LFXP2-8E-7FTN256C

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA

Quantity 1,224 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O201Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1000Number of Logic Elements/Cells8000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFXP2-8E-7FTN256C – XP2 Field Programmable Gate Array (FPGA) IC 201 226304 8000 256-LBGA

The LFXP2-8E-7FTN256C is a commercial-grade Lattice XP2 FPGA offering a compact 256-ball ftBGA package and surface-mount mounting. Built on the LatticeXP2 family architecture, it combines flash-based configuration, dedicated DSP resources and flexible I/O to address mid-density programmable logic needs.

Typical use cases include embedded control, sensor and interface bridging, display and connectivity functions where instant-on configuration, moderate on-chip memory and a 201-pin I/O count provide effective system integration.

Key Features

  • Core Logic  Approximately 8,000 logic elements for implementing combinational and sequential logic, state machines and glue logic.
  • Embedded Memory  Approximately 0.226 Mbits (226,304 bits) of on-chip RAM suitable for buffering, small FIFOs and configuration storage.
  • DSP Resources  XP2 family sysDSP blocks and multiplier resources are provided for multiply-accumulate operations; the XP2-8 devices include four sysDSP blocks and 16 18×18 multipliers as part of the family offering.
  • I/O and Interfaces  201 user I/Os in the 256-ball ftBGA package, supporting a wide range of signaling needs and source-synchronous interfaces described for the XP2 family.
  • Configuration and Security  Family-level flexiFLASH architecture provides instant-on, on-chip flash configuration and features such as FlashBAK and Serial TAG memory for secure, reconfigurable designs.
  • Live Update Technologies  Family Live Update features (TransFR) and design security capabilities including 128-bit AES encryption and dual-boot support are part of the LatticeXP2 architecture.
  • Power  Nominal supply operation in the range 1.14 V to 1.26 V, enabling low-voltage system integration.
  • Package & Mounting  256-LBGA (supplier package: 256-FTBGA, 17×17 mm); surface-mount package suitable for compact board designs.
  • Operating Range & Compliance  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
  • Clocking  XP2 family supports on-chip PLLs (the XP2-8 line provides two global PLLs) for clock management and phase adjustments.

Typical Applications

  • Embedded Control  Glue logic, protocol conversion and control functions where compact packaging and moderate logic capacity are required.
  • Sensor and I/O Bridging  Aggregating and conditioning sensor data or bridging multiple interfaces using available I/Os and embedded memory.
  • Display and Imaging Interfaces  Source-synchronous and LVDS-based interfaces supported by the XP2 family make this device suitable for mid-range display timing and interface tasks.
  • Communications and Protocol Offload  Implement protocol handling, framing and timing functions leveraging DSP blocks and on-chip RAM for buffering.

Unique Advantages

  • Instant-on Configuration: flash-based flexiFLASH architecture provides immediate startup without external configuration memory.
  • Secure Field Updates: Live Update features and 128-bit AES encryption enable secure dual-boot and update workflows at the device level.
  • Integrated DSP Capability: Dedicated sysDSP blocks and multiple 18×18 multipliers deliver efficient multiply-accumulate performance for signal processing tasks.
  • Compact, High-I/O Package: 256-FTBGA package provides 201 I/Os in a small 17×17 mm footprint for dense board layouts.
  • Low-Voltage Operation: 1.14–1.26 V supply aligns with modern low-voltage system domains for power-efficient integration.
  • Design Ecosystem: Family-level support such as pre-engineered IP and Lattice XP2 design tools simplifies implementation and migration within the XP2 family.

Why Choose LFXP2-8E-7FTN256C?

The LFXP2-8E-7FTN256C positions itself as a mid-density, flash-configured FPGA option that balances logic capacity, embedded memory and DSP resources in a compact ftBGA package. Its commercial-grade temperature range, 201 I/Os and low-voltage operation make it well suited for embedded control, interface bridging and mid-range signal processing applications.

Backed by the LatticeXP2 family architecture—offering instant-on flash configuration, Live Update security features and dedicated sysDSP resources—this device is a practical choice for developers seeking a reconfigurable, secure and integrated programmable logic solution with an established design ecosystem.

Request a quote or submit an inquiry to receive pricing and availability for the LFXP2-8E-7FTN256C and to discuss how it can fit into your next design.

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