LFXP2-8E-7QN208C

The LFXP2-8E-7QN208C is a commercial-grade FPGA from the Lattice XP2 family featuring a flash-based flexiFLASH architecture and a reconfigurable LUT fabric. It combines approximately 8,000 logic elements with on-chip embedded memory and dedicated DSP resources to support embedded processing, display and memory interface designs, and general-purpose glue logic in commercial embedded systems.

Designed for surface-mount assembly in a 208-pin BFQFP package, the device operates from a 1.14 V–1.26 V core supply and across a 0 °C to 85 °C operating range, offering a compact, instant-on FPGA option for space-constrained boards that require moderate I/O density (146 I/O available in this package).

Key Features

• Core and Architecture — flexiFLASH architecture with instant-on, non-volatile configuration enabling reconfigurable logic without external configuration memory.
• Logic Capacity — approximately 8,000 logic elements for mid-density designs and custom digital functions.
• Embedded Memory — 226,304 bits of on-chip RAM (approximately 0.226 Mbits) for embedded data storage and buffering.
• sysDSP and Multipliers — on-device DSP resources consistent with the XP2 family for Multiply-and-Accumulate tasks and arithmetic acceleration.
• I/O and Interfaces — 146 available I/O in the 208-pin package, with family-level support for source-synchronous interfaces, DDR/DDR2 memory interfaces, and LVDS-type signaling options.
• Clocking — integrated PLL resources as provided by the XP2 family architecture to support clock multiply/divide and phase shifting.
• Configuration and Security — family features include Serial TAG memory, Dual-boot capability and secure update options such as 128‑bit AES encryption and TransFR Live Update technology.
• Power and Mounting — 1.14 V to 1.26 V core supply; surface-mount package for standard PCB assembly processes.
• Package and Temperature — 208-BFQFP package case; commercial operating temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Display and video interfaces — use the XP2 family’s pre‑engineered LVDS and source-synchronous I/O support to implement display link logic and serializers.
• Memory interface controllers — implement DDR/DDR2 interface logic and timing-critical glue between processors and memory subsystems.
• Signal processing and embedded acceleration — leverage sysDSP blocks and on-chip multipliers for filtering, transforms, and other MAC-heavy functions.
• Custom I/O bridging and glue logic — consolidate peripheral interfacing and protocol translation in a single reconfigurable device with 146 I/O available.

Unique Advantages

• Instant-on, flash-based configuration: flexiFLASH architecture provides non-volatile configuration and instant-on behavior without external configuration ROMs.
• Integrated DSP capability: Dedicated sysDSP resources and multipliers accelerate arithmetic-heavy workloads and reduce reliance on external ASICs or processors.
• Compact, board-friendly package: 208-pin BFQFP surface-mount package with 146 usable I/O balances I/O density and PCB real estate for space-constrained designs.
• Secure update path: Family-level TransFR live update and 128‑bit AES encryption support enable secure, field-updatable configurations.
• Design ecosystem support: The XP2 family is supported by Lattice design tools and pre-engineered IP blocks to accelerate development and verification.

Why Choose LFXP2-8E-7QN208C?

The LFXP2-8E-7QN208C positions itself as a mid-density, flash-configured FPGA that blends reconfigurability, on-chip memory and DSP resources in a compact 208‑pin package. Its approximately 8,000 logic elements, ~0.226 Mbits of embedded RAM, and 146 I/O make it well-suited for commercial embedded applications that demand instant-on configuration, moderate logic capacity and integrated arithmetic acceleration.

Coupled with family-level features such as secure Live Update, PLL-based clocking, and pre-engineered interfaces, this device provides a practical platform for teams seeking to consolidate glue logic, implement memory interfaces and add embedded signal processing while leveraging established design tools and IP from the XP2 ecosystem.

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