-speed memory interfacing.
  • In-field reconfiguration capability: TransFR™ reconfiguration and programmable ROM/SRAM options allow updates and secure design management in deployed systems.

Why Choose LFXP20E-3FN484I?

The LFXP20E-3FN484I delivers a balance of density, I/O flexibility and non-volatile, instant-on operation tailored for industrial embedded designs. With 20,000 logic elements, approximately 405,504 bits of embedded RAM and support for multiple programmable I/O standards, it addresses system designs that require significant logic resources and versatile interfacing while maintaining compact board footprint.

Built on the LatticeXP family architecture, the device benefits from in-field reconfiguration, on-device PLLs and the ecosystem tools and IP documented for the series—enabling scalable development, secure configuration and long-term deployment support for complex embedded applications.

Request a quote or submit an inquiry to receive pricing and availability for LFXP20E-3FN484I and to discuss how this FPGA can fit your next design.

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