LFXP20C-4FN484I

The LFXP20C-4FN484I is a non-volatile XP family Field Programmable Gate Array (FPGA) in a 484‑ball BGA package. It combines reconfigurable logic, embedded memory and flexible I/O to support system-level designs that require instant-on configuration, in-field reconfiguration and high I/O density.

Targeted at industrial embedded applications, this device delivers 20,000 logic elements, extensive on‑chip memory and up to 340 I/Os in a 23 × 23 mm package, enabling compact, highly integrated system implementations.

Key Features

• Core Logic — Approximately 20,000 logic elements with 2,464 logic blocks (PFU/PFF total), enabling complex combinational and sequential logic integration.
• Embedded Memory — Approximately 0.41 Mbits of on-chip RAM (405,504 total bits) for distributed and block memory requirements.
• High‑Density I/O — Up to 340 I/Os to support wide external connectivity and high pin-count systems.
• Flexible I/O Standards — Programmable I/O buffer support for a broad range of interfaces including multiple LVCMOS voltages, LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS (as supported by the LatticeXP family).
• Dedicated Memory Interface — Built‑in support for dedicated DDR memory interfaces (device family support up to DDR333 as specified in the series datasheet).
• Clocking — Up to 4 analog PLLs per device for clock multiply/divide and phase shifting.
• Non‑volatile, Instant‑On Architecture — FPGA architecture supports non‑volatile configuration and instant-on capability without external configuration memory (LatticeXP family characteristic).
• In‑field Reconfiguration & Low‑Power Modes — Supports field reconfiguration (TransFR) and sleep modes for substantial static current reduction (family-level features).
• Power & Supply Range — Operates across a broad supply range of 1.71 V to 3.465 V to accommodate multi‑rail system designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C.
• Package & Mounting — 484‑BBGA (484‑FPBGA, 23 × 23 mm) surface‑mount package suitable for compact system boards; RoHS compliant.

Typical Applications

• Industrial Embedded Systems — Compact, high‑I/O processing for industrial controllers and instrumentation where extended temperature range and reliability are required.
• System Interface & Bridge Functions — Protocol bridging and high‑density I/O interfacing using the device’s flexible I/O standards and large I/O count.
• Memory Interface & Buffering — Dedicated DDR interface support and on‑chip memory make the device suitable for memory controllers, buffering and data‑path implementations.
• Field‑Upgradeable Logic — In‑field reconfiguration capability enables system updates and feature additions without external configuration storage.

Unique Advantages

• Instant‑on, Non‑volatile Configuration: Eliminates the need for external configuration memory, simplifying BOM and system boot sequencing.
• High Integration in a Compact Package: 20,000 logic elements and up to 340 I/Os in a 23 × 23 mm FPBGA reduce board area and simplify layout for dense designs.
• Flexible I/O and Memory Support: Programmable I/O standards and embedded RAM provide broad interface and buffering options without external logic.
• Field Reconfiguration and Low‑Power Modes: Supports in‑field logic updates and sleep mode to reduce static current when full functionality is not required.
• Industrial Temperature Range: Specified −40 °C to 100 °C for deployment in industrial environments.
• Vendor Tool and IP Ecosystem: Series‑level support includes synthesis and IP integration tools to accelerate design implementation and migration within the family.

Why Choose LFXP20C-4FN484I?

The LFXP20C-4FN484I positions itself as a highly integrated, non‑volatile FPGA option for industrial embedded systems that require instant-on behavior, flexible I/O and the ability to update logic in the field. Its combination of 20,000 logic elements, substantial on‑chip RAM and up to 340 I/Os in a 484‑ball FPBGA helps shrink system footprint while retaining design flexibility.

Engineers seeking scalable FPGA resources with industrial temperature capability and a broad supply voltage window will find this device suitable for a range of interface, control and memory‑centric designs. The device leverages family‑level tooling and IP to help compress development timelines and support design migration within the LatticeXP family.

Request a quote or submit your configuration requirements to start procurement or inquiry for the LFXP20C-4FN484I. Our team can provide pricing, availability and technical support information to help integrate this FPGA into your design.