LFXP20C-3F256C

The LFXP20C-3F256C is a commercial-grade, non-volatile FPGA from Lattice Semiconductor's LatticeXP family. It integrates 20,000 logic elements, 405,504 bits of on-chip RAM (approximately 0.41 Mbits) and 188 I/Os in a 256-ball fpBGA (17 × 17 mm) surface-mount package.

Designed for systems that require instant-on behavior, in-field reconfiguration and flexible I/O, this device supports a wide supply range (1.71 V to 3.465 V) and commercial operating temperatures of 0 °C to 85 °C, with RoHS compliance for environmental compatibility.

Key Features

• Core density: 20,000 logic elements providing substantial programmable logic capacity for mid-range FPGA designs.
• Embedded memory: 405,504 total RAM bits (approximately 0.41 Mbits) for distributed and block memory requirements.
• I/O capability: 188 user I/Os available in the 256-FPBGA package, with flexible sysIO buffer support for multiple interface standards described by the LatticeXP family.
• Non-volatile, instant-on architecture: LatticeXP family technology delivers instant-on operation without external configuration memory and supports secure, reconfigurable designs.
• In-field reconfiguration: TransFR™ reconfiguration enables logic updates while the system remains operational; system and JTAG ports support reprogramming.
• Clocking: Up to 4 analog PLLs per device for clock multiply, divide and phase shifting functions.
• Power and low-power modes: Operates over 1.71 V to 3.465 V supply range and supports a Sleep Mode that can reduce static current by up to 1000×.
• Package and mounting: 256-ball fpBGA (17 × 17 mm) surface-mount package for compact board-level integration.
• Commercial operating range: Rated for 0 °C to 85 °C operation and RoHS compliant.

Typical Applications

• Memory interface and controller designs: Dedicated DDR memory support in the LatticeXP family enables implementation of DDR interfaces and memory controllers.
• High-speed I/O bridging: Flexible sysIO buffer capabilities support diverse signaling standards, making the device suitable for bridging and protocol adaptation tasks.
• Embedded system logic consolidation: The combination of 20,000 logic elements and on-chip RAM lets designers consolidate glue logic, control functions and mid-density processing on a single device.
• Field-updatable systems: Instant-on operation and in-field reconfiguration support system-level updates and feature upgrades without external configuration storage.

Unique Advantages

• Highly integrated mid-range FPGA: 20,000 logic elements plus on-chip RAM and 188 I/Os reduce BOM count and board complexity.
• Instant-on, non-volatile operation: Eliminates the need for external configuration memory and delivers rapid system startup.
• Field reconfigurability: TransFR reconfiguration and system/JTAG programmability allow in-system updates and iterative feature deployment.
• Flexible clock management: Up to four PLLs provide on-chip clock multiplication, division and phase shift options for complex timing domains.
• Low-power standby capability: Sleep Mode offers substantial static current reduction to support lower-power system states.
• Commercial-grade reliability and compliance: Specified for 0 °C to 85 °C operation and RoHS-compliant for environmental compatibility.

Why Choose LFXP20C-3F256C?

The LFXP20C-3F256C balances programmable logic capacity, embedded memory and flexible I/O in a compact 256-FPBGA package, offering a practical option for mid-range FPGA applications requiring instant-on behavior and in-field reconfiguration. Its support for multiple supply voltages and robust clocking features make it suitable for designs that need both integration and timing flexibility.

Backed by the LatticeXP family architecture and associated design tools and IP, the device is a solid choice for developers seeking scalable logic density with secure, non-volatile configuration and in-system update capabilities.

Request a quote or submit an RFQ for the LFXP20C-3F256C to get pricing and availability information tailored to your project needs.