LFXP20E-4FN256C

The LFXP20E-4FN256C is a non-volatile LatticeXP family FPGA in a 256-ball fpBGA (17×17 mm) surface-mount package, offering 20,000 logic elements and 188 user I/Os. It targets system-level designs that require instant-on behavior, flexible I/O, and embedded memory resources within a commercial-temperature, low-voltage footprint.

Built on Lattice's ispXP technology, the device provides on-chip non-volatile configuration, rapid reconfiguration capabilities and design-security benefits while supporting a range of I/O standards and dedicated memory interfaces.

Key Features

• Core Capacity  Approximately 20,000 logic elements for implementing medium-density logic and control functions.
• Embedded Memory  Total on-chip RAM of 405,504 bits (approximately 0.406 Mbits) supporting distributed and block memory use.
• I/O Density and Flexibility  188 user I/Os in a 256-ball fpBGA (17×17 mm) package with programmable sysIO buffer support for a wide range of interface standards.
• Non-volatile, Instant-on Architecture  ispXP-based non-volatile configuration eliminates the need for external configuration memory and enables rapid power-up.
• Reconfiguration and In-field Updates  Supports fast SRAM reconfiguration and TransFR™ in-field logic updates for system upgrades without external memory.
• Clocking and Memory Interface  Up to four analog PLLs and dedicated DDR memory support for implementing high-performance memory interfaces.
• Power and Packaging  Low-voltage operation with supply range specified from 1.14 V to 1.26 V, surface-mount 256-FPBGA packaging for compact system integration.
• Operating Range and Compliance  Commercial operating temperature from 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Memory interface controllers  Implement DDR interfaces and memory controllers using the device’s dedicated DDR support and multiple PLLs.
• Protocol bridging and I/O aggregation  Aggregate and translate between diverse I/O standards leveraging 188 programmable I/Os and flexible sysIO buffers.
• Embedded system controllers  Integrate control logic and on-chip memory for compact embedded designs that benefit from instant-on configuration.
• Field-updatable logic  Deploy in systems that require in-field updates or rapid reconfiguration using TransFR and SRAM reconfiguration features.

Unique Advantages

• Non-volatile instant-on: On-chip configuration removes the need for external configuration memory and provides rapid power-up behavior.
• Compact, high-density I/O: 188 I/Os in a 256-ball fpBGA enable dense connectivity while keeping PCB footprint small.
• Balanced compute and memory: 20,000 logic elements together with approximately 0.406 Mbits of embedded RAM support mixed logic and data buffering tasks.
• Flexible clocking and DDR support: Multiple PLLs and dedicated DDR memory capability simplify implementation of high-speed interfaces.
• Commercial-ready and RoHS compliant: Designed for 0 °C to 85 °C operation and meets RoHS requirements for modern electronic products.
• Reduced system BOM: Non-volatile configuration and integrated memory reduce the need for external configuration/storage components.

Why Choose LFXP20E-4FN256C?

The LFXP20E-4FN256C combines a 20k-logic-element FPGA core, substantial on-chip RAM, and 188 flexible I/Os in a compact 256-FPBGA package—providing a balanced platform for designs that need instant-on configuration, field reprogrammability, and robust I/O support. Its low-voltage supply range and commercial temperature rating suit a wide range of embedded and system-level applications.

Supported by Lattice development flows and pre-designed IP modules referenced in the family documentation, this device is suited to engineers and product teams seeking an integrated, reconfigurable solution with predictable thermal and electrical characteristics for production designs.

Request a quote or submit an inquiry for pricing and availability for the LFXP20E-4FN256C.