LFXP2-8E-7MN132C

The LFXP2-8E-7MN132C is a commercial-grade LatticeXP2 family FPGA combining a flash-based configuration architecture with an LUT-based FPGA fabric. It delivers approximately 8,000 logic elements, built-in DSP resources and on-chip RAM for compact, reconfigurable logic and signal-processing tasks in commercial embedded designs.

Designed for applications that require instant-on configuration, secure field updates and a balance of logic, I/O and memory, this surface-mount 132-ball csBGA package provides a space-efficient solution for interface bridging, display and memory interfaces, and DSP-accelerated control functions.

Key Features

• FPGA Core  Approximately 8,000 logic elements for implementing control, glue logic and mid-density combinational/sequential logic.
• Embedded Memory  Approximately 226,304 bits (≈226 Kbits) of on-chip RAM for intermediate data storage and buffering, with support for the family’s embedded and distributed memory architecture.
• sysDSP and Multipliers  Architecture includes 4 sysDSP blocks and 16 18×18 multipliers (family XP2-8 configuration) to accelerate multiply-accumulate operations and signal processing kernels.
• I/O Capacity  86 device I/Os provided in the 132-ball csBGA package, enabling multi-channel interfaces and peripheral connectivity in compact designs.
• Instant-On flash architecture  flexiFLASH architecture supports instant-on, infinitely reconfigurable single-chip operation with FlashBAK and Serial TAG memory for design security and non-volatile configuration.
• Live Update & Security  Live Update (TransFR) technology and 128-bit AES encryption support secure updates and dual-boot images at the system level.
• Clocking  Device-level PLL resources (2 GPLLs for the XP2-8 device) for clock multiplication, division and phase shifting.
• Power & Package  Low-voltage operation with supply range 1.14 V to 1.26 V, surface-mount 132-LFBGA / 132-CSBGA (8×8 mm) package; RoHS compliant and rated for commercial temperature range 0 °C to 85 °C.
• Pre-engineered Interfaces  Family-level support for source-synchronous interfaces (DDR/DDR2, LVDS and other high-speed standards) simplifies implementation of memory and display links.

Typical Applications

• Signal Processing and Filtering  Use the sysDSP blocks and 18×18 multipliers to offload MAC-intensive tasks such as FIR filters, decimation and real-time processing.
• Memory and Display Interfaces  Pre-engineered DDR/DDR2 and LVDS interface support enables high-speed memory controllers and display link designs in a compact package.
• Embedded Control and I/O Aggregation  8,000 logic elements and 86 I/Os make the device suitable for protocol bridging, peripheral aggregation and custom control logic in commercial embedded products.
• Secure Field Upgrade Systems  Live Update technology with AES-128 encryption supports secure in-field firmware updates and dual-boot configurations for maintenance and feature rollouts.

Unique Advantages

• Highly integrated mid-density FPGA:  Combines logic, on-chip memory and DSP blocks in a single 132-ball csBGA package to reduce BOM and PCB area.
• Instant-on, non-volatile configuration:  Flash-based flexiFLASH architecture enables immediate startup and reconfiguration without external configuration PROMs.
• Secure update capability:  Built-in Live Update and AES-128 encryption allow secure remote updates and dual-boot strategies for serviceability.
• DSP acceleration on-chip:  sysDSP blocks and 18×18 multipliers provide hardware acceleration for math-heavy signal and control algorithms, improving performance and latency.
• Space-efficient packaging:  132-LFBGA / 132-CSBGA (8×8 mm) surface-mount package delivers a compact footprint for dense system designs.
• Commercial temperature and RoHS compliance:  Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial applications.

Why Choose LFXP2-8E-7MN132C?

The LFXP2-8E-7MN132C positions itself as a practical, mid-density FPGA choice for commercial embedded designers who need instant-on configuration, on-chip DSP acceleration and secure field update capabilities. With roughly 8,000 logic elements, dedicated sysDSP resources and around 226 Kbits of on-chip RAM, it balances logic capacity, memory and arithmetic resources in a compact 132-ball csBGA package.

Backed by the LatticeXP2 family architecture and design ecosystem, this device is suitable for designs that require reconfigurability, secure updates and integrated interface support—helping teams reduce system complexity while retaining flexibility for future feature upgrades.

Request a quote or submit a request for pricing and availability to evaluate the LFXP2-8E-7MN132C for your next commercial embedded design.