LFXP20C-3FN388I

The LFXP20C-3FN388I is a non-volatile, reconfigurable FPGA from the LatticeXP family designed for industrial applications. It combines approximately 20,000 logic elements and on-chip memory with a high I/O count and flexible I/O standards to support system control, interface bridging, and in-field reconfiguration use cases.

Key value propositions include instant-on non-volatile operation with no external configuration memory required, a broad supply voltage range (1.71 V to 3.465 V), and industrial operating temperature across −40 °C to 100 °C, all delivered in a 388-ball fpBGA package optimized for surface-mount assembly.

Key Features

• Core Capacity — Approximately 20,000 logic elements with a device architecture providing 2,464 logic blocks for implementing medium-density designs.
• Embedded Memory — Approximately 0.41 Mbits (405,504 bits) of on-chip RAM for distributed and block memory usage.
• I/O and Package — 268 user I/O pins delivered in a 388-ball fpBGA (23 × 23 mm) surface-mount package (supplier package: 388-FPBGA).
• Non-Volatile, Instant-On — Family-level capability for instant-on operation with no external configuration memory and secure configuration storage.
• In-Field Reconfiguration — Supports TransFR™ reconfiguration for updating logic while the system is operating (series-level feature).
• Flexible I/O Standards — Series-level programmable I/O buffer support for multiple interfaces and voltage levels including LVCMOS (1.2/1.5/1.8/2.5/3.3 V), LVTTL, SSTL, HSTL, LVDS, LVPECL and PCI-class signaling.
• Clocking — Series-level support for up to four analog PLLs for clock multiply/divide and phase shifting.
• Supply and Temperature — Wide supply voltage operation from 1.71 V to 3.465 V and industrial temperature rating from −40 °C to 100 °C.
• Compliance — RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• System Control and Interface Bridging — Use the device to implement glue logic, protocol conversion and interface aggregation where a high I/O count and flexible I/O standards are required.
• Memory Interface and Buffering — Leverage on-chip memory and series-level DDR support for buffering and memory interface logic in embedded systems.
• Field-Upgradeable Systems — Employ in applications that require in-field logic updates and rapid reconfiguration while maintaining system operation.

Unique Advantages

• Instant-on Non-Volatile Operation: Eliminates the need for external configuration memory and reduces system boot time by powering up in microseconds (series-level behavior).
• High Integration: Combines ~20,000 logic elements, substantial on-chip RAM and 268 I/Os in a single 388-ball fpBGA, reducing BOM and board area.
• Flexible I/O and Clocking: Programmable I/O buffer support and up to four analog PLLs allow integration of diverse interfaces and tailored clock architectures.
• Industrial Robustness: Rated for −40 °C to 100 °C operation and a wide supply range (1.71 V to 3.465 V) to meet demanding environmental conditions.
• In-Field Reconfiguration: Supports TransFR™ for updating logic while the system remains operational, enabling faster feature rollouts and field fixes (series-level feature).
• RoHS Compliant: Meets environmental compliance requirements for modern manufacturing.

Why Choose LFXP20C-3FN388I?

The LFXP20C-3FN388I positions itself as a highly integrated, industrial-grade FPGA for designs that require non-volatile instant-on behavior, flexible I/O, and the ability to update logic in the field. With approximately 20,000 logic elements, around 0.41 Mbits of embedded memory, and 268 user I/Os in a compact 388-ball fpBGA package, it is well suited to medium-density embedded systems, interface bridging, and applications that benefit from reduced external components and secure configuration storage.

Combining family-level features such as in-field reconfiguration, multi-standard I/O support, and multiple analog PLLs with the device’s industrial temperature rating and RoHS compliance provides a robust platform for designers seeking scalable, long-term solutions backed by documented series capabilities.

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