LFXP20C-3F484C

IC FPGA 340 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA

Quantity 92 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O340Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2464Number of Logic Elements/Cells20000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits405504

Overview of LFXP20C-3F484C – XP Field Programmable Gate Array (FPGA), 20,000 Logic Elements, 340 I/Os, 484-BBGA

The LFXP20C-3F484C is a non-volatile LatticeXP family FPGA from Lattice Semiconductor Corporation that integrates reconfigurable logic, embedded memory and high-performance I/O in a single surface-mount package. The device combines approximately 20,000 logic elements, 2464 logic blocks and extensive on-chip RAM to support complex system designs requiring dense logic and flexible interfacing.

Designed for commercial applications, the device offers instant-on non-volatile operation, in-field reconfiguration capability, a wide supply voltage range and programmable I/O support, making it suitable for embedded systems, interface bridging and memory-centric designs.

Key Features

  • Core Architecture  Approximately 20,000 logic elements and 2,464 logic blocks for implementing medium-to-large FPGA designs.
  • Embedded Memory  Approximately 0.396 Mbits of on-chip RAM (EBR and distributed memory) to support data buffering and local storage.
  • High I/O Count  Up to 340 I/O pins to accommodate broad connectivity requirements in a single device.
  • Non-Volatile, Instant-On Operation  Built-in non-volatile configuration removes the need for external configuration memory and allows the device to power up in microseconds.
  • In-Field Reconfiguration (TransFR™)  Supports in-system reconfiguration while the system operates, enabling logic updates without removing the device from the board.
  • Low-Power Sleep Mode  Sleep mode delivers substantial static current reduction for power-sensitive applications.
  • Flexible I/O Buffering  Programmable I/O supports a wide range of standards, enabling interfacing with multiple signaling families and system voltage levels.
  • Dedicated DDR Memory Support  Implements interfaces up to DDR333 for system memory connectivity.
  • Clocking  Up to four analog PLLs for clock multiply, divide and phase shifting.
  • Package & Mounting  484-ball BBGA surface-mount package (supplier package: 484-FPBGA, 23 × 23 mm) for compact board integration.
  • Power & Temperature  Operates across a supply range of 1.71 V to 3.465 V and a commercial operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Embedded Systems  Implement custom processing, control logic and peripheral interfaces using the device’s reconfigurable logic and on-chip memory.
  • Interface Bridging & Protocol Conversion  Leverage 340 I/Os and programmable I/O standards to bridge disparate interfaces and perform protocol translation on a single device.
  • Memory Interface Controllers  Use the dedicated DDR memory support and on-chip RAM for implementing memory controllers and high-speed buffering.
  • Field Upgradeable Systems  Take advantage of in-field TransFR reconfiguration to deploy updates and feature changes without board-level replacements.

Unique Advantages

  • Instant-on, non-volatile configuration: Eliminates external configuration memory and enables fast power-up behavior for systems that require immediate availability.
  • In-field reconfiguration capability: TransFR™ allows logic updates while the system remains in operation, reducing maintenance downtime and enabling agile feature updates.
  • High integration density: 20,000 logic elements and substantial on-chip RAM reduce external component count and simplify board-level design.
  • Flexible I/O and clocking: Extensive I/O support and up to four PLLs enable diverse interface implementations and precise clock management within the same device.
  • Commercial-grade robustness: Qualified for 0 °C to 85 °C operation and a wide supply voltage window (1.71 V–3.465 V) to suit a range of commercial designs.
  • RoHS compliant: Meets environmental compliance requirements for modern electronic assemblies.

Why Choose LFXP20C-3F484C?

The LFXP20C-3F484C targets designers who need a non-volatile, reconfigurable FPGA with a balance of high logic density, abundant I/O and embedded memory. Its instant-on behavior, in-field reconfiguration and flexible I/O support make it well suited for complex embedded and system-level designs that benefit from updates in the field and consolidated board-level integration.

Backed by Lattice Semiconductor’s LatticeXP family architecture and design tool support, the device provides a scalable platform for designs that may require density migration and modular IP reuse, helping teams reduce BOM complexity and streamline system integration.

Request a quote or submit a pricing inquiry to evaluate the LFXP20C-3F484C for your next design.

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