LFXP2-8E-7FTN256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA |
|---|---|
| Quantity | 1,224 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 201 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1000 | Number of Logic Elements/Cells | 8000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFXP2-8E-7FTN256C – XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA
The LFXP2-8E-7FTN256C is a commercial-grade Lattice XP2 FPGA offering a compact 256-ball ftBGA package and surface-mount mounting. Built on the LatticeXP2 family architecture, it combines flash-based configuration, dedicated DSP resources and flexible I/O to address mid-density programmable logic needs.
Typical use cases include embedded control, sensor and interface bridging, display and connectivity functions where instant-on configuration, moderate on-chip memory and a 201-pin I/O count provide effective system integration.
Key Features
- Core Logic Approximately 8,000 logic elements for implementing combinational and sequential logic, state machines and glue logic.
- Embedded Memory Approximately 0.226 Mbits (226,304 bits) of on-chip RAM suitable for buffering, small FIFOs and configuration storage.
- DSP Resources XP2 family sysDSP blocks and multiplier resources are provided for multiply-accumulate operations; the XP2-8 devices include four sysDSP blocks and 16 18×18 multipliers as part of the family offering.
- I/O and Interfaces 201 user I/Os in the 256-ball ftBGA package, supporting a wide range of signaling needs and source-synchronous interfaces described for the XP2 family.
- Configuration and Security Family-level flexiFLASH architecture provides instant-on, on-chip flash configuration and features such as FlashBAK and Serial TAG memory for secure, reconfigurable designs.
- Live Update Technologies Family Live Update features (TransFR) and design security capabilities including 128-bit AES encryption and dual-boot support are part of the LatticeXP2 architecture.
- Power Nominal supply operation in the range 1.14 V to 1.26 V, enabling low-voltage system integration.
- Package & Mounting 256-LBGA (supplier package: 256-FTBGA, 17×17 mm); surface-mount package suitable for compact board designs.
- Operating Range & Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
- Clocking XP2 family supports on-chip PLLs (the XP2-8 line provides two global PLLs) for clock management and phase adjustments.
Typical Applications
- Embedded Control Glue logic, protocol conversion and control functions where compact packaging and moderate logic capacity are required.
- Sensor and I/O Bridging Aggregating and conditioning sensor data or bridging multiple interfaces using available I/Os and embedded memory.
- Display and Imaging Interfaces Source-synchronous and LVDS-based interfaces supported by the XP2 family make this device suitable for mid-range display timing and interface tasks.
- Communications and Protocol Offload Implement protocol handling, framing and timing functions leveraging DSP blocks and on-chip RAM for buffering.
Unique Advantages
- Instant-on Configuration: flash-based flexiFLASH architecture provides immediate startup without external configuration memory.
- Secure Field Updates: Live Update features and 128-bit AES encryption enable secure dual-boot and update workflows at the device level.
- Integrated DSP Capability: Dedicated sysDSP blocks and multiple 18×18 multipliers deliver efficient multiply-accumulate performance for signal processing tasks.
- Compact, High-I/O Package: 256-FTBGA package provides 201 I/Os in a small 17×17 mm footprint for dense board layouts.
- Low-Voltage Operation: 1.14–1.26 V supply aligns with modern low-voltage system domains for power-efficient integration.
- Design Ecosystem: Family-level support such as pre-engineered IP and Lattice XP2 design tools simplifies implementation and migration within the XP2 family.
Why Choose LFXP2-8E-7FTN256C?
The LFXP2-8E-7FTN256C positions itself as a mid-density, flash-configured FPGA option that balances logic capacity, embedded memory and DSP resources in a compact ftBGA package. Its commercial-grade temperature range, 201 I/Os and low-voltage operation make it well suited for embedded control, interface bridging and mid-range signal processing applications.
Backed by the LatticeXP2 family architecture—offering instant-on flash configuration, Live Update security features and dedicated sysDSP resources—this device is a practical choice for developers seeking a reconfigurable, secure and integrated programmable logic solution with an established design ecosystem.
Request a quote or submit an inquiry to receive pricing and availability for the LFXP2-8E-7FTN256C and to discuss how it can fit into your next design.