LFXP20C-5F484C

The LFXP20C-5F484C is a commercial-grade, non-volatile FPGA that combines on-chip logic, embedded memory and extensive I/O in a single surface-mount 484-ball BGA package (23 × 23 mm). With 20,000 logic elements and approximately 0.405 Mbits of on-chip RAM, this device targets applications that require high I/O density, reconfigurable logic and integrated memory resources.

Built around the Lattice XP architecture, the device offers instant-on, in-field reconfiguration and flexible I/O support. Typical use cases include embedded systems, high-density interface bridging and designs that benefit from instant configuration and low system BOM.

Key Features

• Logic Capacity – 20,000 logic elements (cells) to implement medium-complexity logic, state machines and glue logic.
• On-chip Memory – Total of 405,504 bits of embedded RAM, providing approximately 0.405 Mbits of usable on-chip storage for buffers, FIFOs and small datasets.
• High I/O Count – Up to 340 user I/Os to support wide parallel buses, multi-channel interfaces and dense connector systems.
• Non-volatile, Reconfigurable Architecture – Instant-on operation with no external configuration memory required; supports in-system and JTAG reprogramming and fast reconfiguration of SRAM-based logic.
• Flexible I/O Standards – Programmable I/O buffer architecture supports a wide range of interfaces including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and related differential standards.
• Dedicated Memory and DDR Support – Embedded block RAM and distributed RAM resources plus dedicated DDR memory interface capability (up to DDR333 / 166 MHz).
• Clocking – Up to four analog PLLs for clock multiplication, division and phase shifting to support complex timing requirements.
• Power and Thermal – Supply range specified from 1.71 V to 3.465 V and commercial operating temperature from 0 °C to 85 °C; surface-mount 484-BBGA package (484-FPBGA 23 × 23 mm).
• Low-power Modes – Supported sleep mode for significant static current reduction during idle or standby operation.
• RoHS Compliant – Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Embedded Systems – Implement system glue logic, protocol bridging and control functions with on-chip RAM and plentiful I/O.
• Memory Interface and Buffering – Use the device’s embedded RAM and DDR interface capability to implement memory controllers, buffering and data-path logic.
• High-density I/O Platforms – Leverage 340 I/Os and programmable I/O standards for multi-channel sensor aggregation, display interfaces or connector-rich designs.
• Field Upgradeable Products – Instant-on and in-system reconfiguration enable in-field updates and fast feature rollouts without external configuration memory.

Unique Advantages

• Instant-on Non-volatile Operation: Eliminates the need for external configuration memory and provides immediate power-up availability for time-sensitive systems.
• High Integration: Combines 20,000 logic elements with approximately 0.405 Mbits of embedded RAM and up to four PLLs, reducing external components and board complexity.
• Extensive I/O Flexibility: 340 I/Os and programmable sysIO buffers support a wide range of single-ended and differential standards, simplifying interface design.
• Field Reconfigurability: Supports in-system reprogramming and rapid SRAM reconfiguration for fast updates and feature evolution in deployed systems.
• Power Management: Sleep mode enables significant static current reduction for power-sensitive applications.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to match typical commercial deployments and assembly processes.

Why Choose LFXP20C-5F484C?

The LFXP20C-5F484C positions itself as a practical choice for designers who need a non-volatile, reconfigurable FPGA with substantial logic capacity, abundant I/O and integrated memory resources in a compact 23 × 23 mm BGA footprint. Its instant-on capability, in-field reconfiguration and programmable I/O make it suitable for embedded and interface-heavy designs where reducing external components and fast deployment matter.

Supported by vendor design tools and IP resources, this device offers a balance of performance, integration and development support for teams building commercial-temperature systems that require flexible logic, on-chip memory and a wide range of interface options.

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