LFXP20C-4F484I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 940 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20C-4F484I – XP Field Programmable Gate Array, 20,000 logic elements, 340 I/Os, 484-BBGA
The LFXP20C-4F484I is a non-volatile LatticeXP family FPGA from Lattice Semiconductor, offering an array of programmable logic, embedded memory and a high-density I/O complement in a 484-ball BGA package. Designed for industrial applications, the device delivers instant-on operation, in-field reconfiguration and flexible I/O support to address embedded system, communications and I/O‑rich design requirements.
Key Features
- Core Logic Approximately 20,000 logic elements arranged across a programmable fabric to implement custom logic, state machines and glue functions.
- Embedded Memory Approximately 405,504 bits (396 Kbits) of on-chip RAM for distributed and block memory resources to support FIFOs, buffers and local storage.
- High‑Density I/O Up to 340 I/O pins with a programmable sysIO™ buffer supporting multiple standards including LVCMOS, LVTTL, LVDS and several SSTL/HSTL classes for flexible system interfacing.
- Non‑volatile, Instant‑On Architecture ispXP™ non‑volatile technology eliminates the need for external configuration memory and provides microsecond‑scale power‑up with secure bitstream handling.
- In‑Field Reconfiguration TransFR™ reconfiguration enables logic updates while the system remains operational; SRAM-based regions can be reprogrammed in milliseconds.
- Clocking and Memory Interfaces Up to four analog PLLs for clock multiply/divide and phase shifting, and dedicated DDR interface support up to DDR333 (166 MHz) for memory subsystem integration.
- Power and Sleep Modes Supports a wide supply range (1.71 V to 3.465 V) and includes a sleep mode for significant static current reduction.
- Industrial Grade Package and Temperature Surface-mount 484-BBGA (484-FPBGA, 23 × 23 mm) package, rated for industrial operation from −40 °C to 100 °C and RoHS compliant.
- System Support IEEE 1149.1 boundary scan, on-chip oscillator for configuration and support for in-system logic analysis and ispLEVER tool flow for design implementation.
Typical Applications
- Industrial Control Implement motor control interfaces, sensor aggregation and deterministic logic functions that benefit from industrial temperature range and instant-on behavior.
- Communications and Networking High I/O count and DDR memory support make the device suitable for packet buffering, protocol bridging and interface adaptation.
- Embedded Systems Use as a highly integrated logic and I/O hub for embedded platforms where non‑volatile configuration and in-field updates simplify system maintenance.
- Interface and Glue Logic Leverage flexible I/O standards and abundant logic resources to consolidate board-level glue, bus bridging and custom interface conversions.
Unique Advantages
- Instant‑on non‑volatile FPGA: Eliminates external configuration memory and enables microsecond startup for faster system availability.
- In‑field reconfiguration (TransFR™): Update and modify logic while the system is running, reducing downtime and enabling field upgrades.
- High I/O density: Up to 340 I/Os and programmable buffers support a wide range of interface standards, reducing the need for external interface chips.
- Integrated memory resources: Approximately 396 Kbits of on‑chip RAM provides local storage for buffering and state, simplifying board design.
- Robust industrial operation: Wide voltage supply range and −40 °C to 100 °C rating support demanding industrial environments.
- Comprehensive system tools: Support for boundary scan, onboard oscillator and the ispLEVER toolchain for design implementation and debug.
Why Choose LFXP20C-4F484I?
The LFXP20C-4F484I combines non‑volatile instant‑on operation, in‑field reconfiguration and a high I/O count in a compact 484‑BBGA package, making it a strong choice for industrial and embedded designs that require rapid startup, secure configuration and flexible interfacing. With substantial on‑chip memory and multiple PLLs, it supports complex timing and buffering needs while reducing external component count.
Engineers seeking scalable FPGA resources in industrial temperature ranges will find the LFXP20C-4F484I suited to applications where reliability, configurability and a rich I/O feature set are essential. The device is supported by Lattice design tools and IP to accelerate development and deployment.
Request a quote or submit a sales inquiry to evaluate LFXP20C-4F484I for your next design and get pricing, availability and technical support information.