LFXP20C-4F484C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 155 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20C-4F484C – XP Field Programmable Gate Array (FPGA), 20,000 logic elements, 340 I/Os
The LFXP20C-4F484C is a non-volatile FPGA from Lattice Semiconductor’s LatticeXP family, delivering a mid‑density, reconfigurable logic fabric for embedded system designs. It combines approximately 20,000 logic elements with high I/O density and on‑chip memory to support applications that require instant-on behavior, flexible I/O standards and in-field reconfiguration.
Packaged in a 484‑ball BGA (23 × 23 mm) and optimized for surface-mount assembly, this commercial‑grade device targets systems where integration, flexible interfacing and low-power modes are important design considerations.
Key Features
- Logic Capacity — Approximately 20,000 logic elements to implement medium-complexity designs.
- On‑chip Memory — Total on-chip RAM of 405,504 bits (approximately 0.406 Mbits) for embedded and distributed memory needs.
- I/O Density — 340 user I/Os to support rich peripheral and bus interfacing from a single device.
- Non‑volatile, Instant‑on Architecture — LatticeXP family non‑volatile technology provides instant-on operation and no external configuration memory requirement.
- In-field Reconfiguration & Low Power — Support for TransFR™ (in-field logic updates) and a Sleep Mode that enables large static current reduction for power-sensitive applications.
- Flexible I/O Standards — Family-level I/O buffer support for a wide range of interfaces and signaling standards to enable versatile board-level connectivity.
- Clocking Resources — Multiple analog PLLs (up to four per device as specified for the family) to support clock multiply/divide and phase shifting.
- Package & Mounting — 484‑BBGA (supplier package 484‑FPBGA, 23 × 23 mm), surface mount footprint for compact, high-density designs.
- Supply & Temperature — Operating supply range from 1.71 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- Embedded Systems — Implement application logic, glue logic and system control with instant-on capability and on-chip memory for fast startup and secure configuration.
- Communications & Networking — Leverage high I/O count and flexible I/O standards for protocol bridging, interface conversion and mid-range packet processing tasks.
- Consumer Electronics — Use for user interface control, media and peripheral interfacing where compact BGA packaging and low-power modes are beneficial.
- Test & Measurement — Apply programmable logic and multiple PLLs to implement custom timing, data capture and preprocessing functions in measurement equipment.
Unique Advantages
- Instant‑on, non‑volatile operation: Eliminates the need for external configuration memory and enables rapid system boot.
- High interface density: 340 I/Os reduce the need for multiple devices or complex board routing when connecting to peripherals and buses.
- On‑chip memory resources: Approximately 0.406 Mbits of embedded RAM support buffering, state storage and local data processing without external memory.
- In‑field reconfiguration: TransFR capability (family feature) enables updates to logic while the system is running, simplifying maintenance and feature upgrades.
- Flexible power and clocking: Broad supply range and multiple PLLs provide design flexibility for mixed-voltage systems and complex clocking requirements.
- Compact BGA footprint: 484‑ball BGA (23 × 23 mm) offers a high-pin-count packaging option for space-constrained, high-function boards.
Why Choose LFXP20C-4F484C?
The LFXP20C-4F484C balances logic capacity, embedded memory and high I/O density in a non‑volatile FPGA targeted at mid‑complexity system designs. Its instant-on capability, support for in-field reconfiguration and flexible I/O make it well suited for embedded systems, communications equipment and consumer devices that demand fast startup, adaptable interfaces and compact packaging.
Choosing this device provides a scalable platform with on-chip resources and multiple clocking options, enabling tighter integration, reduced BOM and simplified board-level design while maintaining commercial-grade operating conditions and RoHS compliance.
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