LFXP20C-3FN388C

The LFXP20C-3FN388C is a Lattice XP family FPGA offering 20,000 logic elements in a 388-ball fpBGA (23 × 23 mm) surface-mount package. Designed for commercial applications, this non-volatile, reconfigurable device combines embedded memory, flexible I/O and system-level features to support rapid prototyping and production designs that require instant-on configuration and in-field reprogramming.

Typical use cases include embedded control, interface bridging, memory interfacing and mid-density signal processing where a balance of logic capacity, on-chip RAM and a high I/O count are required.

Key Features

• Core Logic  Provides 20,000 logic elements (LUT-based resources) suitable for mid-density FPGA designs.
• Embedded Memory  Approximately 0.41 Mbits of on-chip RAM (405,504 total bits) with a combination of block and distributed memory resources.
• I/O Capacity & Flexibility  268 I/Os in a 388-ball fpBGA package; programmable sysIO buffer support for multiple standards including LVCMOS (1.2–3.3 V ranges listed in the family data), LVTTL, SSTL, HSTL, PCI and various differential options such as LVDS and LVPECL as described for the LatticeXP family.
• Non-volatile, Instant-on Architecture  ispXP-based non-volatile architecture provides instant-on operation with no external configuration memory required and supports in-field reconfiguration.
• Reconfiguration Capabilities  Supports TransFR™ in-field reconfiguration and rapid SRAM-based logic updates; SRAM and non-volatile regions programmable via system configuration and JTAG.
• Clocking  Up to four analog PLLs (per family specification) for clock multiplication, division and phase shifting.
• Dedicated Memory Interface  Family-level support for DDR memory interfaces (up to DDR333 noted in the series documentation) for external memory connectivity.
• Power & Low-Power Modes  Operates across a supply range of 1.71 V to 3.465 V and includes a sleep mode capability for significant static current reduction.
• Package & Mounting  388-BBGA (388-FPBGA, 23 × 23 mm) surface-mount package for compact board designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• Embedded Control  Control logic and state-machine implementations that benefit from non-volatile instant-on behavior and reconfigurability.
• Interface Bridging  Protocol converters and multi-standard I/O interfaces leveraging the device’s programmable sysIO buffers and high I/O count.
• Memory Interfacing  External DDR interface implementations and buffering using the family’s dedicated DDR memory support and on-chip memory resources.
• Signal Processing  Mid-density data-paths and preprocessing functions that utilize the 20,000 logic elements and embedded RAM.

Unique Advantages

• Instant-on, non-volatile operation  Eliminates the need for external configuration memory and enables rapid system startup.
• High I/O density in a compact package  268 I/Os in a 23 × 23 mm fpBGA package reduce board area while supporting complex I/O requirements.
• Flexible power and I/O standards  Wide supply range and programmable I/O buffer options support multiple voltage domains and interface standards.
• On-chip memory and PLL resources  Approximately 0.41 Mbits of embedded RAM and up to four PLLs provide local storage and robust clocking options for synchronous designs.
• Field reconfigurability  TransFR reconfiguration and system/JTAG programming enable in-field updates and iterative design improvements without hardware replacement.

Why Choose LFXP20C-3FN388C?

The LFXP20C-3FN388C positions itself as a mid-density, non-volatile FPGA option for commercial designs that require fast startup, flexible I/O and a balanced combination of logic and on-chip memory. Its 20,000 logic elements, substantial embedded RAM and 268 I/Os in a compact 388-ball fpBGA package make it well suited to embedded control, interface bridging and memory-interfacing applications.

For design teams prioritizing instant-on capability, in-field reconfiguration and a broad set of I/O standards, this device delivers a practical blend of integration and configurability backed by Lattice XP family features.

If you need pricing, availability or technical clarification, request a quote or submit an inquiry to receive detailed information and a formal quote.