LFXP2-8E-7TN144C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 100 226304 8000 144-LQFP |
|---|---|
| Quantity | 108 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-7TN144C – XP2 Field Programmable Gate Array (FPGA) IC 100 226304 8000 144-LQFP
The LFXP2-8E-7TN144C is a commercial-grade FPGA from Lattice Semiconductor’s LatticeXP2 family, featuring flash-based flexiFLASH architecture for instant-on and reconfigurable operation. It provides a balanced mix of logic capacity, embedded memory, DSP resources and flexible I/O in a 144-pin LQFP/TQFP package targeted at medium-density, commercial embedded applications.
Key strengths include approximately 8,000 logic elements, roughly 226,304 bits of on-chip RAM, support for up to 100 I/O pins, and low-voltage operation within a 1.14 V to 1.26 V supply window—all specified for 0 °C to 85 °C operating temperature.
Key Features
- Core architecture (flexiFLASH) Flash-based single-chip architecture with instant-on and infinite reconfigurability; includes on-chip FlashBAK memory and Serial TAG for secure configuration management.
- Logic capacity Approximately 8,000 logic elements to implement medium-density logic functions and control logic.
- Embedded memory Total on-chip RAM of approximately 226,304 bits, providing embedded and distributed memory for buffering, state storage and small data tables.
- sysDSP and multipliers Family-level sysDSP resources with four sysDSP blocks and support for up to sixteen 18×18 multipliers for high-performance multiply-accumulate tasks.
- Flexible I/O and interfaces Up to 100 I/O pins with a sysIO buffer that supports standards including multiple LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS and LVPECL for a wide range of signaling requirements.
- Clocking sysCLOCK PLLs for on-chip clock multiply/divide and phase shifting to support synchronous interfaces and timing control.
- Security and update Live Update capabilities with TransFR technology, secure updates using 128-bit AES encryption and dual-boot image support for robust field update strategies.
- Power and thermal Specified supply voltage range of 1.14 V to 1.26 V and commercial operating temperature range of 0 °C to 85 °C.
- Package & mounting Surface-mount device in a 144-pin LQFP / 144-TQFP (20 × 20 mm) package, simplifying board-level integration for compact designs.
- Environmental RoHS compliant.
Typical Applications
- Embedded control and system glue Implement control logic, protocol bridging and peripheral interfacing in compact commercial embedded systems.
- DSP and signal processing Use sysDSP blocks and dedicated multipliers for multiply-accumulate workloads such as filtering, sensor pre-processing and numeric acceleration.
- Display and high-speed interfaces Leverage flexible I/O and LVDS/Bus-LVDS support for display interfaces and source-synchronous links in commercial video or UI applications.
- Memory buffering and interface bridging On-chip embedded RAM and I/O resources enable small data buffers, protocol conversion and timing adaptation between subsystems.
Unique Advantages
- Flash-based instant-on: Built-in flexiFLASH architecture enables immediate configuration at power-up and field reconfiguration without external volatile storage.
- Balanced medium-density resources: Approximately 8,000 logic elements combined with ~226 Kbits of embedded RAM and DSP blocks delivers a compact solution for control and signal tasks without excessive internal complexity.
- Broad I/O flexibility: A 100-pin I/O count and extensive supported standards simplify interfacing to sensors, memory and high-speed links.
- Secure field updates: Live Update with TransFR and 128-bit AES support enables secure dual-boot and firmware update strategies.
- Low-voltage operation: Narrow supply window (1.14 V–1.26 V) for designs targeting low-voltage digital domains.
- Commercial-temperature rating and RoHS compliant: Suitable for mainstream commercial embedded product deployments with environmental compliance.
Why Choose LFXP2-8E-7TN144C?
The LFXP2-8E-7TN144C positions itself as a practical, flash-based FPGA choice for commercial embedded designs that require instant-on behavior, moderate logic density and integrated DSP and memory resources. Its combination of approximately 8,000 logic elements, on-chip RAM and flexible I/O in a compact 144-pin package makes it well suited for control, interface bridging and signal processing tasks where board space and integration matter.
Supported by Lattice’s XP2 family capabilities—flash configuration, secure update mechanisms and design tool/IP support—this device delivers a scalable platform for developers who need reconfigurability, secure field updates and an established ecosystem for implementation and deployment.
Request a quote or submit an inquiry to check availability and pricing for LFXP2-8E-7TN144C and to discuss volume, lead time and technical requirements.

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