LFXP20C-3F484C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 340 405504 20000 484-BBGA |
|---|---|
| Quantity | 92 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 340 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2464 | Number of Logic Elements/Cells | 20000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 405504 |
Overview of LFXP20C-3F484C – XP Field Programmable Gate Array (FPGA), 20,000 Logic Elements, 340 I/Os, 484-BBGA
The LFXP20C-3F484C is a non-volatile LatticeXP family FPGA from Lattice Semiconductor Corporation that integrates reconfigurable logic, embedded memory and high-performance I/O in a single surface-mount package. The device combines approximately 20,000 logic elements, 2464 logic blocks and extensive on-chip RAM to support complex system designs requiring dense logic and flexible interfacing.
Designed for commercial applications, the device offers instant-on non-volatile operation, in-field reconfiguration capability, a wide supply voltage range and programmable I/O support, making it suitable for embedded systems, interface bridging and memory-centric designs.
Key Features
- Core Architecture Approximately 20,000 logic elements and 2,464 logic blocks for implementing medium-to-large FPGA designs.
- Embedded Memory Approximately 0.396 Mbits of on-chip RAM (EBR and distributed memory) to support data buffering and local storage.
- High I/O Count Up to 340 I/O pins to accommodate broad connectivity requirements in a single device.
- Non-Volatile, Instant-On Operation Built-in non-volatile configuration removes the need for external configuration memory and allows the device to power up in microseconds.
- In-Field Reconfiguration (TransFR™) Supports in-system reconfiguration while the system operates, enabling logic updates without removing the device from the board.
- Low-Power Sleep Mode Sleep mode delivers substantial static current reduction for power-sensitive applications.
- Flexible I/O Buffering Programmable I/O supports a wide range of standards, enabling interfacing with multiple signaling families and system voltage levels.
- Dedicated DDR Memory Support Implements interfaces up to DDR333 for system memory connectivity.
- Clocking Up to four analog PLLs for clock multiply, divide and phase shifting.
- Package & Mounting 484-ball BBGA surface-mount package (supplier package: 484-FPBGA, 23 × 23 mm) for compact board integration.
- Power & Temperature Operates across a supply range of 1.71 V to 3.465 V and a commercial operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- Embedded Systems Implement custom processing, control logic and peripheral interfaces using the device’s reconfigurable logic and on-chip memory.
- Interface Bridging & Protocol Conversion Leverage 340 I/Os and programmable I/O standards to bridge disparate interfaces and perform protocol translation on a single device.
- Memory Interface Controllers Use the dedicated DDR memory support and on-chip RAM for implementing memory controllers and high-speed buffering.
- Field Upgradeable Systems Take advantage of in-field TransFR reconfiguration to deploy updates and feature changes without board-level replacements.
Unique Advantages
- Instant-on, non-volatile configuration: Eliminates external configuration memory and enables fast power-up behavior for systems that require immediate availability.
- In-field reconfiguration capability: TransFR™ allows logic updates while the system remains in operation, reducing maintenance downtime and enabling agile feature updates.
- High integration density: 20,000 logic elements and substantial on-chip RAM reduce external component count and simplify board-level design.
- Flexible I/O and clocking: Extensive I/O support and up to four PLLs enable diverse interface implementations and precise clock management within the same device.
- Commercial-grade robustness: Qualified for 0 °C to 85 °C operation and a wide supply voltage window (1.71 V–3.465 V) to suit a range of commercial designs.
- RoHS compliant: Meets environmental compliance requirements for modern electronic assemblies.
Why Choose LFXP20C-3F484C?
The LFXP20C-3F484C targets designers who need a non-volatile, reconfigurable FPGA with a balance of high logic density, abundant I/O and embedded memory. Its instant-on behavior, in-field reconfiguration and flexible I/O support make it well suited for complex embedded and system-level designs that benefit from updates in the field and consolidated board-level integration.
Backed by Lattice Semiconductor’s LatticeXP family architecture and design tool support, the device provides a scalable platform for designs that may require density migration and modular IP reuse, helping teams reduce BOM complexity and streamline system integration.
Request a quote or submit a pricing inquiry to evaluate the LFXP20C-3F484C for your next design.

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