LFXP20E-3FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA |
|---|---|
| Quantity | 1,273 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20E-3FN256C – XP Field Programmable Gate Array (FPGA), 20k Logic Elements, 256‑BGA
The LFXP20E-3FN256C is a commercial-grade, non-volatile FPGA device in a 256-ball fpBGA (17×17 mm) package. Built on the LatticeXP family architecture, the device combines reconfigurable logic, embedded memory and flexible I/O to support system-level functions that require instant-on behavior, in-field updates and a compact footprint.
With 20,000 logic elements, approximately 0.41 Mbits of on-chip RAM and 188 I/Os, this device targets designs that need abundant logic and memory resources in a surface-mount 256‑FPBGA package while operating within a 1.14–1.26 V supply range and a 0 °C to 85 °C commercial temperature window.
Key Features
- Core Logic 20,000 logic elements (cells) and an architecture aligned with the LatticeXP family for reconfigurable system implementation.
- Embedded Memory Approximately 0.41 Mbits of total on-chip RAM to support distributed and block memory usage in logic designs.
- I/O Capacity & Flexibility 188 I/O pins on the 256-ball fpBGA package to support diverse interface requirements and board-level connectivity.
- Non‑volatile, Instant‑on Architecture Family-level capability for non-volatile configuration and instant-on operation (no external configuration memory required).
- Reconfiguration & In-field Updates Support for fast reconfiguration and in-system updates consistent with the LatticeXP family’s TransFR reconfiguration features.
- Clocking Up to four analog PLLs per device (family-level specification) to enable clock multiply, divide and phase shifting in system designs.
- Power and Sleep Operates from a 1.14 V to 1.26 V supply; family-level sleep mode capability enables significant static current reduction for low-power states.
- Package & Mounting Supplier device package: 256-FPBGA (17×17 mm); mounting type: surface mount for compact PCB integration.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C.
- RoHS Compliance Device is RoHS compliant.
Typical Applications
- Memory interface and control Use the device’s embedded memory resources and dedicated DDR support at the family level to implement memory controllers and buffering logic.
- Flexible I/O bridging Leverage the 188 I/Os and family-level programmable sysIO buffer support to bridge and translate between disparate interface standards.
- Instant-on system control Non-volatile architecture enables fast start-up and immediate availability for control and boot-critical logic.
- In-field feature updates Support for TransFR reconfiguration allows logic updates while the system remains operational, enabling field upgrades and iterative feature deployment.
Unique Advantages
- Highly integrated logic and memory: Combines 20,000 logic elements with approximately 0.41 Mbits of on-chip RAM to implement complex logic and buffering without large external resources.
- Instant-on non-volatile configuration: Eliminates the need for external configuration memory and enables rapid system start-up.
- In-field reconfiguration capability: Supports live updates to SRAM-based logic, reducing service downtime and enabling iterative enhancements.
- Robust clocking options: Up to four analog PLLs (family-level) allow flexible clock management for timing-sensitive designs.
- Compact surface-mount package: 256-FPBGA (17×17 mm) offers high I/O density and a small board footprint for space-constrained applications.
- Commercial-grade reliability and compliance: RoHS compliant and specified for 0 °C to 85 °C operation to meet standard commercial application requirements.
Why Choose LFXP20E-3FN256C?
The LFXP20E-3FN256C provides a balanced combination of reconfigurable logic density, embedded memory and I/O capacity in a compact 256‑FPBGA package. Its non-volatile architecture and family-level features for instant-on and in-field reconfiguration make it well suited to designs that require rapid boot, field updates and a reduced need for external configuration components.
This device is appropriate for engineers and teams building commercial embedded systems that demand a mix of logic resources, flexible interfacing and power-aware operation within a standard commercial temperature range.
If you would like pricing, availability or to submit a quote request for the LFXP20E-3FN256C, please request a quote or contact sales for further assistance.