LFXP20E-4F484C

IC FPGA 340 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA

Quantity 1,252 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O340Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-4F484C – XP FPGA, 20K Logic Elements, 340 I/O, 484‑BBGA

The LFXP20E-4F484C is a non-volatile XP family Field Programmable Gate Array (FPGA) from Lattice Semiconductor, offering a high-density, reconfigurable logic fabric with on-chip memory and extensive I/O. It targets systems that require instant-on behavior, flexible interfacing and in-field reconfiguration while maintaining a compact 484‑ball BGA footprint.

With 20,000 logic elements and 340 I/Os in a 484-BBGA package, this device is suited for designs that need significant routing and memory resources, programmable I/O standards, and system-level features such as PLLs and internal configuration options.

Key Features

  • Core and Logic  20,000 logic elements and 2,464 PFU/PFF units provide the programmable resources required for complex logic implementations.
  • On‑chip Memory  Approximately 0.405 Mbits of total on-chip RAM, backed by distributed memory and embedded SRAM block resources.
  • High‑Density I/O  Up to 340 I/Os with a programmable sysIO buffer supporting a wide range of standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS.
  • Configuration and Security  Non‑volatile, instant-on architecture with no external configuration memory required and design security that prevents bitstream interception.
  • In‑field Reconfiguration  TransFR™ Reconfiguration (TFR) enables reconfiguration of SRAM‑based logic while the system remains operational for flexible field updates.
  • Low‑Power Modes  Sleep mode support enables substantial static current reduction (up to 1000× reduction under sleep), helping reduce standby power.
  • Clocking  Up to four analog PLLs on the device for clock multiply, divide and phase shifting to support varied timing domains.
  • Memory Interface Support  Dedicated DDR memory support (up to DDR333/166 MHz) for designs that require external high‑speed memory interfaces.
  • Package and Mounting  484‑BBGA package (supplier package: 484‑FPBGA, 23×23 mm) with surface‑mount installation for compact, high‑I/O density PCB layouts.
  • Operating Range and Compliance  Commercial grade device with operating temperature 0 °C to 85 °C, core voltage supply 1.14 V to 1.26 V, and RoHS compliance.
  • System Level Tools  IEEE 1149.1 boundary scan, ispTRACY internal logic analyzer capability and onboard oscillator options for configuration and debug.

Typical Applications

  • Instant‑on embedded systems  Systems that require immediate availability on power‑up benefit from the device’s non‑volatile instant‑on architecture and lack of external configuration memory.
  • Memory interface controllers  Designs implementing external DDR memory can use the dedicated DDR support (up to DDR333) and on‑chip PLLs for timing management.
  • High‑I/O signal processing  Applications needing a large number of I/Os and mixed signaling standards (LVDS, PCI, SSTL, HSTL, etc.) can use the programmable sysIO buffers for protocol flexibility.
  • Field‑upgradeable logic  Products requiring in-field updates while operating can leverage TransFR™ reconfiguration to update logic without full system downtime.

Unique Advantages

  • Non‑volatile instant‑on: Powers up in microseconds without external configuration memory, simplifying system startup and reducing component count.
  • High integration: 20,000 logic elements with substantial embedded RAM consolidate logic and memory, lowering PCB BOM and board area.
  • Flexible I/O standards: Programmable sysIO supports a broad set of interface standards, enabling multi‑protocol designs from a single device.
  • In‑field reconfiguration: TransFR™ capability allows live updates to SRAM‑based logic for maintenance and feature upgrades in deployed systems.
  • Low standby power: Sleep mode can reduce static current by up to 1000×, helping meet low‑power system requirements.
  • Compact, high‑I/O package: 484‑ball BGA (23×23 mm) delivers maximum I/O density for space‑constrained PCBs.

Why Choose LFXP20E-4F484C?

The LFXP20E-4F484C delivers a balanced combination of high logic density, abundant I/O and on‑chip memory in a compact 484‑BBGA package. Its non‑volatile architecture and in‑field reconfiguration capabilities make it well suited to products that require rapid startup, secure configuration and the ability to evolve features after deployment.

This device is aimed at engineers and product teams building embedded systems that need programmable interfacing, dedicated DDR support and flexible clocking, while retaining options for low‑power standby and board‑level integration. The LatticeXP family features and system‑level support features provide a clear upgrade path and development ecosystem for scalable designs.

Request a quote or submit an inquiry to obtain pricing, availability and support for integrating the LFXP20E-4F484C into your next design.

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