LFXP20E-3FN484I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 1,124 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-3FN484I – XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA
The LFXP20E-3FN484I is a non-volatile FPGA offering a high-density programmable fabric with 20,000 logic elements and approximately 405,504 bits of on-chip RAM. Designed for industrial applications, this device combines instant-on reconfigurability, extensive I/O, and embedded memory in a compact 484-ball BGA (23 × 23 mm) package.
Typical uses include embedded systems and high‑I/O platforms where fast configuration, in-field updates and flexible interface support are required. The device’s operating range and package make it suitable for robust designs that demand sustained operation from −40 °C to 100 °C.
Key Features
- Non-volatile, instant-on architecture Powers up quickly without external configuration memory and supports secure, reconfigurable operation.
- Reconfiguration and in-field updates Supports SRM reconfiguration and TransFR™ in-field logic updates for system maintenance and feature upgrades while running.
- Logic capacity Provides 20,000 logic elements to implement complex digital functions and custom control logic.
- Embedded memory Approximately 405,504 bits (≈396 Kbits) of on-chip RAM, combining distributed and block RAM resources for data buffering and state storage.
- High I/O density Up to 340 programmable I/O pins to support wide-ranging peripheral and memory interfaces.
- Flexible I/O standards Programmable sysIO™ buffers support multiple standards documented for the family, enabling various single‑ended and differential interfaces.
- Clocking and memory interfaces Up to four analog PLLs and dedicated DDR memory support are provided on the LatticeXP family for clock management and high-speed memory interfacing.
- Low-voltage core operation Specified supply range of 1.14 V to 1.26 V for core operation, enabling low-voltage system designs.
- Industrial temperature range Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
- Compact, surface-mount package 484-ball BBGA (23 × 23 mm) with a 484-FPBGA supplier package footprint for dense board-level integration.
Typical Applications
- Embedded control systems Implement custom control logic and state machines using 20,000 logic elements and on-chip RAM for buffering and configuration.
- High‑I/O interface hubs Leverage up to 340 I/Os and programmable I/O standards to connect sensors, peripherals and external memory devices.
- Memory interface and buffering Use the device’s embedded RAM and dedicated DDR memory support for system memory interfaces, data staging and throughput smoothing.
- Field-updatable systems Deploy designs that require in-field updates and rapid reconfiguration without external configuration storage.
Unique Advantages
- Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables rapid system startup.
- High integration in a compact package: Combines 20,000 logic elements, substantial on-chip RAM and up to 340 I/Os in a 484-BBGA footprint to reduce BOM and board area.
- Robust thermal performance: Industrial temperature rating (−40 °C to 100 °C) supports deployment in harsh environments.
- Low-voltage core: Core supply specified at 1.14 V to 1.26 V supports modern low-voltage system architectures.
- Flexible clocking and memory support: Multiple PLLs and family-documented DDR support enable precise clock management and high-speed memory interfacing.
- In-field reconfiguration capability: TransFR™ reconfiguration and programmable ROM/SRAM options allow updates and secure design management in deployed systems.
Why Choose LFXP20E-3FN484I?
The LFXP20E-3FN484I delivers a balance of density, I/O flexibility and non-volatile, instant-on operation tailored for industrial embedded designs. With 20,000 logic elements, approximately 405,504 bits of embedded RAM and support for multiple programmable I/O standards, it addresses system designs that require significant logic resources and versatile interfacing while maintaining compact board footprint.
Built on the LatticeXP family architecture, the device benefits from in-field reconfiguration, on-device PLLs and the ecosystem tools and IP documented for the series—enabling scalable development, secure configuration and long-term deployment support for complex embedded applications.
Request a quote or submit an inquiry to receive pricing and availability for LFXP20E-3FN484I and to discuss how this FPGA can fit your next design.

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