LFXP20E-3FN256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

Quantity 1,273 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20E-3FN256C – XP Field Programmable Gate Array (FPGA), 20k Logic Elements, 256‑BGA

The LFXP20E-3FN256C is a commercial-grade, non-volatile FPGA device in a 256-ball fpBGA (17×17 mm) package. Built on the LatticeXP family architecture, the device combines reconfigurable logic, embedded memory and flexible I/O to support system-level functions that require instant-on behavior, in-field updates and a compact footprint.

With 20,000 logic elements, approximately 0.41 Mbits of on-chip RAM and 188 I/Os, this device targets designs that need abundant logic and memory resources in a surface-mount 256‑FPBGA package while operating within a 1.14–1.26 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

  • Core Logic  20,000 logic elements (cells) and an architecture aligned with the LatticeXP family for reconfigurable system implementation.
  • Embedded Memory  Approximately 0.41 Mbits of total on-chip RAM to support distributed and block memory usage in logic designs.
  • I/O Capacity & Flexibility  188 I/O pins on the 256-ball fpBGA package to support diverse interface requirements and board-level connectivity.
  • Non‑volatile, Instant‑on Architecture  Family-level capability for non-volatile configuration and instant-on operation (no external configuration memory required).
  • Reconfiguration & In-field Updates  Support for fast reconfiguration and in-system updates consistent with the LatticeXP family’s TransFR reconfiguration features.
  • Clocking  Up to four analog PLLs per device (family-level specification) to enable clock multiply, divide and phase shifting in system designs.
  • Power and Sleep  Operates from a 1.14 V to 1.26 V supply; family-level sleep mode capability enables significant static current reduction for low-power states.
  • Package & Mounting  Supplier device package: 256-FPBGA (17×17 mm); mounting type: surface mount for compact PCB integration.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C.
  • RoHS Compliance  Device is RoHS compliant.

Typical Applications

  • Memory interface and control  Use the device’s embedded memory resources and dedicated DDR support at the family level to implement memory controllers and buffering logic.
  • Flexible I/O bridging  Leverage the 188 I/Os and family-level programmable sysIO buffer support to bridge and translate between disparate interface standards.
  • Instant-on system control  Non-volatile architecture enables fast start-up and immediate availability for control and boot-critical logic.
  • In-field feature updates  Support for TransFR reconfiguration allows logic updates while the system remains operational, enabling field upgrades and iterative feature deployment.

Unique Advantages

  • Highly integrated logic and memory: Combines 20,000 logic elements with approximately 0.41 Mbits of on-chip RAM to implement complex logic and buffering without large external resources.
  • Instant-on non-volatile configuration: Eliminates the need for external configuration memory and enables rapid system start-up.
  • In-field reconfiguration capability: Supports live updates to SRAM-based logic, reducing service downtime and enabling iterative enhancements.
  • Robust clocking options: Up to four analog PLLs (family-level) allow flexible clock management for timing-sensitive designs.
  • Compact surface-mount package: 256-FPBGA (17×17 mm) offers high I/O density and a small board footprint for space-constrained applications.
  • Commercial-grade reliability and compliance: RoHS compliant and specified for 0 °C to 85 °C operation to meet standard commercial application requirements.

Why Choose LFXP20E-3FN256C?

The LFXP20E-3FN256C provides a balanced combination of reconfigurable logic density, embedded memory and I/O capacity in a compact 256‑FPBGA package. Its non-volatile architecture and family-level features for instant-on and in-field reconfiguration make it well suited to designs that require rapid boot, field updates and a reduced need for external configuration components.

This device is appropriate for engineers and teams building commercial embedded systems that demand a mix of logic resources, flexible interfacing and power-aware operation within a standard commercial temperature range.

If you would like pricing, availability or to submit a quote request for the LFXP20E-3FN256C, please request a quote or contact sales for further assistance.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up