LFXP20C-4F484C

IC FPGA 340 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA

Quantity 155 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O340Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20C-4F484C – XP Field Programmable Gate Array (FPGA), 20,000 logic elements, 340 I/Os

The LFXP20C-4F484C is a non-volatile FPGA from Lattice Semiconductor’s LatticeXP family, delivering a mid‑density, reconfigurable logic fabric for embedded system designs. It combines approximately 20,000 logic elements with high I/O density and on‑chip memory to support applications that require instant-on behavior, flexible I/O standards and in-field reconfiguration.

Packaged in a 484‑ball BGA (23 × 23 mm) and optimized for surface-mount assembly, this commercial‑grade device targets systems where integration, flexible interfacing and low-power modes are important design considerations.

Key Features

  • Logic Capacity — Approximately 20,000 logic elements to implement medium-complexity designs.
  • On‑chip Memory — Total on-chip RAM of 405,504 bits (approximately 0.406 Mbits) for embedded and distributed memory needs.
  • I/O Density — 340 user I/Os to support rich peripheral and bus interfacing from a single device.
  • Non‑volatile, Instant‑on Architecture — LatticeXP family non‑volatile technology provides instant-on operation and no external configuration memory requirement.
  • In-field Reconfiguration & Low Power — Support for TransFR™ (in-field logic updates) and a Sleep Mode that enables large static current reduction for power-sensitive applications.
  • Flexible I/O Standards — Family-level I/O buffer support for a wide range of interfaces and signaling standards to enable versatile board-level connectivity.
  • Clocking Resources — Multiple analog PLLs (up to four per device as specified for the family) to support clock multiply/divide and phase shifting.
  • Package & Mounting — 484‑BBGA (supplier package 484‑FPBGA, 23 × 23 mm), surface mount footprint for compact, high-density designs.
  • Supply & Temperature — Operating supply range from 1.71 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Embedded Systems — Implement application logic, glue logic and system control with instant-on capability and on-chip memory for fast startup and secure configuration.
  • Communications & Networking — Leverage high I/O count and flexible I/O standards for protocol bridging, interface conversion and mid-range packet processing tasks.
  • Consumer Electronics — Use for user interface control, media and peripheral interfacing where compact BGA packaging and low-power modes are beneficial.
  • Test & Measurement — Apply programmable logic and multiple PLLs to implement custom timing, data capture and preprocessing functions in measurement equipment.

Unique Advantages

  • Instant‑on, non‑volatile operation: Eliminates the need for external configuration memory and enables rapid system boot.
  • High interface density: 340 I/Os reduce the need for multiple devices or complex board routing when connecting to peripherals and buses.
  • On‑chip memory resources: Approximately 0.406 Mbits of embedded RAM support buffering, state storage and local data processing without external memory.
  • In‑field reconfiguration: TransFR capability (family feature) enables updates to logic while the system is running, simplifying maintenance and feature upgrades.
  • Flexible power and clocking: Broad supply range and multiple PLLs provide design flexibility for mixed-voltage systems and complex clocking requirements.
  • Compact BGA footprint: 484‑ball BGA (23 × 23 mm) offers a high-pin-count packaging option for space-constrained, high-function boards.

Why Choose LFXP20C-4F484C?

The LFXP20C-4F484C balances logic capacity, embedded memory and high I/O density in a non‑volatile FPGA targeted at mid‑complexity system designs. Its instant-on capability, support for in-field reconfiguration and flexible I/O make it well suited for embedded systems, communications equipment and consumer devices that demand fast startup, adaptable interfaces and compact packaging.

Choosing this device provides a scalable platform with on-chip resources and multiple clocking options, enabling tighter integration, reduced BOM and simplified board-level design while maintaining commercial-grade operating conditions and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability for the LFXP20C-4F484C.

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