LFXP2-8E-6MN132I

The LFXP2-8E-6MN132I is a mid-density FPGA from Lattice Semiconductor Corporation based on the LatticeXP2 family flexiFLASH architecture. It combines non-volatile on-chip flash configuration with a LUT-based FPGA fabric to deliver instant-on reconfigurability and embedded system features for designs that require on-chip memory, DSP capability and flexible I/O.

This device targets applications that need a reconfigurable, industrial-grade FPGA with integrated flash, system-level features and a compact 132-ball csBGA package supporting up to 86 I/Os.

Key Features

• Logic Capacity — 8,000 logic elements (logic cells) suitable for mid-density designs and custom logic implementation.
• Embedded Memory — Approximately 0.226 Mbits of on-chip RAM (226,304 total bits) for embedded and distributed memory needs.
• DSP and Multiply Resources — Family sysDSP™ block support is part of the LatticeXP2 architecture, providing high-performance multiply-accumulate resources (series-level feature).
• I/O and Package — 86 I/Os in a 132-ball csBGA (8 × 8 mm) surface-mount package (132-LFBGA / 132-CSBGA), ideal for compact board layouts.
• Power — Low-voltage operation with supply range from 1.14 V to 1.26 V.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation, supporting industrial deployments.
• Mounting and Compliance — Surface-mount package with RoHS compliance.
• flexiFLASH Architecture (Series Capability) — Instant-on, infinitely reconfigurable single-chip flash architecture with on-chip FlashBAK and serial TAG memory (LatticeXP2 family feature).
• Secure Update and Boot Options (Series Capability) — Live Update support including TransFR technology, 128-bit AES encryption and dual-boot with external SPI (LatticeXP2 family feature).

Typical Applications

• Display and Video Interfaces — Use the device’s LVDS and source-synchronous interface support for display transport and timing-sensitive video links (LatticeXP2 family capability).
• Memory Interface Bridging — Pre-engineered DDR/DDR2 interface support on the family enables board-level memory interface implementations up to supported data rates.
• Embedded Signal Processing — sysDSP block resources and on-chip multipliers support multiply-accumulate tasks in compact embedded systems.
• Compact Industrial Controllers — Industrial temperature range and the 132-ball csBGA package make the device suitable for space-constrained industrial control and automation modules.

Unique Advantages

• Instant-on Non-Volatile Configuration: The flexiFLASH architecture enables single-chip instant-on capability and infinite reconfigurability without external volatile configuration memory.
• Secure Update Path: Series-level Live Update with 128-bit AES encryption and dual-boot SPI support simplifies secure field updates and image management.
• Balanced Integration: Combines logic, embedded RAM and DSP-oriented blocks in a compact csBGA package to reduce BOM and simplify board layout.
• Low-Voltage Operation: Operates at a narrow 1.14 V–1.26 V supply range, enabling integration into low-voltage systems.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and RoHS compliant for industrial deployments.

Why Choose LFXP2-8E-6MN132I?

The LFXP2-8E-6MN132I delivers a mid-density FPGA solution with embedded non-volatile flash configuration, integrated memory and DSP-oriented resources in a compact 132-ball csBGA package. Its combination of approximately 8,000 logic elements, on-chip RAM and 86 I/Os makes it well suited for engineers building reconfigurable industrial systems, display and memory interface bridges, or embedded signal-processing modules.

Backed by the LatticeXP2 family architecture and Lattice Semiconductor’s ecosystem features such as secure Live Update and pre-engineered interfaces, this device provides a scalable platform for designs that require instant-on reconfigurability, secure updates and compact board-level integration.

Request a quote or submit an inquiry to receive pricing and availability for the LFXP2-8E-6MN132I.