LFXP2-8E-6TN144C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 100 226304 8000 144-LQFP |
|---|---|
| Quantity | 1,114 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-6TN144C – XP2 Field Programmable Gate Array (FPGA), 8k logic elements, 144‑LQFP
The LFXP2-8E-6TN144C is a flash-based FPGA from the Lattice XP2 family featuring the flexiFLASH architecture for instant-on, infinitely reconfigurable single‑chip solutions. It combines an FPGA fabric with on-chip non-volatile flash and embedded memory, offering 8,000 logic elements, 226,304 bits of total on-chip RAM and up to 100 general-purpose I/Os in a 144‑pin LQFP/TQFP package.
This device is targeted at commercial embedded designs that require instant configuration, secure update capability, and a compact package footprint while operating across a 1.14 V–1.26 V supply range and a 0 °C to 85 °C commercial temperature window.
Key Features
- flexiFLASH Architecture Flash-based single-chip configuration provides instant-on, infinite reconfigurability and on-chip flash-backed memory for persistent designs.
- Live Update & Security Supports secure update technologies including dual-boot and 128‑bit AES encryption for protected firmware updates and TransFR live update capabilities.
- Logic and DSP Resources Approximately 8,000 logic elements for implementing custom logic, with dedicated sysDSP blocks (family-specific: 4 blocks for the XP2-8 series) and up to sixteen 18×18 multipliers for high‑performance multiply‑accumulate tasks.
- Embedded and Distributed Memory 226,304 bits of total on-chip RAM to support embedded data storage and buffering needs.
- Flexible I/O Up to 100 I/Os supported in the 144‑pin package, with family-level support for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and other interface standards for source-synchronous and high-speed links.
- Clocking Multiple sysCLOCK PLLs (family-level support) provide clock multiply/divide and phase shifting for system timing requirements.
- Package and Supply Available in a 144‑pin LQFP / 144‑TQFP (20 × 20 mm) package; device operates from 1.14 V to 1.26 V supply.
- Commercial Grade and Compliance Commercial operating temperature range of 0 °C to 85 °C and RoHS compliant.
Typical Applications
- Display and Video Interfaces Pre‑engineered source‑synchronous I/O and LVDS support make the device suitable for display interface tasks and related video transport functions.
- Memory Interface and Bridge Logic DDR/DDR2 interface support and on‑chip memory resources allow implementation of memory controllers, buffers and protocol bridges.
- Secure Field‑Updatable Systems Instant-on flash architecture combined with secure live-update features enables field firmware updates with AES‑based protection.
- Embedded Control and I/O Aggregation Compact footprint and up to 100 I/Os serve general embedded control, sensor aggregation, and peripheral interfacing in commercial equipment.
Unique Advantages
- Instant‑on Flash Configuration: Eliminates external configuration time by storing the configuration on‑chip for immediate startup.
- Secure, Field‑Safe Updates: Live Update and 128‑bit AES encryption enable protected updates and dual‑boot configurations for robust maintenance workflows.
- On‑chip DSP Acceleration: sysDSP blocks and multiple 18×18 multipliers accelerate multiply‑accumulate workloads without external co‑processors.
- Compact, High‑I/O Package: 144‑pin LQFP/TQFP provides up to 100 I/Os in a small 20 × 20 mm footprint for space‑constrained designs.
- Design Ecosystem Support: Family-level support includes pre‑engineered IP and design tools to streamline implementation and migration within the XP2 family.
- Regulatory and Environmental Compliance: RoHS compliance supports environmentally conscious product design and manufacturing.
Why Choose LFXP2-8E-6TN144C?
The LFXP2-8E-6TN144C balances reconfigurability, on‑chip memory and DSP capability in a compact 144‑pin package, ideal for commercial embedded systems that require instant-on behavior and secure update paths. With 8,000 logic elements, 226,304 bits of embedded RAM, dedicated DSP resources, and flexible I/O support, it suits designers implementing display interfaces, memory bridges, and secure field-updatable products.
Backed by the Lattice XP2 family architecture and its design tool ecosystem, this device offers a scalable platform for designs that need persistent flash configuration, integrated DSP acceleration and a compact, RoHS‑compliant package for commercial applications.
Request a quote or submit a procurement inquiry to receive pricing, lead-time and availability details for the LFXP2-8E-6TN144C. Our team can assist with volume requests and technical clarification.
