LFXP2-8E-6QN208I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 146 226304 8000 208-BFQFP |
|---|---|
| Quantity | 213 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 146 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-6QN208I – XP2 Field Programmable Gate Array (FPGA) IC, 146 I/O, 208‑BFQFP
The LFXP2-8E-6QN208I is an industrial‑grade FPGA combining a LUT‑based FPGA fabric with non‑volatile flash configuration in Lattice’s flexiFLASH architecture. It delivers approximately 8,000 logic elements, on‑chip RAM, dedicated DSP resources, and a broad I/O set in a 208‑pin PQFP package optimized for surface‑mount assembly.
Designed for embedded and industrial applications that require reconfigurable logic, secure configuration and a compact package, this device offers instant‑on flash configuration, multiple DSP and memory resources, and support for a wide range of I/O standards and source‑synchronous interfaces.
Key Features
- Core Architecture LUT‑based FPGA fabric with flexiFLASH architecture for instant‑on, infinitely reconfigurable single‑chip operation and on‑chip FlashBAK storage as described in the LatticeXP2 family documentation.
- Logic Capacity Approximately 8,000 logic elements to implement mid‑size control, interface and signal processing designs.
- Embedded Memory Total on‑chip memory of 226,304 bits (approximately 226 Kbits) for distributed and embedded storage.
- sysDSP and Multipliers Family features include four sysDSP blocks and 16 18×18 multipliers (XP2‑8 family), providing dedicated hardware for multiply‑accumulate and DSP tasks.
- I/O and Interface Support 146 user I/Os in the 208‑pin BFQFP (208‑PQFP 28×28 mm) package. Flexible sysIO buffer supports a wide range of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, MLVDS, LVPECL, RSDS) and pre‑engineered source‑synchronous interfaces including DDR/DDR2 and multi‑lane LVDS.
- Clocking Up to two analog PLLs (family capability) for clock multiply/divide and phase shifting to support timing requirements.
- Configuration & Security Flash‑based configuration with support for secure update features in the LatticeXP2 family (Live Update, TransFR, 128‑bit AES encryption, and dual‑boot capabilities as documented for the family).
- Power & Operating Range Device supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C suitable for industrial environments.
- Package & Mounting 208‑pin BFQFP (supplier device package: 208‑PQFP, 28×28 mm) for surface‑mount PCB assembly.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control Reconfigurable logic and on‑chip memory make the device suitable for motion control, PLC I/O aggregation, and protocol bridging in industrial automation systems.
- Embedded Systems Mid‑density logic, DSP resources and multiple I/O standards support embedded control, sensor interfacing and custom peripheral integration.
- Display & Imaging Interfaces Pre‑engineered source‑synchronous I/O and 7:1 LVDS support (family capability) enable display timing, serialization and interface bridging tasks.
- Memory‑Interface Gateways Support for DDR/DDR2 source‑synchronous interfaces (family capability) for applications requiring external memory control or buffering.
Unique Advantages
- Flash‑based Instant‑On Configuration: flexiFLASH architecture enables immediate device startup and on‑board non‑volatile configuration without external volatile configuration logic.
- Integrated DSP Resources: Dedicated sysDSP blocks and 18×18 multipliers accelerate signal processing functions while keeping general logic available for control and glue logic.
- Flexible I/O in a Compact Package: 146 user I/Os in a 208‑pin PQFP package support many parallel interfaces and mixed signaling standards while fitting space‑constrained PCBs.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployments in demanding temperature environments.
- Secure Update and Dual‑Boot Support: Family‑level Live Update features and 128‑bit AES encryption support secure field updates and dual‑image boot strategies.
- Established Design Ecosystem: The LatticeXP2 family is supported by Lattice design tools and pre‑designed IP modules to speed development and integration.
Why Choose LFXP2-8E-6QN208I?
The LFXP2-8E-6QN208I positions mid‑density FPGA capability with flash configuration, DSP resources and a broad I/O feature set in a compact 208‑pin PQFP package for industrial applications. Its combination of approximately 8,000 logic elements, dedicated DSP multiply resources, on‑chip memory and flexible I/O standards makes it suited for embedded systems that require reconfigurability, secure updates and robust ambient temperature operation.
Engineers developing industrial controllers, interface bridges, display controllers or embedded signal‑processing modules will find the device’s balance of integration, memory and DSP support useful for reducing BOM complexity and accelerating time‑to‑market, while the LatticeXP2 family ecosystem provides design tools and IP to support development.
Request a quote or submit a product inquiry today to evaluate the LFXP2-8E-6QN208I for your next design.