LFXP20C-4FN256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

Quantity 593 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20C-4FN256C – XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

The LFXP20C-4FN256C is a non-volatile LatticeXP family FPGA offering 20,000 logic elements and approximately 396 Kbits (405,504 bits) of on-chip RAM in a 256-ball fpBGA (17 × 17 mm) package. Designed for commercial-grade systems, it delivers instant-on operation without external configuration memory and a broad voltage supply range for flexible board-level integration.

Its feature set — including up to 188 I/O pins, programmable I/O standards, multiple PLLs and in-field reconfiguration — makes this device suited for embedded systems, memory interface logic and other applications that require reconfigurable logic with compact package integration and reduced BOM.

Key Features

  • Core Logic — 20,000 logic elements provide a sizable fabric for implementing complex combinational and sequential logic.
  • On‑chip Memory — Approximately 396 Kbits (405,504 bits) of embedded RAM, delivered as block and distributed memory resources for data buffering and state storage.
  • I/O and Package — 188 I/O pins in a 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package, suitable for compact board layouts and high-density routing.
  • Voltage and Temperature — Flexible supply range from 1.71 V to 3.465 V and a commercial operating temperature range of 0 °C to 85 °C.
  • Non‑volatile, Instant‑On Architecture — ispXP non-volatile technology eliminates the need for external configuration memory and enables power-up in microseconds.
  • In-field Reconfiguration (TransFR™) — Supports in-system logic updates with the ability to reconfigure SRAM-based logic in milliseconds while the system operates.
  • Low‑Power Mode — Sleep mode capability for significant static current reduction (up to 1000× as described in family documentation), useful for power-sensitive designs.
  • Clocking — Up to four analog PLLs for clock multiply/divide and phase shifting to support various timing architectures.
  • Flexible I/O Standards — Programmable sysIO buffer supports LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS interfaces as documented for the family.
  • Memory Interface Support — Implements interfaces up to DDR333 (166 MHz) for dedicated DDR memory connectivity, per family specifications.
  • Compliance — RoHS compliant and supplied in a surface-mount package for standard SMT assembly.

Typical Applications

  • Embedded Systems — Implement board-level control, protocol handling and custom logic functions that benefit from instant-on and reconfigurability.
  • Memory Interface and Bridging — Use the device’s DDR support and multiple PLLs to implement memory controllers, buffers and timing-critical interfaces.
  • High‑Density I/O and Interface Conversion — Leverage 188 I/Os and programmable I/O standards for signal bridging, level translation and mixed signaling on compact PCBs.
  • In‑field Upgradable Logic — Apply TransFR reconfiguration to deliver firmware-like updates and feature additions without removing the board from the system.

Unique Advantages

  • Non‑volatile, instant-on operation: Eliminates external configuration memory and enables immediate startup in microseconds, simplifying system boot behavior.
  • Substantial logic and memory in a small package: 20,000 logic elements and approximately 396 Kbits of embedded memory in a 17 × 17 mm fpBGA reduce board area and BOM complexity.
  • Flexible interfacing: Programmable I/O standards and 188 I/Os support a wide range of signaling families for versatile system integration.
  • Field reprogrammability: In-field reconfiguration (TFR) and JTAG/system configuration ports allow updates and security without external bitstreams.
  • Power management options: Sleep mode provides substantial static current reduction for power-conscious designs.

Why Choose LFXP20C-4FN256C?

The LFXP20C-4FN256C positions itself as a compact, non-volatile FPGA option for commercial embedded designs that require a balance of logic density, on-chip memory and flexible I/O. Its instant-on capability, in-field reconfiguration and programmable I/O make it suitable for systems that need rapid startup, secure configuration and adaptable interfaces.

For developers and procurement teams building board-level logic, memory interfaces or reconfigurable subsystems, this device offers scalability within the LatticeXP family and proven toolchain support referenced in the family documentation, helping reduce integration risk and accelerate time-to-market.

Request a quote or submit a sales inquiry today to discuss availability, lead times and volume pricing for the LFXP20C-4FN256C.

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