LFXP20C-4F256I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 405504 20000 256-BGA |
|---|---|
| Quantity | 423 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20C-4F256I – XP Field Programmable Gate Array (FPGA), 20,000 logic elements, 256‑BGA
The LFXP20C-4F256I is a non-volatile, infinitely reconfigurable FPGA from the LatticeXP family, offering instant-on operation without external configuration memory. It combines approximately 20,000 logic elements, on-chip embedded memory, and a flexible I/O fabric in a 256-ball fpBGA (17 × 17 mm) package targeted at industrial applications.
Designed for systems that require secure configuration, in-field updates and a range of interface options, this device supports a wide operating voltage range (1.71 V to 3.465 V) and an industrial operating temperature range (‑40 °C to 100 °C), with 188 available I/Os.
Key Features
- Core density — Approximately 20,000 logic elements to implement moderate- to high-density logic functions.
- Embedded memory — Approximately 405,504 bits (≈0.405 Mbits) of on-chip RAM for distributed and block memory usage.
- Flexible I/O — 188 I/Os with programmable sysIO buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and other interface standards as supported by the LatticeXP family.
- Non‑volatile, instant-on configuration — Internal non-volatile configuration eliminates the need for external configuration memory and enables rapid power-up.
- In-field reconfiguration — TransFR™ reconfiguration for updating SRAM-based logic while the system operates; reconfiguration and programming supported via system configuration and JTAG ports.
- Low-power modes — Sleep mode available for significant static current reduction.
- Clocking and memory support — Up to four analog PLLs for clock management and dedicated DDR memory interface support (up to DDR333/166 MHz as defined for the LatticeXP family).
- Rugged industrial package — Surface-mount 256-ball fpBGA (256-FPBGA, 17 × 17 mm) with industrial temperature grade (‑40 °C to 100 °C).
- Supply range — Operates across a flexible supply range from 1.71 V to 3.465 V to support multiple I/O and core voltage requirements.
- Design ecosystem — Supported by the ispLEVER design tool and a library of ispLeverCORE IP modules for efficient implementation and migration within the LatticeXP family.
Typical Applications
- Industrial control — Implement motor control logic, I/O aggregation and real-time control functions that benefit from industrial temperature rating and robust I/O options.
- Embedded systems — Use instant-on, non-volatile configuration and on-chip RAM for compact embedded controllers and system-on-module designs.
- High-speed memory interfaces — Deploy dedicated DDR interface support and PLL-based clock management for systems requiring external memory connectivity.
- Communications and protocol bridging — Leverage flexible sysIO buffers and multiple interface standards to implement protocol translators, SERDES-adjacent interfaces, and mid-range comms logic.
Unique Advantages
- Non‑volatile instant-on — Eliminates external configuration memory and reduces boot time by bringing the system to operation immediately after power-up.
- Field-updatable logic — TransFR reconfiguration enables in-field updates to SRAM-based logic without full system downtime, simplifying maintenance and feature upgrades.
- Broad interface support — Programmable I/O buffers accommodate a wide set of standards, reducing the need for external level shifters and interface chips.
- Power management flexibility — Sleep mode capability provides substantial static current reduction for energy-sensitive designs.
- Industrial robustness — Extended operating temperature and industrial grading support deployment in demanding environments.
- Integrated design support — Compatibility with ispLEVER tools and ispLeverCORE IP shortens development time and eases migration across LatticeXP densities.
Why Choose LFXP20C-4F256I?
The LFXP20C-4F256I positions itself as a high-density, industrial-grade FPGA solution that balances on-chip memory, flexible I/O and non-volatile instant-on configuration. Its combination of approximately 20,000 logic elements, roughly 0.405 Mbits of embedded memory and support for a wide set of interface standards makes it suitable for embedded control, communications bridging and systems requiring in-field update capability.
Designed for engineers who need a reconfigurable, secure and power-conscious implementation, the device is supported by the Lattice design ecosystem, enabling efficient development, IP reuse and density migration within the LatticeXP family.
Request a quote or submit an inquiry today to check pricing, lead times and availability for the LFXP20C-4F256I.

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