LFXP20E-3FN388I

The LFXP20E-3FN388I from Lattice Semiconductor Corporation is a non‑volatile XP family FPGA offering 20,000 logic elements and 268 configurable I/Os in a 388‑ball BGA package. Built on the LatticeXP architecture, this device combines instant‑on non‑volatile configuration, reconfigurable SRAM‑based logic and embedded memory to support system‑level and industrial applications requiring fast startup, in‑field updates and flexible I/O.

Key hardware characteristics include approximately 0.41 Mbits of on‑chip RAM (405,504 total RAM bits), a compact 388‑BBGA (23×23 mm) package, operation across -40 °C to 100 °C, and a core supply range of 1.14 V to 1.26 V—making it suitable for industrial‑grade embedded systems and communications interfaces.

Key Features

• Core Capacity: 20,000 logic elements for implementing medium‑to‑large combinational and sequential logic networks.
• Embedded Memory: Approximately 0.41 Mbits of on‑chip RAM (405,504 bits) including distributed and block memory resources for data buffering and state storage.
• I/O and Interface Flexibility: 268 I/Os in a 388‑BBGA package to support diverse bus and peripheral connections; flexible I/O buffers and standards support are part of the LatticeXP family architecture.
• Non‑volatile Instant‑On: Family‑level non‑volatile configuration eliminates the need for external configuration memory and enables power‑up in microseconds.
• In‑Field Reconfiguration: Supports TransFR™ reconfiguration and rapid SRAM reprogramming to update logic while the system is operating.
• Power Management: Sleep mode capability (family feature) offers substantial static current reduction for low‑power standby.
• Clocking: Up to four analog PLLs per device (LFXP20 family) provide multiply/divide and phase‑shift capabilities for system clocking.
• Package and Thermal: 388‑ball FBGA (23×23 mm) supplier device package with industrial temperature grading from -40 °C to 100 °C.
• Industry Compliance: RoHS‑compliant device construction.

Typical Applications

• Industrial Control: Implement custom control logic, sensor interfacing and deterministic I/O handling in industrial equipment using industrial temperature range and large I/O counts.
• Embedded Systems: Integrate processing glue logic, state machines and memory buffering in compact embedded platforms with instant‑on configuration.
• Communications and Interfaces: Build protocol bridges, transceivers and DDR interface logic using flexible I/O and on‑chip memory resources.
• Field‑Updatable Systems: Enable in‑field logic updates and rapid feature deployment using TransFR reconfiguration and SRAM update capability.

Unique Advantages

• Instant non‑volatile configuration: Eliminates external configuration memory and enables microsecond‑scale power‑up for faster system availability.
• High integration density: 20,000 logic elements and ~0.41 Mbits of embedded RAM reduce external component count and simplify board design.
• Large, flexible I/O set: 268 I/Os in a 388‑BBGA package allow broad connectivity to peripherals, sensors and high‑speed interfaces.
• Designed for in‑field updates: TransFR and rapid SRAM reprogramming enable live system updates without full downtime.
• Industrial temperature range: Rated for -40 °C to 100 °C to support deployment in demanding environmental conditions.
• Controlled supply domain: Narrow core supply range (1.14 V to 1.26 V) for predictable power management and compatibility with defined system rails.

Why Choose LFXP20E-3FN388I?

The LFXP20E-3FN388I brings LatticeXP family capabilities—non‑volatile instant‑on configuration, in‑field reconfiguration and a balance of density and embedded memory—into a single industrial‑grade FPGA package. Its 20,000 logic elements, substantial on‑chip RAM and 268 I/Os make it well suited for embedded, industrial and communication system designs that require fast startup, flexible interfaces and the ability to update logic in the field.

Engineers and procurement teams seeking a scalable, reconfigurable solution with industrial temperature support and a compact 388‑BBGA footprint will find the LFXP20E‑3FN388I aligns with mid‑range FPGA needs while leveraging the LatticeXP architecture and system‑level features.

Request a quote or submit a procurement enquiry to receive pricing, availability and lead‑time information for the LFXP20E-3FN388I.