LFXP2-8E-7M132C

IC FPGA 86 I/O 132CSBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 86 226304 8000 132-LFBGA, CSPBGA

Quantity 616 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case132-LFBGA, CSPBGANumber of I/O86Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells8000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFXP2-8E-7M132C – XP2 Field Programmable Gate Array (FPGA), 86 I/O, 132-LFBGA

The LFXP2-8E-7M132C is a commercial-grade FPGA IC in the LatticeXP2 family, combining a LUT-based programmable fabric with non-volatile flash-based configuration. Designed for mid-density embedded designs, it offers 8,000 logic elements, approximately 226 Kbits of on-chip RAM and up to 86 general-purpose I/Os in a 132-ball csBGA package.

This device targets applications that require instant-on reconfigurability, integrated DSP resources and flexible I/O support while operating from a low-voltage supply (1.14 V to 1.26 V) across a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core Architecture LatticeXP2 family flexiFLASH architecture provides instant-on, infinitely reconfigurable, single-chip operation with FlashBAK embedded block memory and Serial TAG memory for secure configuration management.
  • Logic Capacity Approximately 8,000 logic elements suitable for mid-density logic implementations.
  • Embedded Memory Total on-chip RAM: 226,304 bits (approximately 226 Kbits) for embedded and distributed storage.
  • sysDSP and Multipliers XP2-8 family devices include sysDSP blocks and multiple 18×18 multipliers for efficient multiply-accumulate and arithmetic acceleration (family table lists 4 sysDSP blocks and 16 18×18 multipliers for the XP2-8 device).
  • Flexible I/O and Interfaces Up to 86 I/Os in the 132-ball csBGA package; family I/O buffer support includes LVCMOS, SSTL, HSTL, LVDS and other high-speed signaling formats for source-synchronous interfaces such as DDR/DDR2 and LVDS display links.
  • Clocking Family architecture supports multiple analog PLLs for clock multiplication, division and phase shifting (up to four PLLs per device in the family).
  • Configuration and Security Live Update technology with TransFR, secure updates using 128-bit AES encryption and dual-boot capability (family-level features).
  • Power and Mechanical Low-voltage operation at 1.14 V to 1.26 V; surface-mount 132-LFBGA / csBGA (8 × 8 mm) package; commercial grade operating range 0 °C to 85 °C.
  • Compliance RoHS-compliant.

Typical Applications

  • Embedded Control and Glue Logic Use the device’s 8,000 logic elements and flexible I/O to implement custom control, protocol bridging and system glue functions in space-constrained boards.
  • Signal Processing and Acceleration Leverage sysDSP blocks and multiple 18×18 multipliers for real-time arithmetic and DSP tasks such as filtering, aggregation and fixed-point processing.
  • Memory and Interface Controllers Implement DDR/DDR2 interfaces and other source-synchronous links using the family’s pre-engineered interface support and programmable I/O buffers.
  • Secure Field Updates Take advantage of the family’s Live Update and 128-bit AES-secured configuration mechanisms for controlled remote firmware updates and dual-boot configurations.

Unique Advantages

  • Instant-on, non-volatile configuration: Built-in flash-backed architecture eliminates the need for external configuration memory and enables immediate startup.
  • Mid-density integration: 8,000 logic elements and approximately 226 Kbits of on-chip RAM provide a balance of logic and memory for compact embedded designs.
  • Integrated DSP resources: sysDSP blocks and dedicated multipliers reduce the need for external DSP ICs and simplify signal processing implementations.
  • Flexible I/O in a compact package: 86 I/Os in a 132-ball csBGA package support a range of signaling standards while minimizing PCB footprint.
  • Secure and updatable systems: Family-level secure update features including 128-bit AES encryption and dual-boot support enable controlled configuration management.

Why Choose LFXP2-8E-7M132C?

The LFXP2-8E-7M132C positions itself as a versatile mid-density FPGA solution within the LatticeXP2 family: it combines instant-on flash configuration, a substantial logic element count and integrated DSP resources in a compact 132-ball csBGA package. Its low-voltage operation and family-provided interface and security features make it suitable for embedded systems requiring reconfigurability, DSP acceleration and controlled field updates.

Designers seeking a commercial-grade FPGA with moderate I/O and memory resources will find this device appropriate for a range of applications where board space, secure updates and integrated DSP capability are important. Family-level ecosystem tools and pre-engineered IP support are available to aid design integration and migration across XP2 densities.

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