LFXP2-8E-6TN144I

The LFXP2-8E-6TN144I is an FPGA IC from Lattice Semiconductor’s LatticeXP2 family. It combines a LUT-based FPGA fabric with flash-based configuration to deliver instant-on, reconfigurable logic in a single surface-mount 144‑LQFP package.

Designed for industrial applications, the device offers approximately 8,000 logic elements, roughly 226,304 bits of on-chip memory, flexible I/O and integrated system-level features that simplify interface, signal processing and control tasks in embedded systems.

Key Features

• flexiFLASH Architecture  Flash-based instant-on configuration with on-chip non-volatile storage and design security features as described for the LatticeXP2 family.
• Logic and DSP Resources  Approximately 8,000 logic elements and sysDSP block capabilities for high-performance multiply–accumulate operations (family sysDSP support).
• On-chip Memory  Approximately 226,304 bits of embedded memory available for buffers, state machines and small data stores.
• Flexible I/O  100 user I/Os in the 144‑LQFP package, with LatticeXP2 family I/O buffer support for a wide set of signaling standards and source-synchronous interfaces.
• Clocking  Integrated PLL resources per LatticeXP2 family architecture for clock multiply, divide and phase shifting.
• Package and Mounting  144‑LQFP (20 × 20 mm) surface-mount package, suitable for board-level assembly.
• Power  Nominal device supply around 1.2 V with an operating supply range of 1.14 V to 1.26 V.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting demanding environmental conditions.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Use the device to implement custom control logic, motor control interfaces or sensor aggregation where industrial temperature capability and reconfigurability are required.
• Display and Video Interfaces  Support source-synchronous and LVDS-style interfaces for display subsystem bridging and timing control using the family’s pre-engineered I/O support.
• Embedded Signal Processing  Leverage sysDSP block functionality and on-chip memory for fixed-point filtering, aggregation and lightweight signal-processing tasks.
• Interface Bridging and Prototyping  Implement protocol conversion, glue logic and board-level prototypes that benefit from instant-on flash configuration and reprogrammability.

Unique Advantages

• Instant-on, reconfigurable architecture: Flash-based flexiFLASH enables single-chip, non-volatile configuration for rapid startup and field reprogramming.
• Compact, production-ready package: 144‑LQFP surface-mount package with 100 I/Os balances board-level density and ease of assembly.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh environments without additional thermal qualification steps.
• Integrated memory and DSP resources: On-chip embedded RAM and sysDSP capabilities reduce external memory and accelerator requirements for many embedded designs.
• Tightly controlled supply range: Narrow 1.14 V to 1.26 V supply window simplifies power rail design for reliable FPGA operation.

Why Choose LFXP2-8E-6TN144I?

The LFXP2-8E-6TN144I provides a balanced mix of logic capacity, on-chip memory and DSP-oriented resources in a compact 144‑LQFP footprint, making it well suited to industrial and embedded designs that require instant-on configuration and field reprogrammability. Its flexible I/O and PLL features support common interface and timing needs while the industrial temperature rating and RoHS compliance support deployment in commercial and industrial environments.

This device is a practical choice for designers who need a reconfigurable logic device that integrates memory and signal-processing capability with a known supply and thermal envelope, and who prefer the predictable assembly and sourcing characteristics of a 144‑pin surface-mount package.

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