LFXP20C-3F256I

The LFXP20C-3F256I is an industrial-grade, non-volatile Field Programmable Gate Array (FPGA) supplied in a 256-ball FPBGA (17 × 17 mm) package. It integrates approximately 20,000 logic elements and roughly 405,504 bits of embedded RAM with 188 user I/Os to address mid-density system control, data aggregation, and interface tasks.

Designed for embedded and industrial systems, this device combines instant-on non-volatile configuration, flexible I/O support and on-chip memory to simplify board design and speed time-to-market for applications requiring robust operating-temperature range and surface-mount packaging.

Key Features

• Logic Capacity — Approximately 20,000 logic elements to implement mid-density control, interface and data-processing functions.
• Embedded Memory — Approximately 405,504 bits (≈396 Kbits) of on-chip RAM across distributed and block memory resources for buffering, packet handling and state storage.
• I/O and Package — 188 user I/Os in a 256-FPBGA (17 × 17 mm) surface-mount package for compact board layouts and high pin-count connectivity.
• Voltage Supply — Flexible supply range from 1.71 V to 3.465 V to support a variety of system power rails.
• Industrial Temperature Range — Qualified for operation from −40 °C to 100 °C, suitable for industrial environments.
• Non‑volatile, Instant‑On Architecture — Built on non-volatile FPGA technology enabling fast power-up without external configuration memory and secure configuration retention.
• Reconfiguration and Power Management — Support for in-field logic updates and a sleep mode that provides substantial static current reduction.
• Flexible I/O Standards — Programmable I/O buffers support a wide range of common interfaces (examples in family datasheet include LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and related standards), enabling integration with diverse peripherals and memory interfaces.
• Clocking and Memory Interfaces — On-chip analog PLLs and system clock features from the family data sheet enable clock multiply/divide and phase shifting; dedicated DDR memory interface options are provided at the family level.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Industrial Control — Replace discrete logic and glue components with programmable logic for motor control, machine I/O aggregation and real-time sequencing within an extended temperature envelope.
• Communications and Networking — Implement protocol bridging, packet buffering and custom interface logic using on-chip RAM and 188 I/Os for media adaptation and endpoint processing.
• System Interfaces — Act as a flexible interface hub between sensors, processors and memory subsystems where multiple I/O standards and deterministic signal handling are required.

Unique Advantages

• Instant-on Non-volatile Configuration: Eliminates the need for external configuration memory, simplifying BOM and startup sequencing.
• Compact, High‑Pin Density Packaging: 256-FPBGA (17 × 17 mm) enables a high I/O count in a small footprint for space-constrained designs.
• Broad Operating Voltage Range: Support for 1.71 V to 3.465 V supplies allows compatibility with multiple system power rails.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
• Embedded Memory Resources: Approximately 405,504 bits of on-chip RAM reduce reliance on external memory for many control and buffering tasks.
• Family-Level System Features: Includes sleep mode, in-field reconfiguration and programmable I/O options (as documented in family datasheet) to enable flexible power and update strategies.

Why Choose LFXP20C-3F256I?

The LFXP20C-3F256I offers a balance of logic capacity, embedded memory and a high I/O count in a compact 256-ball FPBGA package, tailored for industrial systems that need non-volatile, instant-on programmable logic. Its supply voltage range and qualified operating temperature make it suitable for a wide range of embedded and industrial applications where board space, configurability and reliable operation matter.

Choosing this device provides a path to consolidate discrete logic, memory buffering and interface glue into a single programmable component—reducing parts count and simplifying design iterations while leveraging family-level features such as reconfiguration, PLL-based clocking and flexible I/O support.

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