LFXP20C-4F256I

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA

Quantity 423 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20C-4F256I – XP Field Programmable Gate Array (FPGA), 20,000 logic elements, 256‑BGA

The LFXP20C-4F256I is a non-volatile, infinitely reconfigurable FPGA from the LatticeXP family, offering instant-on operation without external configuration memory. It combines approximately 20,000 logic elements, on-chip embedded memory, and a flexible I/O fabric in a 256-ball fpBGA (17 × 17 mm) package targeted at industrial applications.

Designed for systems that require secure configuration, in-field updates and a range of interface options, this device supports a wide operating voltage range (1.71 V to 3.465 V) and an industrial operating temperature range (‑40 °C to 100 °C), with 188 available I/Os.

Key Features

  • Core density — Approximately 20,000 logic elements to implement moderate- to high-density logic functions.
  • Embedded memory — Approximately 405,504 bits (≈0.405 Mbits) of on-chip RAM for distributed and block memory usage.
  • Flexible I/O — 188 I/Os with programmable sysIO buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and other interface standards as supported by the LatticeXP family.
  • Non‑volatile, instant-on configuration — Internal non-volatile configuration eliminates the need for external configuration memory and enables rapid power-up.
  • In-field reconfiguration — TransFR™ reconfiguration for updating SRAM-based logic while the system operates; reconfiguration and programming supported via system configuration and JTAG ports.
  • Low-power modes — Sleep mode available for significant static current reduction.
  • Clocking and memory support — Up to four analog PLLs for clock management and dedicated DDR memory interface support (up to DDR333/166 MHz as defined for the LatticeXP family).
  • Rugged industrial package — Surface-mount 256-ball fpBGA (256-FPBGA, 17 × 17 mm) with industrial temperature grade (‑40 °C to 100 °C).
  • Supply range — Operates across a flexible supply range from 1.71 V to 3.465 V to support multiple I/O and core voltage requirements.
  • Design ecosystem — Supported by the ispLEVER design tool and a library of ispLeverCORE IP modules for efficient implementation and migration within the LatticeXP family.

Typical Applications

  • Industrial control — Implement motor control logic, I/O aggregation and real-time control functions that benefit from industrial temperature rating and robust I/O options.
  • Embedded systems — Use instant-on, non-volatile configuration and on-chip RAM for compact embedded controllers and system-on-module designs.
  • High-speed memory interfaces — Deploy dedicated DDR interface support and PLL-based clock management for systems requiring external memory connectivity.
  • Communications and protocol bridging — Leverage flexible sysIO buffers and multiple interface standards to implement protocol translators, SERDES-adjacent interfaces, and mid-range comms logic.

Unique Advantages

  • Non‑volatile instant-on — Eliminates external configuration memory and reduces boot time by bringing the system to operation immediately after power-up.
  • Field-updatable logic — TransFR reconfiguration enables in-field updates to SRAM-based logic without full system downtime, simplifying maintenance and feature upgrades.
  • Broad interface support — Programmable I/O buffers accommodate a wide set of standards, reducing the need for external level shifters and interface chips.
  • Power management flexibility — Sleep mode capability provides substantial static current reduction for energy-sensitive designs.
  • Industrial robustness — Extended operating temperature and industrial grading support deployment in demanding environments.
  • Integrated design support — Compatibility with ispLEVER tools and ispLeverCORE IP shortens development time and eases migration across LatticeXP densities.

Why Choose LFXP20C-4F256I?

The LFXP20C-4F256I positions itself as a high-density, industrial-grade FPGA solution that balances on-chip memory, flexible I/O and non-volatile instant-on configuration. Its combination of approximately 20,000 logic elements, roughly 0.405 Mbits of embedded memory and support for a wide set of interface standards makes it suitable for embedded control, communications bridging and systems requiring in-field update capability.

Designed for engineers who need a reconfigurable, secure and power-conscious implementation, the device is supported by the Lattice design ecosystem, enabling efficient development, IP reuse and density migration within the LatticeXP family.

Request a quote or submit an inquiry today to check pricing, lead times and availability for the LFXP20C-4F256I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up