LFXP20C-5FN484C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 461 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20C-5FN484C – XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA
The LFXP20C-5FN484C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for programmable digital logic implementations. It provides 20,000 logic elements, 340 user I/O pins, and 405,504 bits of on-chip RAM for embedded memory requirements.
Packaged in a 484-ball BGA (484-FPBGA, 23×23) and offered as a surface-mount device, this commercial-grade FPGA operates from a 1.71 V to 3.465 V supply range and across a 0 °C to 85 °C temperature range, making it suitable for a wide range of commercial electronic designs.
Key Features
- Core Logic 20,000 logic elements provide substantial programmable logic capacity for implementing custom digital functions and control logic.
- Embedded Memory 405,504 bits of on-chip RAM (approximately 0.406 Mbits) for local data buffering, state storage, and intermediate processing.
- High I/O Count 340 user I/O pins to support dense external connectivity and multiple parallel interfaces.
- Package and Mounting 484-ball BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
- Flexible Power Wide supply voltage range from 1.71 V to 3.465 V to accommodate various system power architectures.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operating temperature for typical commercial electronics environments.
- RoHS Compliant Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.
Typical Applications
- Custom Digital Logic and Prototyping — Implement and iterate custom state machines, glue logic, and specialized digital functions using the device's 20,000 logic elements.
- High I/O Interface Control — Manage multiple parallel interfaces and peripheral connections with 340 available I/O pins.
- On-chip Data Buffering — Use the 405,504 bits of embedded RAM for frame buffers, FIFOs, and temporary data storage in embedded systems.
- Compact Board Designs — Leverage the 484-ball BGA package for space-constrained PCBs requiring surface-mount FPGA integration.
Unique Advantages
- Substantial Logic Capacity: 20,000 logic elements enable implementation of complex custom logic without external programmable devices.
- Significant I/O Availability: 340 I/O pins reduce the need for external I/O expanders and simplify board-level connectivity.
- Embedded Memory On-Chip: 405,504 bits of RAM provide local buffering and storage to streamline data paths and reduce external memory dependencies.
- Flexible Power Range: Operates from 1.71 V to 3.465 V to fit a variety of system power domains and design preferences.
- Compact BGA Footprint: 484-ball FPBGA (23×23) offers a dense package for integrating FPGA capability in compact designs.
- Commercial-grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lifecycles.
Why Choose LFXP20C-5FN484C?
The LFXP20C-5FN484C positions itself as a versatile FPGA choice for commercial electronic designs that require a balance of logic capacity, on-chip memory, and high I/O density in a compact BGA package. Its broad supply voltage range and surface-mount 484-FPBGA footprint make it straightforward to integrate into modern PCB layouts.
This device is well suited for engineers and product teams implementing custom digital logic, I/O-intensive controllers, and embedded designs where on-chip memory and a sizable number of I/Os reduce system complexity and BOM counts.
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